# Power MOSFET, N Channel, 30 V, 2.5 A, 0.06 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:9845364/)

**URL**: https://novapart.co/products/FDN357N/power-mosfet-n-channel-30-v-25-a-006-ohm-sot-23
**SKU**: FDN357N
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1840
**Stock**: 1000+
**Lead Time**: 99 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:2.5A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.053ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:1.6V; Power Dissipati

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 500mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.5A |
| Drain Source On State Resistance | 0.06ohm |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9845364/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

FAIRCHILD J 

March 1998 

## **FDN357N** 

## **N-Channel Logic Level Enhancement Mode Field Effect Transistor** 

SuperSOTTM-3 N-Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and   other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. ~~ws a wi~~ **SOT-23** A **SuperSOTTM-6 SuperSOTTM-8** 

- 1.9 A,  30 V,  RDS(ON) = 0.090 Ω @ VGS = 4.5 V RDS(ON) = 0.060 Ω @ VGS = 10 V. 

- Industry  standard outline SOT-23 surface mount package  using  proprietary SuperSOTTM-3 design for superior thermal and electrical capabilities. 

- High density cell design for extremely low RDS(ON). Exceptional on-resistance and maximum DC current capability. 

**==> picture [175 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
SO-8 SOT-223 SOIC-16<br>**----- End of picture text -----**<br>


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D<br>S<br>TM G<br>SuperSOT  -3<br>357<br>**----- End of picture text -----**<br>


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D<br>G S<br>**----- End of picture text -----**<br>


**Absolute Maximum Ratings** TA = 25oC unless  other wise noted 

|**Symbol**|**Parameter**||**FDN357N**|**Units**|
|---|---|---|---|---|
|VDSS|Drain-Source Voltage||30|V|
|VGSS|Gate-Source Voltage - Continuous||±20|V|
|ID|Drain/Output Current - Continuous||1.9|A|
||- Pulsed||10||
|PD|Maximum Power Dissipation(Note 1a)|(Note 1a)|0.5|W|
||(Note 1b)|(Note 1b)|0.46||
|TJ,TSTG|Operating and Storage Temperature Range||-55 to 150|°C|
|**THERMAL CHARACTERISTICS**|||||
|RθJA|Thermal Resistance, Junction-to-Ambient(Note 1a)||250|°C/W|
|RθJC|Thermal Resistance, Junction-to-Case|Thermal Resistance, Junction-to-Case(Note 1)|75|°C/W|



FDN357N Rev.C 

© 1998 Fairchild Semiconductor Corporation 

**Electrical Characteristics** (TA = 25[O] C unless otherwise noted ) 

|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|**Electrical Characteristics **(TA= 25OC unless otherwise noted )|
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**OFF CHARACTERISTICS**||||||||
|BVDSS|Drain-Source Breakdown Voltage|VGS= 0 V,  ID= 250 µA||30|||V|
|∆BVDSS/∆TJ|Breakdown Voltage Temp. Coefficient|ID= 250 µA, Referenced to  25<br>oC|||36||mV/<br>oC|
|IDSS|Zero Gate Voltage  Drain Current|VDS= 24 V,  VGS= 0 V||||1|µA|
||||TJ= 55°C|||10|µA|
|IGSSF|Gate - Body Leakage, Forward|VGS= 20 V,VDS= 0 V||||100|nA|
|IGSSR|Gate - Body Leakage, Reverse|VGS= -20 V, VDS= 0 V||||-100|nA|
|**ON CHARACTERISTICS**(Note)||||||||
|VGS(th)|Gate Threshold Voltage|VDS= VGS,  ID= 250 µA||1|1.6|2|V|
|∆VGS(th)/∆TJ|Gate Threshold Voltage Temp. Coefficient|ID= 250 µA, Referenced to  25<br>oC|||-3.6||mV/<br>oC|
|RDS(ON)|Static Drain-Source On-Resistance|VGS= 4.5 V,  ID= 1.9 A<br>VGS= 10 V,  ID= 2.2 A|||0.081|0.09|Ω|
||||T**J**=125°C||0.11|0.14||
||||||0.053|0.06||
|ID(ON)|On-State Drain Current|VGS= 4.5 V,  VDS= 5 V||5|||A|
|gFS|Forward Transconductance|VDS= 5 V,  ID= 1.9 A|||5||S|
|**DYNAMIC CHARACTERISTICS**||||||||
|Ciss|Input Capacitance|VDS= 10 V,  VGS= 0 V,<br>f  = 1.0 MHz|||235||pF|
|Coss|Output Capacitance||||145||pF|
|Crss|Reverse Transfer Capacitance||||50||pF|
|**SWITCHING CHARACTERISTICS**(Note)||||||||
|tD(on)|Turn - On Delay Time|VDD= 10 V,  ID= 1 A,<br>VGS= 10 V,  RGEN= 6Ω|||5|10|ns|
|tr|Turn - On Rise Time||||12|22|ns|
|tD(off)|Turn - Off Delay Time||||12|22|ns|
|tf|Turn - Off Fall Time||||3|8|ns|
|Qg|Total Gate Charge|VDS= 10 V,  ID= 1.9 A,<br>VGS= 5 V|||4.2|5.9|nC|
|Qgs|Gate-Source Charge||||1.3||nC|
|Qgd|Gate-Drain Charge||||1.7||nC|
|**DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS**||||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current|||||0.42|A|
|VSD|Drain-Source Diode Forward Voltage|VGS= 0 V,  IS= 0.42 A(Note)|||0.71|1.2|V|
|Note:<br>1. RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the  solder mounting surface of  the   drain pins. RθJCis guaranteed by<br>design while RθCAis determined by the user's board design.<br>Typical RθJAusing the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment :<br>Scale 1 : 1 on letter size paper<br>2. Pulse Test: Pulse Width<<br> 300µs, Duty Cycle<<br> 2.0%.<br> <br> a. 250<br>oC/W when mounted on<br>a 0.02 in<br>2pad of 2oz Cu.<br>b. 270<br>oC/W when mounted on<br> a 0.001 in<br>2pad of 2oz Cu.||||||||



