# Power MOSFET, P Channel, 30 V, 1.6 A, 0.125 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:9846328RL/)

**URL**: https://novapart.co/products/FDN358P/power-mosfet-p-channel-30-v-16-a-0125-ohm-sot-23
**SKU**: FDN358P
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1820
**Stock**: 1000+
**Lead Time**: 148 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:1.6A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.2ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1.9V; Power Dissipati

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 560mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.6A |
| Drain Source On State Resistance | 0.125ohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9846328RL/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

January 2003 

## **FDN358P** 

## **Single P-Channel, Logic Level, PowerTrench[] MOSFET** 

## **General Description** 

This P-Channel Logic Level MOSFET is produced using Fairchild Semiconductor advanced Power Trench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. 

These devices are well suited for portable electronics applications: load switching and power management, battery charging circuits, and DC/DC conversion. 

## **Features** 

- –1.5 A, –30 V. RDS(ON) = 125 mΩ @ VGS = –10 V RDS(ON) = 200 mΩ @ VGS = –4.5 V 

- Low gate charge (4 nC typical) 

- High performance trench technology for extremely low RDS(ON) . 

- High power version of industry Standard SOT-23 package. Identical pin-out to SOT-23 with 30% higher power handling capability. 

**==> picture [422 x 326] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D<br>/ (ih)<br>S<br>G S<br>TM G<br>SuperSOT  -3<br>Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol  Parameter  Ratings Units<br>VDSS Drain-Source Voltage   –30   V<br>VGSS Gate-Source Voltage  ±20  V<br>ID Drain Current – Continuous  (Note 1a) –1.5  A<br>– Pulsed  –5<br>PD Power Dissipation for Single Operation  (Note 1a) 0.5<br>W<br>(Note 1b) 0.46<br>TJ, TSTG Operating and Storage Junction Temperature Range  –55 to +150  °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient   (Note 1a)  250  °C/W<br>RθJC Thermal Resistance, Junction-to-Case  (Note 1)  75  °C/W<br>Package Marking and Ordering Information<br>Device Marking  Device  Reel Size  Tape width  Quantity<br>358  FDN358P  7’’ 8mm 3000 units<br>**----- End of picture text -----**<br>


2003 Fairchild Semiconductor Corporation 

FDN358P  Rev G (W) 

