# Power MOSFET, N Channel, 120 V, 64 A, 6000 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3003995/)

**URL**: https://novapart.co/products/FDMS86202/power-mosfet-n-channel-120-v-64-a-6000-ohm-pqfn
**SKU**: FDMS86202
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.1300
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:64A; Drain Source Voltage Vds:120V; On Resistance Rds(on):0.006ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.1V; Powe

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | - |
| Power Dissipation | 156W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 120V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 64A |
| Drain Source On State Resistance | 6000µohm |
| Gate Source Threshold Voltage Max | 3.1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3003995/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [42 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
July 2014<br>**----- End of picture text -----**<br>


## **FDMS86202** 

## **N-Channel Shielded Gate PowerTrench[®] MOSFET 120 V, 64 A, 7.2 m** Ω 

## **Features** 

Shielded Gate MOSFET Technology 

Max rDS(on) = 7.2 mΩ at  VGS = 10 V, ID = 13.5 A 

Max rDS(on) = 10.3 mΩ at  VGS = 6 V, ID = 11.5 A 

Advanced Package and Silicon combination for low rDS(on) and high efficiency 

MSL1 robust package design 

## **General Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench **[®]** process that incorporates Shielded Gate technology. This process has been optimized for the on-state resistance and yet maintain superior switching performance. 

## **Application** 

DC-DC Conversion 

100% UIL tested 

RoHS Compliant 

||**Top**<br>**Pin 1**|**D **<br>**Pin 1**|**D D**|**Bottom**<br>**S**<br>**D**|**S**<br>**S**<br><_|**Pin 1**<br>**G**|**Pin 1**|**S**<br>**S**<br>**S**<br>**G**||1)<br>2}<br>3}<br>4}|1)<br>2}<br>3}<br>4}|||i<br>fd<br>is<br>is|**D**<br>**D**<br>**D**<br>**D**|**D**<br>**D**<br>**D**<br>**D**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Power 56**||||||||||||||||
|**MOSFET Maximum Ratings**|**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted|||= 25 °C unless otherwise noted|||||||||||||
|**Symbol**|||**Parameter**|||||||||**Ratings**||||**Units**|
|VDS|Drain to Source Voltage|||||||||||120||||V|
|VGS|Gate to Source Voltage|||||||||||±20||||V|
||Drain Current   -Continuous                                    T||Drain Current   -Continuous                                    T|Drain Current   -Continuous                                    T|Drain Current   -Continuous                                    TC= 25 °C||= 25 °C|||||64|||||
|ID|-Continuous                                        T||-Continuous                                        T|-Continuous                                        T|-Continuous                                        TA= 25 °C||= 25 °C|= 25 °C(Note 1a)||||13.5||||A|
||-Pulsed||-Pulsed|-Pulsed|-Pulsed|-Pulsed|-Pulsed|-Pulsed(Note 4)||||240|||||
|EAS|Single Pulse Avalanche Energy|||||||(Note 3)||||600||||mJ|
|PD|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   T<br>Power Dissipation                                                      T|Power Dissipation                                                   TC= 25 °C<br>Power Dissipation                                                      TA= 25 °C||= 25 °C|= 25 °C(Note 1a)||||156<br>2.7||||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||||||||||-55 to +150||||°C|
|**Thermal Characteristics**|**Thermal Characteristics**||||||||||||||||
|RθJC|Thermal Resistance, Junction to Case|||||||||||0.8||||°C/W|
|RθJA|Thermal Resistance, Junction to Ambient                                                 (Note 1a)||||Thermal Resistance, Junction to Ambient                                                 (Note 1a)|Thermal Resistance, Junction to Ambient                                                 (Note 1a)|Thermal Resistance, Junction to Ambient                                                 (Note 1a)|Thermal Resistance, Junction to Ambient                                                 (Note 1a)||||45|||||
|**Package Marking and Ordering Information**|**Package Marking and Ordering Information**||||||||||||||||
|**Device Marking**<br>**Device**||||**Package**|||**Reel Size**|||||**Tape Width**||**Quantity**|||
||FDMS86202<br>FDMS86202|||Power 56||||13 ’’||||12 mm||3000 units|||