Note: 

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the  solder mounting surface of  the   drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

Typical RθJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment : 

a. 250oC/W when mounted on b. 270oC/W when mounted on a 0.02 in2 pad of 2oz Cu. a 0.001 in2 pad of 2oz Cu. 

Scale 1 : 1 on letter size paper 

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. 

FDN357N Rev.C 

## **Typical Electrical Characteristics** 

**==> picture [218 x 318] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br> V    = 10VGS  5.0<br> 4.5<br> 6.0<br>8  4.0<br>6<br> 3.5<br>4<br>2  3.0<br>0<br>0 0.5 1 1.5 2 2.5 3<br>V     , DRAIN-SOURCE VOLTAGE (V)DS<br>Figure 1. On-Region Characteristics .<br>1.6<br>I   = 1.9AD<br>1.4 V     = 4.5VGS<br>1.2<br>1<br>0.8<br>0.6<br>-50 -25 0 25 50 75 100 125 150<br>T  , JUNCTION TEMPERATURE (°C)J<br>I   , DRAIN-SOURCE CURRENT (A)D<br>DS(ON)<br>R            , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


## **Figure 3. On-Resistance Variation with Temperature** . 

**==> picture [210 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
14<br>V     = 10VDS T  = -55°CA 25°C<br>12 125°C<br>10<br>8<br>6<br>4<br>2<br>0<br>1 2 3 4 5 6<br>V     , GATE TO SOURCE VOLTAGE (V)GS<br>I   , DRAIN CURRENT (A)D<br>**----- End of picture text -----**<br>


**Figure  5. Transfer Characteristics.** 

**==> picture [199 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.8<br>1.6<br>V     =3.5VGS<br>1.4<br>1.2  4.0<br> 4.5<br>1<br>5.0<br> 6.0<br>0.8 7.0<br>10<br>0.6<br>0.4<br>0 2 4 6 8 10<br>I    , DRAIN CURRENT (A)D<br>DS(ON)<br>R            , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 2. On-Resistance Variation with Drain Current and Gate** 

**==> picture [214 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.25<br>I   =0.95AD<br>0.2<br>0.15<br>0.1 T  = 125°CA<br>T  = 25°CA<br>0.05<br>0<br>2 4 6 8 10<br>V      ,GATE TO SOURCE VOLTAGE (V)GS<br>DS(ON)<br>R           , DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 4. On-Resistance Variation with** 

**Gate-to-Source Voltage.** 

**==> picture [191 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>V    = 0VGS<br>1 T  J = 125°C<br>0.1 25°C<br>-55°C<br>0.01<br>0.001<br>0.0001<br>0 0.2 0.4 0.6 0.8 1 1.2<br>V     , BODY DIODE FORWARD VOLTAGE (V)SD<br>I   , REVERSE DRAIN CURRENT (A)S<br>**----- End of picture text -----**<br>


**Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.** 

FDN357N Rev.C 

## **Typical Electrical  And  Thermal Characteristics** 

**==> picture [224 x 338] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>I    = 1.9AD V    = 5VDS<br>10V<br>8<br>15V<br>6<br>4<br>2<br>0<br>0 2 4 6 8<br>Q    , GATE CHARGE (nC)g<br>Figure 7. Gate Charge Characteristics.<br>20<br>10<br>5<br>1<br>0.5<br>0.1 V      GS = 10V<br>SINGLE PULSE<br>0.05 R     = 250θ [JA] °C/W<br>T    = 25°CA A<br>0.01<br>0.1 0.2 0.5 1 2 5 10 20 50<br> V     , DRAIN-SOURCE VOLTAGE (V)DS<br>1ms<br>10ms<br>100ms<br> 1s<br>10s<br>DC<br>RDS(ON) LIMIT<br>GS<br>V      , GATE-SOURCE VOLTAGE (V)<br>I   , DRAIN CURRENT (A)D<br>**----- End of picture text -----**<br>


**Figure 9. Maximum Safe Operating Area.** 

**==> picture [190 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
600<br>300<br>C  iss<br>200<br>C  oss<br>100<br>50<br>f = 1 MHz C  rss<br>V     = 0 VGS<br>20<br>0.1 0.2 0.5 1 2 5 10 30<br>V     , DRAIN TO SOURCE VOLTAGE (V)DS<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 8. Capacitance Characteristics** . 

**==> picture [217 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>SINGLE PULSE<br>40<br>R       =250° C/W       θJA<br>T   = 25°CA<br>30<br>20<br>10<br>0<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>SINGLE PULSE TIME (SEC)<br>POWER (W)<br>**----- End of picture text -----**<br>


**Figure 10. Single Pulse Maximum Power** 

**Dissipation.** 

**==> picture [409 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.5  D = 0.5<br>0.2   0.2   R       (t) = r(t)   θ [JA] *  R          θ [JA]<br>0.1  0.1     R        = 250 °C/W θ [J][A]<br>0.05  0.05<br> 0.02  P(pk)<br>0.02  0.01<br> t  1<br>0.01  Single Pulse   t   2<br>0.005 T  - T    = P  * R       J A θ [JA] (t)<br>Duty Cycle, D = t   /t 1 2<br>0.002<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>t  , TIME (sec)1<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


## **Figure 11. Transient Thermal Response Curve.** 

Note: Thermal characterization performed using the conditions described in note 1a. Transient thermal response will change depending on the circuit board design. 

FDN357N Rev.C 

## **TRADEMARKS** 

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

**==> picture [433 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|ACEx™|FAST||OPTOLOGIC™|SMART START™|VCX™|
|Bottomless™|FASTr™|OPTOPLANAR™|STAR*POWER™|
|CoolFET™|FRFET™|PACMAN™|Stealth™|
|CROSSVOLT|™|GlobalOptoisolator™|POP™|SuperSOT™-3|
|DenseTrench™|GTO™|Power247™|SuperSOT™-6|
|DOME™|HiSeC™|PowerTrench||SuperSOT™-8|
|EcoSPARK™|ISOPLANAR™|QFET™|SyncFET™|
|E|[2]|CMOS|[TM]|LittleFET™|QS™|TinyLogic™|
|EnSigna|[TM]|MicroFET™|QT Optoelectronics™|TruTranslation™|
|FACT™|MicroPak™|Quiet Series™|UHC™|
|FACT Quiet Series™|MICROWIRE™|SILENT SWITCHER||UltraFET||

**----- End of picture text -----**<br>


STAR*POWER is used under license 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 

1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

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**----- Start of picture text -----**<br>
Datasheet Identification Product Status Definition<br>Advance Information Formative or This datasheet contains the design specifications for<br>In Design product development. Specifications may change in<br>any manner without notice.<br>Preliminary First Production This datasheet contains preliminary data, and<br>supplementary data will be published at a later date.<br>Fairchild Semiconductor reserves the right to make<br>changes at any time without notice in order to improve<br>design.<br>No Identification Needed Full Production This datasheet contains final specifications. Fairchild<br>Semiconductor reserves the right to make changes at<br>any time without notice in order to improve design.<br>Obsolete Not In Production This datasheet contains specifications on a product<br>that has been discontinued by Fairchild semiconductor.<br>The datasheet is printed for reference information only.<br>**----- End of picture text -----**<br>


Rev. H4 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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