# Power MOSFET, N Channel, 30 V, 42 A, 0.0024 ohm, Power 56, Surface Mount

![Product image](https://novapart.co/image/farnell:2083297/)

**URL**: https://novapart.co/products/FDMS7670AS./power-mosfet-n-channel-30-v-42-a-00024-ohm-56
**SKU**: FDMS7670AS.
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4220
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Power Dissipation | 65W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 65W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0024ohm |
| Transistor Case Style | Power 56 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 42A |
| Drain Source On State Resistance | 0.0024ohm |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083297/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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October 2014<br>**----- End of picture text -----**<br>


## **FDMS7670AS** 

## **N-Channel PowerTrench[®] SyncFET[TM] 30 V, 42 A, 3 m** 

## **Features** 

Max rDS(on) = 3.0 m at VGS = 10 V, ID = 21 A Max rDS(on) = 3.2 m at VGS = 7 V, ID = 19 A 

Advanced Package and Silicon combination for low rDS(on) and high efficiency 

SyncFET Schottky Body Diode MSL1 robust package design 100% UIL tested RoHS Compliant 

## **General Description** 

The FDMS7670AS has been designed to minimize losses in power conversion application. Advancements in both silicon and package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance. This device has the added benefit of an efficient monolithic Schottky body diode. 

## **Applications** 

Synchronous Rectifier for DC/DC Converters 

Notebook Vcore/ GPU low side switch 

Networking Point of Load low side switch 

Telecom secondary side rectification 

|**D**<br>**D D D**<br>**G**<br>**S**<br>**S**<br>**S**<br>Pin 1<br>**Bottom**<br>**Top**<br>es|**D**<br>**D D D**<br>**G**<br>**S**<br>**S**<br>**S**<br>Pin 1<br>**Bottom**<br>**Top**<br>es|**D**<br>**D D D**<br>**G**<br>**S**<br>**S**<br>**S**<br>Pin 1<br>**Bottom**<br>**Top**<br>es|**D**<br>**D D D**<br>**G**<br>**S**<br>**S**<br>**S**<br>Pin 1<br>**Bottom**<br>**Top**<br>es|**D**<br>**D D D**<br>**G**<br>**S**<br>**S**<br>**S**<br>Pin 1<br>**Bottom**<br>**Top**<br>es|**D**<br>**D**<br>**D**<br>**D**|**5**<br>**6**<br>**7**<br>**8**|**5**<br>**6**<br>**7**<br>**8**|||**4**<br>**3**<br>**2**<br>**1**|**S**<br>**S**<br>**S**<br>**G**|**S**<br>**S**<br>**S**<br>**G**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Power 56**||||||||||||
|**MOSFET Maximum Ratings**|**MOSFET Maximum Ratings** TC= 25 °C unless otherwise noted||||||||||||
|**Symbol**|**Parameter**|||||||**Ratings**||||**Units**|
|VDS|Drain to Source Voltage|||||||30||||V|
|VGS|Gate to Source Voltage                                                                                 (Note 4)|Gate to Source Voltage                                                                                 (Note 4)|Gate to Source Voltage                                                                                 (Note 4)|Gate to Source Voltage                                                                                 (Note 4)|Gate to Source Voltage                                                                                 (Note 4)|||±20||||V|
||Drain Current   -Continuous(Package limited)|TC = 25 °C|= 25 °C|||||42|||||
|ID|-Continuous (Silicon limited)          T<br>-Continuous                                        T|-Continuous (Silicon limited)          TC= 25 °C<br>-Continuous                                        TA= 25 °C              (Note 1a)|= 25 °C<br>= 25 °C              (Note 1a)||= 25 °C              (Note 1a)|||113<br>22||||A|
||-Pulsed|||||||150|||||
|dv/dt|MOSFET dv/dt|||||||1.8||||V/ns|
|EAS|Single Pulse Avalanche Energy                                                              (Note 3)|Single Pulse Avalanche Energy                                                              (Note 3)|Single Pulse Avalanche Energy                                                              (Note 3)|Single Pulse Avalanche Energy                                                              (Note 3)|Single Pulse Avalanche Energy                                                              (Note 3)|||98||||mJ|
|PD|Power Dissipation                                                   T<br>Power Dissipation                                                         T|Power Dissipation                                                   TC= 25 °C<br>Power Dissipation                                                         TA= 25 °C              (Note 1a)|= 25 °C<br>= 25 °C              (Note 1a)||= 25 °C              (Note 1a)|||65<br>2.5||||W|
|TJ, TSTG|Operating and Storage Junction Temperature Range|||||||-55 to +150||||°C|
|**Thermal Characteristics**|||||||||||||
|R JC|Thermal Resistance, Junction to Case|||||||1.9||||°C/W|
|R JA|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient<br> (Note 1a)|||50|||||
|**Package Marking and Ordering Information**|||||||||||||
|**Device Marking**<br>**Device**<br>**Package**<br>FDMS7670AS<br>FDMS7670AS<br>Power 56<br>~~—~~|||||**Reel Size**<br>13 ’’|||**Tape Width**<br>12 mm||**Quantity**<br>3000 units|||