**MOSFET Maximum Ratings** TA = 25 °C unless otherwise noted 

## **Thermal Characteristics** 

## **Package Marking and Ordering Information** 

©2013 Fairchild Semiconductor Corporation FDMS86202 Rev. C3 

www.fairchildsemi.com 

**1** 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|
|---|---|
|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Switching Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250μA, VGS= 0 V<br>120<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250μA, referenced to 25 °C<br>103<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 96 V, VGS= 0 V<br>1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS= 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250μA<br>2.0<br>3.1<br>4.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250μA, referenced to 25 °C<br>-10<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 13.5 A<br>6.0<br>7.2<br>mΩ<br>VGS= 6 V, ID= 11.5 A<br>8.1<br>10.3<br>VGS= 10 V, ID= 13.5 A,TJ= 125 °C<br>10.9<br>13.2<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 13.5 A<br>44<br>S<br>Ciss<br>Input Capacitance<br>VDS= 60 V, VGS= 0 V,<br>f = 1 MHz<br>3195<br>4250<br>pF<br>Coss<br>Output Capacitance<br>449<br>600<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>17<br>30<br>pF<br>Rg<br>Gate Resistance<br>0.1<br>0.9<br>2.7<br>Ω<br>td(on)<br>Turn-On DelayTime<br>VDD= 60 V, ID= 13.5 A,<br>VGS= 10 V, RGEN= 6Ω<br>21<br>33<br>ns<br>tr<br>Rise Time<br>6<br>13<br>ns<br>td(off)<br>Turn-Off DelayTime<br>27<br>44<br>ns<br>tf<br>Fall Time<br>5<br>11<br>ns<br>~~=~~<br>~~eeneee~~<br>~~=~~<br>~~===~~||
|Qg<br>Total Gate Charge<br>VGS= 0 V to 10 V<br>VDD= 60 V,<br>ID= 13.5 A<br>45<br>64<br>nC<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 6 V<br>29<br>41<br>nC<br>Qgs<br>Gate to Source Charge<br>14.3<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>8.7<br>nC<br>~~———~~||
|**Drain-Source Diode Characteristics**||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS= 0 V, IS= 2.1 A(Note 2)<br>0.69<br>1.2<br>V<br>VGS= 0 V, IS= 13.5 A(Note 2)<br>0.76<br>1.3<br>trr<br>Reverse RecoveryTime<br>IF= 13.5 A, di/dt = 100 A/μs<br>73<br>118<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>117<br>187<br>nC<br>~~————————~~||
|Notes**:**||
|1. RθJAis determined with the device mounted on a 1in2pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJCis guaranteed by design while RθCAis determined by||
|the user's board design.||
|45 °C/W when mounted  on  a<br>1 in2pad of  2 oz  copper<br>a)<br>b) 115 °C/W when mounted on a<br>minimum pad of 2 oz copper.<br>D)||
|**G**<br>**DF**<br>**DS**<br>**SF**<br>**SS**<br>**G**<br>**DF**<br>**DS**<br>**SF**<br>**SS**||



2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 

3. EAS of 600 mJ is based on starting TJ = 25 °C, L = 3 mH, IAS =  20 A, VDD = 120 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS =  65 A. 

4. Pulse Id limited by junction temperature, td ≤ 100 μs, please refer to SOA curve for more details. 

©2013 Fairchild Semiconductor Corporation FDMS86202 Rev. C3 

www.fairchildsemi.com 

**2** 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

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240 5<br>VGS = 10 V PULSE DURATION = 80  μ s VGS = 5 V<br>VGS = 8 V DUTY CYCLE = 0.5% MAX 4<br>180<br>VGS =  7 V VGS = 6 V<br>VGS = 6 V 3<br>120<br>2 VGS = 7 V<br>VGS = 8 V<br>60<br>VGS = 5 V 1 PULSE DURATION = 80  μ s VGS = 10 V<br>DUTY CYCLE = 0.5% MAX<br>0 0<br>0 1 2 3 4 5 0 60 120 180 240<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>2.4 40<br>2.2 ID = 13.5 A PULSE DURATION = 80  μ s<br>VGS = 10 V DUTY CYCLE = 0.5% MAX<br>2.0<br>30<br>1.8 ID = 13.5 A<br>1.6<br>1.4 20<br>1.2<br>TJ = 125  [o] C<br>1.0<br>10<br>0.8<br>0.6 TJ = 25  [o] C<br>0.4 0<br>-75 -50 -25 0 25 50 75 100 125 150 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>240 300<br>PULSE DURATION = 80  μ s 100 VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>180 10<br>VDS = 10 V<br>TJ = 150  [o] C<br>1<br>120<br>TJ = 150  [o] C 0.1 T J  = 25 [ o] C<br>TJ = 25  [o] C<br>60<br>TJ = -55  [o] C 0.01 TJ = -55  [o] C<br>0 0.001<br>2 3 4 5 6 7 8 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>) Ω<br>(m<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6. Forward Voltage vs Source Current** 

