# Power MOSFET, P Channel, 20 V, 1.3 A, 0.2 ohm, SuperSOT, Surface Mount

![Product image](https://novapart.co/image/farnell:1467975RL/)

**URL**: https://novapart.co/products/FDN336P/power-mosfet-p-channel-20-v-13-a-02-ohm-supersot
**SKU**: FDN336P
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1610
**Stock**: 1000+
**Lead Time**: 113 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-1.3A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.122ohm; Rds(on) Test Voltage Vgs:-4.5V; Threshold Voltage Vgs:-900mV; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 500mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SuperSOT |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.3A |
| Drain Source On State Resistance | 0.2ohm |
| Gate Source Threshold Voltage Max | 900mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1467975RL/)

## **ON Semiconductor** 

## **Is Now** 

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**To learn more about onsemi™, please visit our website at www.onsemi.com** 

**onsemi** and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 

## **FDN336P** 

## **Single P-Channel 2.5V Specified PowerTrench**[®] **MOSFET** 

## **General Description** 

This P-Channel 2.5V specified MOSFET is produced using ON Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. 

These devices are well suited for portable electronics applications: load switching and power management, battery charging circuits and DC/DC conversion. 

## **Features** 

- –1.3 A,  –20 V. RDS(ON) = 0.20 Ω @ VGS = –4.5 V RDS(ON) = 0.27 Ω @ VGS = –2.5 V 

- Low gate charge (3.6 nC typical) 

- High performance trench technology for extremely low RDS(ON) 

- TM 

- • SuperSOT -3 provides low RDS(ON)  and 30% higher power handling capability than SOT23 in the same footprint 

**==> picture [130 x 96] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>S<br>TM G<br>SuperSOT  -3<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
D<br>G S<br>**----- End of picture text -----**<br>


**Absolute Maximum Ratings** TA=25[o] C unless otherwise noted 

**==> picture [433 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
Symbol Parameter Ratings Units<br>VDSS Drain-Source Voltage   –20 V<br>VGSS Gate-Source Voltage ±8  V<br>ID Drain Current  – Continuous  (Note 1a) –1.3 A<br>– Pulsed –10<br>PD Maximum Power Dissipation  (Note 1a) 0.5 W<br>(Note 1b) 0.46<br>TJ, TSTG Operating and Storage Junction Temperature Range  –55 to +150 °C<br>Thermal Characteristics<br>RθJA Thermal Resistance, Junction-to-Ambient   (Note 1a)  250  °C/W<br>RθJC Thermal Resistance, Junction-to-Case  (Note 1)  75  °C/W<br>ee<br>Package Marking and Ordering Information<br>Device Marking  Device  Reel Size  Tape width  Quantity<br>336 FDN336P 7’’ 8mm 3000 units<br>se<br>**----- End of picture text -----**<br>