|<br> <br> <br> <br>|**Electrical Characteristics**|**Electrical Characteristics**|**Electrical Characteristics**|**TA = 25°C unless otherwise noted**|**Min**<br>**Typ Max Units**<br>–30<br>V<br>–22<br>mV/°C<br>–1<br>µA<br>–10<br>100<br>nA<br>–100<br>nA<br>–1<br>–1.9<br>–3<br>V<br>4<br>mV/°C<br>105<br>125<br>mΩ<br>148<br>210<br>161<br>200<br>–5<br>A<br>3.5<br>S<br>182<br>pF<br>56<br>pF<br>26<br>pF<br>5<br>10<br>ns<br>13<br>23<br>ns<br>12<br>21<br>ns<br>2<br>4<br>ns<br>4<br>5.6<br>nC<br>0.8<br>nC<br>0.8<br>nC<br>–0.42<br>A<br>–0.76<br>–1.2<br>V<br>e is defined as the solder mounting surface of<br>on a|**Min**<br>**Typ Max Units**<br>–30<br>V<br>–22<br>mV/°C<br>–1<br>µA<br>–10<br>100<br>nA<br>–100<br>nA<br>–1<br>–1.9<br>–3<br>V<br>4<br>mV/°C<br>105<br>125<br>mΩ<br>148<br>210<br>161<br>200<br>–5<br>A<br>3.5<br>S<br>182<br>pF<br>56<br>pF<br>26<br>pF<br>5<br>10<br>ns<br>13<br>23<br>ns<br>12<br>21<br>ns<br>2<br>4<br>ns<br>4<br>5.6<br>nC<br>0.8<br>nC<br>0.8<br>nC<br>–0.42<br>A<br>–0.76<br>–1.2<br>V<br>e is defined as the solder mounting surface of<br>on a|**Min**<br>**Typ Max Units**<br>–30<br>V<br>–22<br>mV/°C<br>–1<br>µA<br>–10<br>100<br>nA<br>–100<br>nA<br>–1<br>–1.9<br>–3<br>V<br>4<br>mV/°C<br>105<br>125<br>mΩ<br>148<br>210<br>161<br>200<br>–5<br>A<br>3.5<br>S<br>182<br>pF<br>56<br>pF<br>26<br>pF<br>5<br>10<br>ns<br>13<br>23<br>ns<br>12<br>21<br>ns<br>2<br>4<br>ns<br>4<br>5.6<br>nC<br>0.8<br>nC<br>0.8<br>nC<br>–0.42<br>A<br>–0.76<br>–1.2<br>V<br>e is defined as the solder mounting surface of<br>on a|
|---|---|---|---|---|---|---|---|
|||**Symbo**|**l**<br>**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|
|||**Off Characteristics**||||||
|||BVDSS|Drain–Source Breakdown Voltage|VGS= 0 V, ID= –250µA|–30|||
|||∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= –250µA, Referenced to 25°C||–22||
|||IDSS|Zero Gate Voltage Drain Current|VDS= –24V,<br>VGS= 0 V|||–1|
|||||VDS= –24V, VGS= 0 V, TJ=55°C|||–10|
|||IGSSF|Gate–BodyLeakage, Forward|VGS= 20 V,<br>VDS= 0 V|||100|
|||IGSSR|Gate–BodyLeakage, Reverse|VGS= –20 V,<br>VDS= 0 V|||–100|
|||**On Characteristics**<br>**(Note 2)**||||||
|||VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= –250µA|–1|–1.9|–3|
|||∆VGS(th)<br> <br>∆TJ|Gate Threshold Voltage<br>Temperature Coefficient|ID= –250µA, Referenced to 25°C||4||
|||RDS(on)|Static Drain–Source<br>On–Resistance|VGS= –10 V,<br>ID= –1.5 A||105|125|
|||||VGS= –10 V,ID= –1.5 A,TJ=125°C||148|210|
|||||VGS= –4.5 V,<br>ID= –1.2A,||161|200|
|||ID(on)|On–State Drain Current|VGS= –4.5 V,<br>VDS= –5 V|–5|||
|||gFS|Forward Transconductance|VDS= –5 V,<br>ID= –1.5 A||3.5||
|||**Dynamic Characteristics**||||||
|||Ciss|Input Capacitance|VDS= –15 V,<br>VGS= 0 V,<br>f = 1.0 MHz||182||
|||Coss|Output Capacitance|||56||
|||Crss|Reverse Transfer Capacitance|||26||
|||**Switching Characteristics (Note 2)**||||||
|||td(on)|Turn–On DelayTime|VDD= –15 V,<br>ID= –0.5 A,<br>VGS= –10 V,<br>RGEN= 6Ω||5|10|
|||tr|Turn–On Rise Time|||13|23|
|||td(off)|Turn–Off DelayTime|||12|21|
|||tf|Turn–Off Fall Time|||2|4|
|||Qg|Total Gate Charge|VDS= –15V,<br>ID= –1.5 A,<br>VGS= –10 V||4|5.6|
|||Qgs|Gate–Source Charge|||0.8||
|||Qgd|Gate–Drain Charge|||0.8||
|||**Drain–Source Diode Characteristics **||**and Maximum Ratings**||||
|||IS|Maximum Continuous Drain–Source Diode Forward Current||||–0.42|
|||VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= –0.42 A(Note 2)||–0.76|–1.2|
||**N**<br>**1**<br>S<br>**2**|**otes:**<br>**.**<br>RθJAis th<br>the drain<br>cale 1 : 1 on<br>**.**<br>Pulse Te|e sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal referenc<br>pins.  RθJCis guaranteed by design while RθCAis determined by the user's board design.<br>a) 250°C/W when mounted on a<br>0.02 in2pad of 2 oz. copper.<br>b) 270°C/W when mounted<br>minimum pad.<br>letter size paper<br>st: Pulse Width≤300µs, Duty Cycle≤2.0%|||||



FDN358P Rev G (W) 

## **Typical Characteristics** 

**==> picture [424 x 537] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>VGS=-10V -4.5V 2.2<br>-6.0V<br>4 2.0<br>VGS=-4.0V<br>-3.5V 1.8<br>3<br>1.6  -4.5V<br>2 1.4 -5.0V<br>-3.0V  -6.0V<br>1 1.2  -7.0V<br>1.0  -10V<br>0<br>0 0.5 1 1.5 2 2.5 0.8<br>0 1 2 3 4 5<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.6 0.4<br>VIDGS = -1.5A = -10V ID = -0.75A<br>1.4<br>0.3<br>1.2<br>TA = 125 [o] C<br>0.2<br>1<br>TA = 25 [o] C<br>0.1<br>0.8<br>0.6<br>0<br>-50 -25 0 25 50 75 100 125 150<br>2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>5 10<br>VDS = -5V TA = -55 [o] C 25 [o] C VGS = 0V<br>4 1<br>125 [o] C<br>TA = 125 [o] C<br>3 0.1<br>25 [o] C<br>2 0.01<br>-55 [o] C<br>1 0.001<br>0 0.0001<br>1.5 2 2.5 3 3.5 4 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD,  BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>, DRAIN CURRENT (A)-ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>RDS(ON) , ON-RESISTANCE (OHM)DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)-ID<br>, REVERSE DRAIN CURRENT (A)-IS<br>**----- End of picture text -----**<br>