www.fairchildsemi.com 

**1** 

©2010 Fairchild Semiconductor Corporation FDMS7670AS Rev.C2 

## **Electrical Characteristics** TA = 25 °C unless otherwise noted 

|**Electrical Characteristics**TA = 25 °C unless otherwise notedA = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TA = 25 °C unless otherwise notedA = 25 °C unless otherwise noted= 25 °C unless otherwise noted|
|---|---|
|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 1 mA, VGS= 0 V<br>30<br>V<br>BVDSS<br>TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 10 mA, referenced to 25 °C<br>14<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24 V, VGS= 0 V<br>500<br>A<br>IGSS<br>Gate to Source Leakage Current, Forward<br>VGS= 20 V, VDS= 0 V<br>100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 1 mA<br>1.2<br>1.6<br>3.0<br>V<br>VGS(th)<br>TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 10 mA, referenced to 25 °C<br>-5<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 21 A<br>2.4<br>3.0<br>m<br>VGS= 7 V, ID= 19 A<br>2.5<br>3.2<br>VGS= 4.5 V, ID= 17 A<br>3.0<br>3.5<br>VGS= 10 V, ID= 21 A, TJ= 125 °C<br>3.0<br>3.8<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 21 A<br>300<br>S<br>**(Note 2)**<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 15 V, VGS= 0 V,<br>f = 1 MHz<br>3175<br>4225<br>pF<br>Coss<br>Output Capacitance<br>1175<br>1565<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>110<br>165<br>pF<br>Rg<br>Gate Resistance<br>1.3<br>2.6<br>**Switching Characteristics**<br>a<br>~~Se~~<br>ee<br>a<br>~~Se~~<br>es<br>ee<br>es<br>es<br>ee<br>ee<br>~~ee~~<br>~~a GD~~<br>ee<br>ee ee eee eee<br>ee<br>ee ee eee eee<br>ee<br>ee<br>ee ee eee ee<br>eeeG<br>=||
|td(on)<br>Turn-On Delay Time<br>VDD= 15 V, ID= 21 A,<br>VGS= 10 V, RGEN= 6<br>14<br>25<br>ns<br>tr<br>Rise Time<br>6<br>12<br>ns<br>td(off)<br>Turn-Off Delay Time<br>35<br>56<br>ns<br>tf<br>Fall Time<br>5<br>10<br>ns<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 10 V<br>VDD= 15 V,<br>ID= 21 A<br>47<br>66<br>nC<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 4.5 V<br>22<br>31<br>nC<br>Qgs<br>Gate to Source Gate Charge<br>8.5<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>4.9<br>nC<br>ee<br>ee ee ee ee<br>ee<br>ee ee ee ee<br>ee<br>2<br>ee ee ee ee<br>ee<br>ee ee ee ee<br>ee<br>ee ee ee ee<br>ee<br>ee ee ee ee<br>ee<br>ee ee ee ee<br>ee<br>ee ee ee ee||
|**Drain-Source Diode Characteristics**||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS= 0 V, IS= 2 A            (Note 2)<br>0.43<br>0.7<br>V<br>VGS= 0 V, IS= 21 A          (Note 2)<br>0.75<br>1.2<br>~~ae~~<br>ee||
|trr<br>Reverse Recovery Time<br>IF= 21 A, di/dt = 300 A/<br>s<br>35<br>56<br>ns<br>Qrr<br>Reverse Recovery Charge<br>41<br>67<br>nC<br>Notes**:**<br>a<br>ee<br>ee eeeee||
|1. R JAis determined with the device mounted on a 1in2pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R JCis guaranteed by design while R CAis determined by<br>the user's board design.<br>to)<br>c)<br>c)||



