# Power MOSFET, N Channel, 80 V, 76 A, 2600 µohm, Power 56, Surface Mount

![Product image](https://novapart.co/image/farnell:2322593/)

**URL**: https://novapart.co/products/FDMS86300DC/power-mosfet-n-channel-80-v-76-a-2600-ohm-56
**SKU**: FDMS86300DC
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.2100
**Stock**: 1000+
**Lead Time**: 134 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:76A; Drain Source Voltage Vds:80V; On Resistance Rds(on):0.0026ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.3V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 125W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | Power 56 |
| Drain Source Voltage Vds | 80V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 76A |
| Drain Source On State Resistance | 2600µohm |
| Gate Source Threshold Voltage Max | 3.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2322593/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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July 2015<br>**----- End of picture text -----**<br>


## **FDMS86300DC N-Channel Dual Cool[TM] 56 PowerTrench[®] MOSFET** 

## **80 V, 110 A, 3.1 m** Ω 

## **Features** 

Dual Cool[TM] Top Side Cooling PQFN package Max rDS(on) = 3.1 mΩ at VGS = 10 V, ID = 24 A Max rDS(on) = 4.0 mΩ at VGS = 8 V, ID = 21 A 

High performance technology for extremely low rDS(on) 100% UIL Tested 

RoHS Compliant 

## **General Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench[®] process. Advancements in both silicon and Dual Cool[TM] package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance by extremely low Junction-to-Ambient thermal resistance. 

## **Applications** 

Synchronous Rectifier for DC/DC Converters 

eX2 Telecom Secondary Side Rectification 

High End Server/Workstation Vcore Low Side 

|**Bottom**<br>**Top**<br>**Pin 1**<br>**S**<br>**G**<br>**S**<br>**S**<br>**D**<br>**D**<br>**D D**<br>**Dual CoolTM 56**<br>**S**<br>**Pin 1**<br>**S**<br>**S**<br>**S**<br>**G**<br>**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted<br>~~~~~|**Bottom**<br>**Top**<br>**Pin 1**<br>**S**<br>**G**<br>**S**<br>**S**<br>**D**<br>**D**<br>**D D**<br>**Dual CoolTM 56**<br>**S**<br>**Pin 1**<br>**S**<br>**S**<br>**S**<br>**G**<br>**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted<br>~~~~~|**Bottom**<br>**Top**<br>**Pin 1**<br>**S**<br>**G**<br>**S**<br>**S**<br>**D**<br>**D**<br>**D D**<br>**Dual CoolTM 56**<br>**S**<br>**Pin 1**<br>**S**<br>**S**<br>**S**<br>**G**<br>**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted<br>~~~~~|7<br>3}<br>4}|7<br>3}<br>4}||(3<br>ig<br>is|**D**<br>**D**<br>**D**<br>**D**|**D**<br>**D**<br>**D**<br>**D**||
|---|---|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**||||**Ratings**||||**Units**|
|VDS<br>Drain to Source Voltage|||||80||||V|
|VGS<br>Gate to Source Voltage|e|e|||±20||||V|
|Drain Current   -Continuous                                    T|Drain Current   -Continuous                                    TC = 25 °C|= 25 °C|||110|||||
|ID<br>-Continuous                                     T|-Continuous                                     TA= 25 °C|= 25 °C(Note 1a)|||24||||A|
|-Pulsed|-Pulsed|-Pulsed(Note 2)|||260|||||
|EAS<br>Single Pulse Avalanche Energy||(Note 3)|||240||||mJ|
|PD<br>Power Dissipation                                                   T<br>Power Dissipation                                                      T|ation                                                   TC= 25 °C<br>ation                                                      TA= 25 °C|= 25 °C<br>= 25 °C(Note 1a)|||125<br>3.2||||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range|||||-55 to +150||||°C|
|**Thermal Characteristics**||||||||||
|RθJC<br>Thermal Resistance, Junction to Case|Thermal Resistance, Junction to Case|Thermal Resistance, Junction to Case(TopSource)|||2.3|||||
|RθJC<br>Thermal Resistance, Junction to Case|Thermal Resistance, Junction to Case|Thermal Resistance, Junction to Case(Bottom Drain)|||1.0|||||
|RθJA<br>Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1a)|||38|||||
|RθJA<br>Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1b)|||81||||°C/W|
|RθJA<br>Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1i)|||16|||||
|RθJA<br>Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1j)|||23|||||
|RθJA<br>Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1k)|||11|||||