Publication Order Number: FDN336P/D 

©2005 Semiconductor Components Industries, LLC. October-2017, Rev. 4 

**Electrical Characteristics** (TA = 25[O] C unless otherwise noted ) 

|**Electrical**|**Characteristics **(TA= 25OC unless o|therwise noted )|therwise noted )|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**OFF CHARACTERISTICS**||||||||
|BVDSS|Drain-Source Breakdown Voltage|VGS= 0 V,  ID= -250 µA||-20|||V|
|∆BVDSS/∆TJ|Breakdown Voltage Temp. Coefficient|ID= -250 µA, Referenced to  25<br>oC|||-16||mV /<br>oC|
|IDSS|Zero Gate Voltage  Drain Current|VDS= -16 V,  VGS= 0 V||||-1|µA|
||||TJ= 55°C|||-10|µA|
|IGSSF|Gate - Body Leakage, Forward|VGS= 8 V, VDS=  0 V||||100|nA|
|IGSSR|Gate - Body Leakage, Reverse|VGS=  -8 V, VDS=  0 V||||-100|nA|
|**ON CHARACTERISTICS**(Note 2)||||||||
|VGS(th)|Gate Threshold Voltage|VDS= VGS,  ID= -250 µA||-0.4|-0.9|-1.5|V|
|∆VGS(th)/∆TJ|Gate Threshold Voltage Temp. Coefficient|ID= -250 µA, Referenced to  25<br>oC|||3||mV /<br>oC|
|RDS(ON)|Static Drain-Source On-Resistance|VGS= -4.5 V,  ID= -1.3 A|||0.122|0.2|Ω|
||||T**J**=125°C||0.18|0.32||
|||VGS= -2.5 V,  ID= -1.1 A|||0.19|0.27||
|ID(ON)|On-State Drain Current|VGS= -4.5 V,  VDS= -5 V||-5|||A|
|gFS|Forward Transconductance|VDS= -4.5 V,  ID= -2 A|||4||S|
|**DYNAMIC CHARACTERISTICS**||||||||
|Ciss|Input Capacitance|VDS= -10 V,  VGS= 0 V,<br>f  = 1.0 MHz|||330||pF|
|Coss|Output Capacitance||||80||pF|
|Crss|Reverse Transfer Capacitance||||35||pF|
|**SWITCHING CHARACTERISTICS**(Note 2)||||||||
|tD(on)|Turn - On Delay Time|VDD= -5 V,  ID= -0.5 A,<br>VGS= -4.5 V,  RGEN= 6Ω|||7|15|ns|
|tr|Turn - On Rise Time||||12|22|ns|
|tD(off)|Turn - Off Delay Time||||16|26|ns|
|tf|Turn - Off Fall Time||||5|12|ns|
|Qg|Total Gate Charge|VDS= -10 V,  ID= - 2 A,<br>VGS= -4.5 V|||3.6|5|nC|
|Qgs|Gate-Source Charge||||0.8||nC|
|Qgd|Gate-Drain Charge||||0.7||nC|
|**DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS**||||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current|||||-0.42|A|
|VSD|Drain-Source Diode Forward Voltage|VGS= 0 V,  IS= -0.42 A (Not|e)||-0.7|-1.2|V|
|Note:||||||||



1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the  solder mounting surface of  the  drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a. 250oC/W when mounted on b. 270oC/W when mounted on a 0.02 in2 pad of 2oz Cu. a 0.001 in2 pad of 2oz Cu. Scale 1 : 1 on letter size paper 

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. 

www.onsemi.com 

2 

## **Typical Electrical Characteristics** 

**==> picture [188 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br> V    = -4.5VGS<br>8 -3.5V<br>-3.0V<br>6<br>-2.5V<br>4<br>2 -2.0V<br>0<br>0 1 2 3 4 5<br>-V     , DRAIN-SOURCE VOLTAGE (V)DS<br>D<br>- I   , DRAIN-SOURCE CURRENT (A)<br>**----- End of picture text -----**<br>


**Figure 1. On-Region Characteristics** . 

**==> picture [217 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.6<br>I   = -1.3AD<br>1.4 V     =  GS -4.5V<br>1.2<br>1<br>0.8<br>0.6<br>-50 -25 0 25 50 75 100 125 150<br>T  , JUNCTION TEMPERATURE (°C)J<br>DS(ON)<br>R             , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


## **Figure 3. On-Resistance Variation with Temperature** . 

**==> picture [211 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>V     = -5VDS T  = -55°CJ 25°C<br>3<br>125°C<br>2<br>1<br>0<br>0.5 1 1.5 2 2.5<br>-V     , GATE TO SOURCE VOLTAGE (V)GS<br>- I   , DRAIN CURRENT (A)<br>D<br>**----- End of picture text -----**<br>


