# Power MOSFET, N Channel, 30 V, 2.7 A, 0.046 ohm, SuperSOT, Surface Mount

![Product image](https://novapart.co/image/farnell:2825184RL/)

**URL**: https://novapart.co/products/FDN359BN/power-mosfet-n-channel-30-v-27-a-0046-ohm-supersot
**SKU**: FDN359BN
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1660
**Stock**: 1000+
**Lead Time**: 373 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:2.7A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.026ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.8V

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 500mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SuperSOT |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.7A |
| Drain Source On State Resistance | 0.046ohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2825184RL/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## January 2006 

## **FDN359BN** 

## **N-Channel Logic Level PowerTrench[TM] MOSFET** 

## **General Description** 

## **Features** 

- 2.7 A, 30 V. RDS(ON)= 0.046 Ω @ VGS = 10 V 

This N-Channel Logic Level MOSFET is produced using Fairchild’s Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance. 

These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. 

RDS(ON)= 0.060 Ω @ VGS = 4.5 V 

- Very fast switching speed. 

- Low gate charge (5nC typical) 

• High performance version of industry standard SOT-23 package.  Identical pin out to SOT-23 with 30% higher power handling capability. 

**==> picture [131 x 97] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>S<br>TM G<br>SuperSOT  -3<br>**----- End of picture text -----**<br>


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D<br>G S<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol  Parameter  Ratings Units<br>VDSS Drain-Source Voltage   30  V<br>VGSS Gate-Source Voltage  ±20  V<br>ID Maximum Drain Current – Continuous  (Note 1a) 2.7  A<br>              – Pulsed  15<br>PD Maximum Power Dissipation  (Note 1a) 0.5   W<br>(Note 1b) 0.46<br>TJ, TSTG Operating and Storage Temperature Range  −55 to +150  °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient   (Note 1a)  250  °C/W<br>RθJC Thermal Resistance, Junction-to-Case  (Note 1)  75  °C/W<br>Package Marking and Ordering Information<br>Device Marking Device  Reel Size  Tape width  Quantity<br>359B  FDN359BN  7’’  8mm   3000 units<br>**----- End of picture text -----**<br>


FDN359BN  Rev A(W) 

©2006 Fairchild Semiconductor Corporation 

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Electrical Characteristics  TA = 25°C unless otherwise noted<br>Symbol  Parameter  Test Conditions  Min Typ  Max Units<br>Off Characteristics<br>BVDSS Drain–Source Breakdown Voltage VGS = 0 V,   ID = 250 µA  30  V<br>   ∆∆BVTDSSJ Breakdown Voltage Temperature Coefficient   ID = 250 µA,Referenced to 25°C  21  mV/°C<br>IDSS Zero Gate Voltage Drain Current  VDS = 24 V,  VGS = 0 V  1  µA<br>TJ = -55OC 10  µA<br>IGSS Gate–Body Leakage  VGS = ±20 V,  VDS = 0 V  ±100  nA<br>On Characteristics  (Note 2)<br>VGS(th) Gate Threshold Voltage   VDS = VGS,   ID = 250 µA  1  1.8  3  V<br>∆VGS(th) Gate Threshold Voltage  ID = 250 µA,Referenced to 25°C  –4  mV/°C<br>   ∆TJ Temperature Coefficient<br>RDS(on) Static Drain–Source   VGS = 10 V,   ID = 2.7 A  0.026  0.046  Ω<br>On–Resistance  VGS = 4.5 V,   ID = 2.4 A  0.032  0.060<br>VGS = 10 V, ID = 2.7 A, TJ = 125°C  0.033  0.075<br>ID(on) On–State Drain Current  VGS = 10 V,  VDS = 5 V  15  A<br>gFS Forward Transconductance  VDS = 5V,   ID = 2.7 A  11  S<br>Dynamic Characteristics<br>Ciss Input Capacitance  VDS = 15  V,   V GS = 0 V,   485  650  pF<br>Coss Output Capacitance  f = 1.0 MHz  105  140  pF<br>Crss Reverse Transfer Capacitance  65  100  pF<br>RG Gate Resistance  f = 1.0 MHz  1.8  Ω<br>Switching Characteristics (Note 2)<br>td(on) Turn–On Delay Time  VDD = 15V,  ID = 1 A,  7  14  ns<br>tr Turn–On Rise Time  VGS = 10 V,  RGEN = 6 Ω 5  10  ns<br>td(off) Turn–Off Delay Time  20  35  ns<br>tf Turn–Off Fall Time  2  4  ns<br>Qg Total Gate Charge  VDS = 15 V,   ID = 2.7 A,  5  7  nC<br>Qgs Gate–Source Charge  VGS = 5 V   1.3  nC<br>Qgd Gate–Drain Charge  1.8  nC<br>**----- End of picture text -----**<br>


FDN359BN Rev A(W) 

|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Drain–Source Diode Characteristics and Maximum Ratings**|||||||
|IS|Maximum Continuous Drain–Source Diode Forward Current||||0.42|A|
|VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 0.42 A<br>(Note 2)||0.7|1.2|V|
|trr|Diode Reverse RecoveryTime|IF = 2.7A,   diF/dt = 100 A/µs||12|20|ns|
|Qrr|Diode Reverse RecoveryCharge|||3|5|nC|



**otes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

   - a) 250°C/W when mounted on a b) 270°C/W when mounted on a 0.02 in[2  ] pad of 2 oz. copper. minimum pad. 

Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% 

FDN359BN Rev A(W) 

## **Typical Characteristics** 

**==> picture [429 x 538] intentionally omitted <==**

**----- Start of picture text -----**<br>
15 2.6<br>VGS = 10V 3.5V VGS = 3.0V<br>12 2.2<br>4.5V 4.0V<br>9 1.8<br>3.0V<br>6 1.4 3.5V<br>4.0V 4.5V<br>5.0V<br>6.0<br>3 1 10.0V<br>2.5V<br>0 0.6<br>0 0.5 1 1.5 2 2.5 0 3 6 9 12 15<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.2 0.08<br>ID = 2.7A<br>VGS = 10V ID = 1.35A<br>1.1<br>0.06<br>1<br>TA = 125 [o] C<br>0.04<br>0.9<br>TA = 25 [o] C<br>0.8 0.02<br>-50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>15 100<br>VDS = 5V VGS = 0V<br>10<br>12<br>1<br>9<br>0.1<br>6 TA = 125 [o] C<br>TA = 125 [o] C -55 [o] C 0.01 25 [o] C<br>3 0.001 -55 [o] C<br>25 [o] C<br>0 0.0001<br>1 1.5 2 2.5 3 3.5 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>, DRAIN CURRENT (A)ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDN359BN Rev A(W) 

## **Typical Characteristics** 

**==> picture [426 x 490] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 800<br>ID = 2.7A f = 1MHz<br>VGS = 0 V<br>8<br>600<br>VDS = 10V 20V Ciss<br>6<br>400<br>15V<br>4<br>200 Coss<br>2<br>Crss<br>0 0<br>0 2 4 6 8 10 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>100 30<br>SINGLE PULSE<br>RDS(ON) LIMIT 100µs 25 RθJAT = 270°C/WA = 25°C<br>10<br>1ms 20<br>10ms<br>100ms<br>1 1s 15<br>DC<br>10<br>V GS  = 10V<br>0.1 SINGLE PULSE<br>RθJA = 270 [o] C/W 5<br>T A  = 25 [o] C<br>0.01 0<br>0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5 RθJA(t) = r(t) * RθJA<br>0.2 RθJA = 270 °C/W<br>0.1 0.1<br>0.05 P(pk)<br>0.02 t1<br>0.01 0.01 SINGLE  TJ - TA = P  t2 * RθJA(t)<br>Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**==> picture [326 x 26] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Transient Thermal Response Curve.<br>                                                           Thermal characterization performed using the conditions described in Note 1b.<br>                                                           Transient thermal response will change depending on the circuit board design.<br>**----- End of picture text -----**<br>


FDN359BN Rev A(W) 

## **TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

|<br>ACEx™<br>ActiveArray™<br>Bottomless™|<br>FAST®<br>FASTr™<br>FPS™|ISOPLANAR™<br>LittleFET™<br>MICROCOUPLER™|PowerSaver™<br>PowerTrench®<br>QFET®|SuperSOT™-6<br>SuperSOT™-8<br>SyncFET™|
|---|---|---|---|---|
|Build it Now™|FRFET™|MicroFET™|QS™<br>|TCM™|
|CoolFET™|GlobalOptoisolator™|MicroPak™|QT Optoelectronics™<br>|TinyLogic®|
|_CROSSVOLT_™|GTO™|MICROWIRE™|Quiet Series™|TINYOPTO™|
|DOME™|HiSeC™|MSX™|RapidConfigure™|TruTranslation™|
|EcoSPARK™<br>E2CMOS™|I2C™<br>_i-Lo_™|MSXPro™<br>OCX™|RapidConnect™<br>μSerDes™|UHC™<br>UltraFET®|
|EnSigna™<br>FACT™|ImpliedDisconnect™<br>IntelliMAX™|OCXPro™<br>OPTOLOGIC®|ScalarPump™<br>SILENT SWITCHER®|UniFET™<br>VCX™|
|FACT Quiet Series™||OPTOPLANAR™|SMART START™|Wire™|
|Across the board. Around the world.™<br>The Power Franchise®<br>Programmable Active Droop™||PACMAN™<br>POP™<br>Power247™<br>PowerEdge™|SPM™<br>Stealth™<br>SuperFET™<br>SuperSOT™-3||



## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 

1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or<br>In Design|This datasheet contains the design specifications for<br>product development. Specifications may change in<br>any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data, and<br>supplementary data will be published at a later date.<br>Fairchild Semiconductor reserves the right to make<br>changes at any time without notice in order to improve<br>design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild<br>Semiconductor reserves the right to make changes at<br>any time without notice in order to improve design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product<br>that has been discontinued by Fairchild semiconductor.<br>The datasheet is printed for reference information only.|



Rev. I18 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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