FDN358P Rev G (W) 

## **Typical Characteristics** 

**==> picture [426 x 533] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 250<br>f = 1 MHz<br>ID = -1.5A VDS = -5V -10V CISS VGS = 0 V<br>8 200<br>-15V<br>6 150<br>4 100<br>COSS<br>2 50<br>CRSS<br>0 0<br>0 1 2 3 4 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>10 20<br>RDS(ON) LIMIT 1ms SINGLE PULSE<br>RθJA = 270°C/W<br>10ms TA = 25°C<br>100ms 15<br>1<br>1s<br>10s 10<br>DC<br>0.1 VGS = -10V<br>SINGLE PULSE 5<br>RθJA = 270 [o] C/W<br>TA = 25 [o] C<br>0.01 0<br>0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000<br>-VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5<br>0.2 RθJA(t) = r(t) + RθJA<br>0.1 0.1 RθJA = 270 °C/W<br>0.05<br>P(pk)<br>0.02<br>0.01 t1<br>0.01 t2<br>TJ - TA = P * RθJA(t)<br>SINGLE PULSE Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 11. Transient Thermal Response Curve.<br>Thermal characterization performed using the conditions described in Note 1b.<br>Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>-V<br>, DRAIN CURRENT (A)-ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


FDN358P Rev G (W) 

**==> picture [64 x 7] intentionally omitted <==**

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TRADEMARKS<br>**----- End of picture text -----**<br>


**==> picture [439 x 597] intentionally omitted <==**

**----- Start of picture text -----**<br>
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is<br>not intended to be an exhaustive list of all such trademarks.<br>ACEx™ FACT™ ImpliedDisconnect™ PACMAN™ SPM™<br>ActiveArray™ FACT Quiet Series™ ISOPLANAR™ POP™ Stealth™<br>Bottomless™ FAST® LittlkeFET™ Power247™ SuperSOT™-3<br>CoolFET™ FASTr™ MicroFET™ PowerTrench® SuperSOT™-6<br>CROSSVOLT™ FRFET™ MicroPak™ QFET™ SuperSOT ™-8<br>DOME™ GlobalOptoisolator™ MICROWIRE™ qas™ SyncFET™<br>EcoSPARK™ GTOo™ MSX™ QT Optoelectronics™ TinyLogic®<br>E?CMOS™ HiSeC™ MSXPro™ Quiet Series™ TruTranslation™<br>EnSigna™ 2co™ OCX™ RapidConfigure™ UHC™<br>Across the board. Around the world.™ OCXPro™ RapidConnect™ UltraFET®<br>The Power Franchise™ OPTOLOGIC® SILENT SWITCHER® VCX™<br>Programmable Active Droop™ OPTOPLANAR™ SMART START™<br>DISCLAIMER<br>FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER<br>NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD<br>DOES NOTASSUMEANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT<br>OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT<br>RIGHTS, NOR THE RIGHTS OF OTHERS.<br>LIFE SUPPORT POLICY<br>FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT<br>DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTENAPPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.<br>As used herein:<br>1. Life support devices or systems are devices or 2. A critical component is any component ofa life<br>systems which, (a) are intended for surgical implant into support device or system whose failure to perform can<br>the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life<br>failure to perform when properly used in accordance support device or system, or to affect its safety or<br>with instructions for use provided in the labeling, can be effectiveness.<br>reasonably expected to result in significant injury to the<br>user.<br>PRODUCT STATUS DEFINITIONS<br>Definition of Terms<br>Advance Information Formative or This datasheet contains the design specifications for<br>In Design product development. Specifications may change in<br>any manner without notice.<br>Preliminary First Production This datasheet contains preliminary data, and<br>supplementary data will be published at a later date.<br>Fairchild Semiconductor reserves the right to make<br>changes at any time without notice in order to improve<br>design.<br>No Identification Needed Full Production This datasheet contains final specifications. Fairchild<br>Semiconductor reserves the right to make changes at<br>any time without notice in order to improve design.<br>Obsolete Not In Production This datasheet contains specifications on a product<br>that has been discontinued by Fairchild semiconductor.<br>The datasheet is printed for reference information only.<br>**----- End of picture text -----**<br>


Rev. 12 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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