**Figure  5. Transfer Characteristics.** 

**==> picture [200 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1.8<br>1.6 V     = -2.5 VGS<br>1.4 -3.0V<br>-3.5V<br>1.2<br>-4.0V -4.5V<br>1<br>0.8<br>0 2 4 6 8 10<br>- I    , DRAIN CURRENT (A)D<br>DS(on)<br>R           , NORMALIZED<br>DRAIN-SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 2. On-Resistance Variation with Drain Current and Gate** 

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**----- Start of picture text -----**<br>
0.5<br> I   = -0.6AD<br>0.4<br>0.3<br>0.2<br>T  = 125°CA<br>0.1<br>25°C<br>0<br>0 2 4 6 8 10<br>- V      , GATE TO SOURCE VOLTAGE (V)GS<br>DS(ON)<br>R             , ON-RESISTANCE (OHM)<br>**----- End of picture text -----**<br>


## **Figure 4. On-Resistance Variation with Gate-to-Source Voltage.** 

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**----- Start of picture text -----**<br>
10<br>V    = 0VGS<br>1 T  = 125 J °C<br>25°C<br> -55°C<br>0.1<br>0.01<br>0.001<br>0.2 0.4 0.6 0.8 1 1.2 1.4<br>-V     , BODY DIODE FORWARD VOLTAGE (V)SD<br>- I   , REVERSE DRAIN CURRENT (A)<br>S<br>**----- End of picture text -----**<br>


**Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.** 

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## **Typical Electrical Characteristics** (continued) 

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**----- Start of picture text -----**<br>
5 700<br>I    = -1.3AD<br>400<br>4 V    = -5VDS C  iss<br>-10V<br>3 -15V 200<br>100<br>2<br>C  oss<br>1<br>40 f = 1 MHz<br>V     = 0 V GS          C   rss<br>0<br>0 1 2 3 4<br>0.1 0.2 0.5 1 2 5 10 20<br>Q    , GATE CHARGE (nC)g -V     , DRAIN TO SOURCE VOLTAGE (V)DS<br>Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics .<br>30 50<br>10<br>SINGLE PULSE<br>40<br>3 R       =270°C/W       θJAθJAJA<br>T   = 25°CAA<br>1 30<br>0.3 20<br>0.1 V      GS = -4.5V<br>SINGLE PULSE 10<br>0.03 R        = 270θ [JA] °C/W<br>T    = 25°C A<br>0<br>0.01 0.0001 0.001 0.01 0.1 1 10 100 300<br>0.2 0.5 1 3 5 10 30<br>SINGLE PULSE TIME (SEC)<br>-V     , DRAIN-SOURCE VOLTAGE (V)DS<br>100ms<br>RDS(ON) LIMIT 1ms<br>10ms<br> 1s<br>10s<br> DC<br>CAPACITANCE (pF)<br>GS<br>-V      , GATE-SOURCE VOLTAGE (V)<br>POWER (W)<br>-I  , DRAIN CURRENT (A)D<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
50<br>SINGLE PULSE<br>40<br>R       =270°C/W       θJAθJAJA<br>T   = 25°CAA<br>30<br>20<br>10<br>0<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>SINGLE PULSE TIME (SEC)<br>POWER (W)<br>**----- End of picture text -----**<br>


## **Figure 9. Maximum Safe Operating Area.** 

**Figure 10. Single Pulse Maximum Power Dissipation.** 

**==> picture [410 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.5  D = 0.5<br>0.2   0.2   R       (t) = r(t)   θ [JA] *  R      θ [JA]<br>0.1  0.1     R        = 270 °C/W θ [J][A]<br>0.05  0.05<br> 0.02  P(pk)<br>0.02  0.01<br> t  1<br>0.01  Single Pulse   t   2<br>0.005 T  - T    = P  * R       J A θ [JA] (t)<br>Duty Cycle, D = t /t 1 2<br>0.002<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 300<br>t  , TIME (sec)1<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 11. Transient Thermal Response Curve.** Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. 

www.onsemi.com 

4 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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