**MOSFET Maximum Ratings** TA = 25 °C unless otherwise noted 

## **Thermal Characteristics** 

## **Package Marking and Ordering Information** 

|**Device Marking**|**Device**|**Package**|**Reel Size**|**Tape Width**|**Quantity**|
|---|---|---|---|---|---|
|86300|FDMS86300DC|Dual CoolTM56|13’’|12 mm|3000 units|



©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**1** 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Electrica**|**l Characteristics**TJ= 25 °C unles|s otherwise noted|s otherwise noted|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**||||||||
|BVDSS|Drain to Source Breakdown Voltage|ID= 250μA, VGS= 0 V||80|||V|
|ΔBVDSS<br>ΔTJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250μA, referenced to 25 °C|||45||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 64 V, VGS = 0 V||||1|μA|
|IGSS|Gate to Source Leakage Current|VGS= ±20 V, VDS = 0 V||||±100|nA|
|**On Characteristics**||||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS,  ID= 250μA||2.5|3.3|4.5|V|
|ΔVGS(th)<br>ΔTJ|Gate to Source Threshold Voltage<br>Temperature Coefficient|ID= 250μA, referenced to 25 °C|||-11||mV/°C|
|rDS(on)|Static Drain to Source On Resistance|VGS= 10 V,  ID= 24 A|||2.6|3.1|mΩ|
|||VGS= 8 V,  ID= 21 A|||3.1|4.0||
|||VGS= 10 V,  ID= 24 A, TJ= 125 °C|||4.1|5.0||
|gFS|Forward Transconductance|VDD= 10 V,  ID= 24 A|||79||S|
|**Dynamic Characteristics**||||||||
|Ciss|Input Capacitance|VDS= 40 V, VGS= 0 V,<br>f = 1 MHz|||5265|7005|pF|
|Coss|Output Capacitance||||929|1235|pF|
|Crss|Reverse Transfer Capacitance||||21|50|pF|
|Rg|Gate Resistance|||0.1|1.2|2.6|Ω|
|**Switching Characteristics**||||||||
|td(on)|Turn-On DelayTime|VDD= 40 V , ID= 24 A,<br>VGS= 10 V, RGEN= 6Ω|||29|47|ns|
|tr|Rise Time||||25|44|ns|
|td(off)|Turn-Off DelayTime||||35|57|ns|
|tf|Fall Time||||9|18|ns|
|Qg(TOT)|Total Gate Charge|VGS= 0 V to 10 V|VDD= 40 V<br>ID= 24 A||72|101|nC|
||Total Gate Charge|VGS= 0 V to 8 V|||59|84|nC|
|Qgs|Total Gate Charge||||26||nC|
|Qgd|Gate to Drain “Miller” Charge||||14||nC|
|**Drain-Source Diode Characteristics**||||||||
|VSD|Source to Drain Diode  Forward Voltage|VGS = 0 V, IS = 2.7 A(Note 2)|||0.72|1.2|V|
|||VGS = 0 V, IS = 24 A(Note 2)|||0.80|1.3||
|IS|Diode continuous forward current|TC= 25 °C||||75|A|
|IS, pulse|Diodepulse current|||||150||
|trr|Reverse RecoveryTime|IF= 24 A, di/dt = 100 A/μs|||56|88|ns|
|Qrr|Reverse RecoveryCharge||||42|67|nC|



©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**2** 

www.fairchildsemi.com 

## **Thermal Characteristics** 

|RθJC|Thermal Resistance, Junction to Case(TopSource)|2.3|°C/W|
|---|---|---|---|
|RθJC|Thermal Resistance, Junction to Case(Bottom Drain)|1.0||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1a)|38||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1b)|81||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1c)|27||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1d)|34||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1e)|16||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1f)|19||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1g)|26||
|RθJA|Thermal Resistance, Junction to Ambient                                                 (Note 1h)|61||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1i)|16||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1j)|23||
|RθJA|Thermal Resistance, Junction to Ambient                                                 (Note 1k)|11||
|RθJA|Thermal Resistance, Junction to Ambient(Note 1l)|13||