©2013 Fairchild Semiconductor Corporation FDMS86202 Rev. C3 

www.fairchildsemi.com 

**3** 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
10 10000<br>ID = 13.5 A VDD = 35 V<br>8 Ciss<br>1000<br>VDD = 60 V<br>6 C oss<br>VDD = 85 V 100<br>4<br>10 Crss<br>2<br>f = 1 MHz<br>VGS = 0 V<br>0 1<br>0 10 20 30 40 50 0.1 1 10 100<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>100<br>100<br>80<br>60<br>TJ = 25 [ o] C VGS = 10 V<br>10 Limited by Package<br>TJ = 100 [ o] C 40<br>VGS = 6 V<br>20<br>TJ = 125  [o] C<br>R θ JC = 0.8  [o] C/W<br>1 0<br>25 50 75 100 125 150<br>0.01 0.1 1 10 100 1000<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current  vs Case Temperature<br>1000 50000<br>SINGLE PULSE<br>10 us R θ JC = 0.8  [o] C/W<br>100 10000 TC = 25  [o] C<br>10 THIS AREA IS<br>LIMITED BY r<br>DS(on)<br>100 us 1000<br>SINGLE PULSE<br>1 T J = MAX RATED 1 ms<br>R θ JC = 0.8 [ o] C/W CURVE BENT TO  10 ms<br>TC = 25  [o] C MEASURED DATA DC<br>0.1 100<br>0.1 1 10 100 400 10-5 10-4 10-3 10-2 10-1 1<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                      Figure 12.   Single  Pulse Maximum<br>Operating Area  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


**Power  Dissipation** 

©2013 Fairchild Semiconductor Corporation FDMS86202 Rev. C3 

www.fairchildsemi.com 

**4** 

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**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>      0.1 PDM<br>      0.05<br>0.1<br>      0.02<br>      0.01 t1<br>t 2<br>NOTES:<br>0.01 Z θ JC(t) = r(t) x R θ JC<br>SINGLE PULSE RPeak T θ JC = 0.8 J = P [o] C/WDM x Z θ JC(t) + TC<br>Duty Cycle, D = t 1  / t 2<br>0.001<br>10-5 10-4 10-3 10-2 10-1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 13.  Junction-to-Case Transient Thermal Response Curve<br>**----- End of picture text -----**<br>


©2013 Fairchild Semiconductor Corporation FDMS86202 Rev. C3 

www.fairchildsemi.com 

**5** 

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**----- Start of picture text -----**<br>
5.10<br>A<br>4.90 4.42<br>PKG 3.81<br>CL B<br>8 5 8 7 6 5<br>1.14<br>KEEP OUT AREA<br>3.65<br>PKG CL 6.25<br>5.90 4.79 6.61<br>1.27<br>PIN #1 1 4<br>IDICATOR TOP VIEW 1 2 3 4<br>1.27 0.61<br>SEE<br>DETAIL A 3.81<br>5.10<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
LAND PATTERN<br>RECOMMENDATION<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
SIDE VIEW<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
3.81<br>0.10 C A B<br>1.27<br>0.47<br>(0.38)<br>0.37 [  (8X)]<br>1 4<br>(0.35)<br>0.65<br>0.55<br> PIN #1<br>INDICATOR 4.66<br>4.46<br>8 5<br>0.70<br>4.33<br>4.13<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


- NOTES: UNLESS OTHERWISE SPECIFIED A)  PACKAGE STANDARD REFERENCE: JEDEC MO-240, ISSUE A, VAR. AA, 

- B)  ALL DIMENSIONS ARE IN MILLIMETERS. 

- C)  DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. MOLD FLASH OR BURRS DOES NOT EXCEED 0.10MM. 

- D)  DIMENSIONING AND TOLERANCING PER ASME Y14.5M-2009. 

- E)  IT IS RECOMMENDED TO HAVE NO TRACES OR VIAS WITHIN THE KEEP OUT AREA. 

- F)  DRAWING FILE NAME: PQFN08JREV3. 

**==> picture [268 x 114] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.10 C<br>1.10<br>0.90<br>0.08 C<br>C<br>0.25 0.05<br>0.15 0.00 SEATING<br>PLANE<br>**----- End of picture text -----**<br>


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SCALE: 2:1 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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