a. 50 °C/W when mounted  on a b. 125 °C/W when mounted on  a 1 in[2] pad of  2 oz  copper. minimum pad of 2 oz copper. 

2. Pulse Test: Pulse Width < 300 vy s, Duty cycle < 2.0%. 

3. EAS of 98 mJ is based on starting TJ = 25 °C, L = 1 mH, IAS = 14 A, VDD = 27 V, VGS = 10 V. 100% test at L = 0.3 mH, IAS = 21 A. 

4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied. 

www.fairchildsemi.com 

**2** 

FDMS7670AS Rev.C2 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
150 3.5<br>VGS = 3.5 V 3.0 PULSE DURATION = 80  � s<br>120 DUTY CYCLE = 0.5% MAX<br>VGS = 10 V VGS = 3 V<br>90 VVGSGS = 4 V = 4.5 V 2.5 VGS = 3.5 V<br>2.0<br>60 VGS = 3 V VGS = 4 V<br>1.5<br>30 VGS = 4.5 V<br>1.0<br>PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX � s VGS = 10 V<br>0 0.5<br>0.0 0.5 1.0 1.5 2.0 0 30 60 90 120 150<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 10<br>1.5 ID = 21 A ID = 21 A PULSE DURATION = 80  � s<br>VGS = 10 V DUTY CYCLE = 0.5% MAX<br>1.4 8<br>1.3<br>6<br>1.2<br>1.1 TJ = 125  [o] C<br>4<br>1.0<br>0.9<br>2<br>0.8 TJ = 25  [o] C<br>0.7 0<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>150 200<br>PULSE DURATION = 80 �� s 100 VGS = 0 VGS = 0 V= 0 V<br>DUTY CYCLE = 0.5% MAX<br>120<br>10<br>VDS = 5 V<br>TJ = 125 J = 125  = 125  [[o]] C<br>90<br>1<br>TJ = 125  [o] C<br>60 0.1 TJ = 25 J = 25  = 25  [[o]] C<br>TJ = 25  [o] C<br>30 0.01 TJ = -55J = -55 = -55 [[ o]] C<br>TJ = -55 [ o] C<br>0 0.001<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)SD, BODY DIODE FORWARD VOLTAGE (V), BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>DRAIN CURRENT (A)<br>ID,<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>�<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>ISS<br>**----- End of picture text -----**<br>


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200<br>100 VGS = 0 VGS = 0 V= 0 V<br>10<br>TJ = 125 J = 125  = 125  [[o]] C<br>1<br>TJ = 25 J = 25  = 25  [[o]] C<br>0.1<br>0.01 TJ = -55J = -55 = -55 [[ o]] C<br>0.001<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, BODY DIODE FORWARD VOLTAGE (V)SD, BODY DIODE FORWARD VOLTAGE (V), BODY DIODE FORWARD VOLTAGE (V)<br>Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>, REVERSE DRAIN CURRENT (A)<br>ISS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