NOTES: 

1. RθJA is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

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a. 38 °C/W when mounted on b. 81 °C/W when mounted on<br>     a 1 in [2  ] pad of  2 oz  copper                a minimum pad of 2 oz copper<br>G DF DS SF SS<br>G DF DS SF SS<br>**----- End of picture text -----**<br>


   - c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in[2] pad of 2 oz copper 

- d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper 

- e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in[2] pad of 2 oz copper 

- f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper 

- g. 200FPM Airflow, No Heat Sink,1 in[2] pad of 2 oz copper 

- h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper 

- i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in[2] pad of 2 oz copper 

- j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper 

- k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in[2] pad of 2 oz copper 

- l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper 

2. Pulse Test: Pulse Width < 30 0 μs, Duty cycle < 2.0%. 

3. Starting TJ = 25[o] C, L = 0.3 mH, IAS = 40 A, VDD = 72 V, VGS = 10 V. 

©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**3** 

www.fairchildsemi.com 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

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260 6<br>VGS = 10 V VGS = 7 V VGS = 5.5 V<br>VGS = 8 V 5<br>208 PULSE DURATION = 80  μ s<br>PULSE DURATION = 80  μ s VGS = 6 V DUTY CYCLE = 0.5% MAX<br>DUTY CYCLE = 0.5% MAX 4<br>156<br>VGS = 6.5 V<br>VGS = 6.5 V 3<br>104 VGS = 7 V<br>2<br>VGS = 6 V<br>52<br>1<br>VGS = 5.5 V VGS = 8 V VGS = 10 V<br>0 0<br>0 1 2 3 4 5 0 52 104 156 208 260<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 1.  On-Region Characteristics** 

**Figure 2. vs Drain Current and Gate Voltage** 

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2.0<br>1.8 ID = 24 A<br>VGS = 10 V<br>1.6<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( [o] C)<br>Figure 3.  Normalized  On- Resistance<br>vs Junction Temperature<br>260<br>PULSE DURATION = 80  μ s<br>DUTY CYCLE = 0.5% MAX<br>208<br>VDS = 5 V<br>156<br>TJ = 150  [o] C<br>104<br>TJ = 25  [o] C<br>52<br>TJ = -55  [o] C<br>0<br>3 4 5 6 7 8<br>VGS, GATE TO SOURCE VOLTAGE (V)<br>NORMALIZED<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

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15<br>ID = 24 A PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX μ s<br>12<br>9<br>TJ = 125  [o] C<br>6<br>3<br>TJ = 25  [o] C<br>0<br>5 6 7 8 9 10<br>VGS, GATE TO SOURCE VOLTAGE (V)<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>rDS(on),<br>SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 4. Source Voltage** 

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300<br>100 VGS = 0 V<br>10<br>TJ = 150  [o] C<br>1<br>T J = 25 [ o] C<br>0.1<br>0.01 T J  = -55  [o] C<br>1E-3<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 6. Forward Voltage vs Source Current** 

©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**4** 

www.fairchildsemi.com 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

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10 10000<br>ID = 24 A VDD = 30 V Ciss<br>8<br>VDD = 40 V VDD = 50 V 1000<br>6 Coss<br>4 100 Crss<br>2<br>f = 1 MHz<br>10 VGS = 0 V<br>0 5<br>0 20 40 60 80 0.1 1 10 80<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>100 160<br>140<br>120<br>VGS = 10 V<br>TJ = 25 [ o] C 100<br>10 TJ = 100 [ o] C 80<br>Limited by Package VGS = 8 V<br>60<br>R θ JC = 1.0  [o] C/W<br>40<br>TJ = 125  [o] C<br>20<br>1 0<br>0.01 0.1 1 10 100 500 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current vs Case Temperature<br>1000 10000<br>SINGLE PULSE<br>100 R θ JA = 81  [o] C/W<br>1000 TA = 25  o C<br>100 u s<br>10<br>THIS AREA IS  1 ms 100<br>1 LIMITED BY r<br>DS(on) 10 m s<br>SINGLE PULSE<br>0.1 T J = MAX RATED 100 m1 s s 10<br>R θ JA = 81  [ o] C/W CURVE BENT TO  10 s<br>TA = 25  [o] C MEASURED DATA DC<br>0.010.01 0.1 1 10 100200 110-4 10-3 10-2 10-1 100 101 100 1000<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                  Figure 12.  Single  Pulse Maximum<br>Operating Area Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)ID<br>PEAK TRANSIENT POWER (W)<br>,<br>(PK)<br>P<br>**----- End of picture text -----**<br>