www.fairchildsemi.com 

**3** 

FDMS7670AS Rev.C2 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
10<br>ID = 21 A<br>8<br>VDD = 10 V VDD = 20 V<br>6<br>VDD = 15 V<br>4<br>2<br>0<br>0 10 20 30 40 50<br>Qg, GATE CHARGE (nC)<br>Figure 7.  Gate Charge Characteristics<br>40<br>TJ = 25 [ o] C<br>10<br>TJ = 100  [o] C<br>TJ = 125  [o] C<br>1<br>0.01 0.1 1 10 100 300<br>tAV, TIME IN AVALANCHE (ms)<br>Figure 9. Unclamped Inductive<br>Switching Capability<br>200<br>100 100  � s<br>1 ms<br>10<br>10 ms<br>1 THIS AREA IS  100 ms<br>LIMITED BY r<br>DS(on)<br>1 s<br>SINGLE PULSE<br>0.1 TJ = MAX RATED 10 s<br>R � JA = 125  [o] C/W DC<br>TA = 25  [o] C<br>0.01<br>0.01 0.1 1 10 100 200<br>VDS, DRAIN to SOURCE VOLTAGE (V)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>D<br> I<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 11.  Forward Bias Safe<br>Operating Area<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
5000<br>Ciss<br>Coss<br>1000<br>Crss<br>100 f = 1 MHz<br>VGS = 0 V<br>60<br>0.1 1 10 30<br>VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>120<br>VGS = 10 V<br>90<br>VGS = 4.5 V<br>60<br>30<br>Limited by Package R � JC = 1.9 oC/W<br>0<br>25 50 75 100 125 150<br>TC, CASE TEMPERATURE (oC)<br>Figure 10.  Maximum Continuous Drain<br>Current  vs Case Temperature<br>10000<br>VGS = 10 V<br>1000<br>100<br>10<br>SINGLE PULSE<br>R � JA = 125  [o] C/W<br>1 TA = 25  [o] C<br>0.510-4 10-3 10-2 10-1 1 10 100 1000<br>t, PULSE WIDTH (sec)<br>Figure 12.   Single  Pulse Maximum<br>Power  Dissipation<br>CAPACITANCE (pF)<br> DRAIN CURRENT (A)I,D<br>PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDMS7670AS Rev.C2 

**==> picture [469 x 199] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1<br>      0.05<br>      0.02<br>      0.01 PDM<br>0.01<br>t1<br>t2<br>0.001 NOTES:<br>SINGLE PULSE DUTY FACTOR: D = t1/t2<br>R � JA = 125 [ o] C/W PEAK TJ = PDM x Z �JA  x R �JA  + TA<br>0.0001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>ZJA �<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**Figure 13.  Junction-to-Ambient Transient Thermal Response Curve** 

www.fairchildsemi.com 

**5** 

FDMS7670AS Rev.C2 

## **Typical Characteristics** (continued) 

## **SyncFET Schottky body diode Characteristics** 

Fairchild’s SyncFET process embeds a Schottky diode in parallel with PowerTrench MoSFET. This diode exhibits similar characteristics to a discrete external Schottky diode in parallel with a MOSFET. Figure 14 shows the reverses recovery characteristic of the FDMS7670AS. 

Schottky barrier diodes exhibit significant leakage at high temperature and high reverse voltage. This will increase the power in the device. 

**==> picture [464 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
25 10-2<br>TJ = 125  [o] C<br>20<br>10-3 TJ = 100  [o] C<br>15<br>di/dt = 300 A/ � s<br>10 10-4<br>5 TJ = 25  [o] C<br>10-5<br>0<br>-5 10-6<br>0 30 60 90 120 150 0 5 10 15 20 25 30<br>TIME (ns) VDS, REVERSE VOLTAGE (V)<br>CURRENT (A)<br>, REVERSE LEAKAGE CURRENT (A)<br>IDSS<br>**----- End of picture text -----**<br>


**Figure 14. FDMS7670AS SyncFET body diode reverse recovery characteristic** 

**Figure 15. SyncFET body diode reverses leakage  versus drain-source voltage** 

www.fairchildsemi.com 

**6** 

FDMS7670AS Rev.C2 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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