©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**5** 

www.fairchildsemi.com 

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Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>       0.2<br>0.1        0.1 PDM<br>       0.05<br>       0.02<br>0.01        0.01 t 1<br>t2<br>SINGLE PULSE NOTES:<br>Z θJA (t) = r(t) x R θJA<br>0.001 R θJA  = 81 °C/W<br>Peak TJ = PDM x Z θJA (t) + TA<br>Duty Cycle, D = t1 / t2<br>0.000110-4 10-3 10-2 10 -1 100 10 1 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Junction-to-Ambient Transient Thermal Response Curve<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


©2012 Fairchild Semiconductor Corporation FDMS86300DC Rev. 1.13 

**6** 

www.fairchildsemi.com 

(2X) 

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A .1 C<br>4.90 A (2X)<br>(2.60) .1 C<br>(0.90) CL<br>B<br>8 5<br>A<br>(3.30) CL 5.80<br>(2.08)<br>(0.82)<br>1 4 (1.05)<br>OPTIONAL PIN 1<br>SEE<br>INDICATOR<br>DETAIL A<br>**----- End of picture text -----**<br>


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5.10<br>3.91 1.27<br>0.77<br>8 7 6 5<br>KEEP-<br>OUT<br>2.54<br>2.04<br>AREA<br>1.22<br>2.67<br>1.27<br>1 2 3 4<br>1.27 0.61<br>3.81<br>LAND PATTERN<br>RECOMMENDATION<br>**----- End of picture text -----**<br>


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A 5.00<br>OPTIONAL DRAFT ANGLE<br>4.80<br>MAY APPEAR ON FOUR<br>A<br>1.27 3.81 0.410.31 (8X) SIDES OF THE PACKAGE<br>0.50<br>(0.34) 0.40 [ (8X)]<br>7°<br>1 2 3 4 0.10 C A B<br>(1.02)<br>A 0.710.44 (4X) A (1.40) (0.50)<br>5.85 A<br>0.35 0.40<br>0.25 0.30 3.58 5.50<br>3.38<br>CHAMFER (0.20)<br>CORNER (8X)<br> AS PIN #1<br>IDENT MAY 8 7 6 5<br>APPEAR AS 3.86 0.65<br>OPTIONAL 3.61 0.45 (4X) NOTES:<br>0.1 MAX<br>0.10 C<br>       ASME Y14.5M-2009.<br>0.08 C<br>0.30 0.05 C<br>0.20 0.00<br>1.05 SEATING<br>0.95<br>PLANE<br>SCALE: 2:1<br>**----- End of picture text -----**<br>


- A)  PACKAGE IS NOT FULLY COMPLIANT TO JEDEC MO-240, VARIATION AA. 

- B)  ALL DIMENSIONS ARE IN MILLIMETERS. 

- C)  DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. MOLD FLASH OR BURRS DOES NOT EXCEED 0.10MM. 

- D)  DIMENSIONING AND TOLERANCING PER ASME Y14.5M-2009. 

- E)  IT IS RECOMMENDED TO HAVE NO TRACES OR VIAS WITHIN THE KEEP OUT AREA. 

- F)  DRAWING FILE NAME: PQFN08DREV4 

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## Links

- [View this product on Novapart](https://novapart.co/products/FDMS86300DC/power-mosfet-n-channel-80-v-76-a-2600-ohm-56)
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- [Supplier page](https://es.farnell.com/on-semiconductor/fdms86300dc/mosfet-n-ch-80v-76a-power-56-8/dp/2322593)
---

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