# Power MOSFET, P Channel, 30 V, 18 A, 0.015 ohm, Power 56, Surface Mount

![Product image](https://novapart.co/image/farnell:2083281/)

**URL**: https://novapart.co/products/FDMS4435BZ/power-mosfet-p-channel-30-v-18-a-0015-ohm-56
**SKU**: FDMS4435BZ
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2570
**Stock**: 1000+
**Lead Time**: 113 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-18A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.015ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1.9V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 39W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | Power 56 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 18A |
| Drain Source On State Resistance | 0.015ohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083281/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## y 4 **FDMS4435BZ** 

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## **P-Channel PowerTrench[®] MOSFET -30 V, -18 A, 20 m** Ω 

## **General Description** 

## **Features** 

Max rDS(on) = 20 mΩ at  VGS = -10 V, ID = -9.0 A Max rDS(on) = 37 mΩ at  VGS = -4.5 V, ID = -6.5 A Extended VGSS range (-25 V) for battery applications 

This P-Channel MOSFET is produced using Fairchild Semiconductor’s advanced  Power  Trench **[®]** process that has been especially tailored to minimize the on-state resistance. This device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs. 

|High performance trench technology for extremely low rDS(on)<br>High power and current handling capability<br>HBM ESD protection level >7 kV typical (Note 4)<br>100% UIL tested<br>Termination is Lead-free and RoHS Compliant<br>**Bottom**<br>**Top**|switching applications common in Notebook Computers and<br>Portable Battery Packs.<br>**Applications**<br>High side in DC-DC Buck Converters<br>Notebook battery power management<br>Load switch in Notebook|switching applications common in Notebook Computers and<br>Portable Battery Packs.<br>**Applications**<br>High side in DC-DC Buck Converters<br>Notebook battery power management<br>Load switch in Notebook|switching applications common in Notebook Computers and<br>Portable Battery Packs.<br>**Applications**<br>High side in DC-DC Buck Converters<br>Notebook battery power management<br>Load switch in Notebook|switching applications common in Notebook Computers and<br>Portable Battery Packs.<br>**Applications**<br>High side in DC-DC Buck Converters<br>Notebook battery power management<br>Load switch in Notebook|switching applications common in Notebook Computers and|switching applications common in Notebook Computers and|switching applications common in Notebook Computers and|switching applications common in Notebook Computers and|switching applications common in Notebook Computers and|switching applications common in Notebook Computers and|
|---|---|---|---|---|---|---|---|---|---|---|
|**Pin 1**<br>**G**<br>**S**<br>**S**<br>**S**<br>**D**<br>**D**<br>**D D**<br>**D**<br>**D**<br>**D**<br>**D**<br>**5**<br>**6**<br>**7**<br>**8**<br>es|||||||**4**<br>**3**<br>**2**<br>**1**|**G**<br>**S**<br>**S**<br>**S**|||
|**Power 56**|||||||||||
|**MOSFET Maximum Ratings  **TA= 25 °C unless otherwise noted|||||||||||
|**Symbol**<br>**Parameter**||||**Ratings**|||||**Units**||
|VDS<br>Drain to Source Voltage||||-30|||||V||
|VGS<br>Gate to Source Voltage|e|||±25|||||V||
|Drain Current   -Continuous(Package limited)T|TC = 25 °C|||-18|||||||
|ID<br>-Continuous(Silicon limited)T<br>-Continuous                                        T|TC = 25 °C<br>-Continuous                                        TA= 25 °C(Note 1a)|||-35<br>-9.0|||||A||
|-Pulsed||||-50|||||||
|EAS<br>Single Pulse Avalanche Energy|(Note 3)|||18|||||mJ||
|PD<br>Power Dissipation                                                   T<br>Power Dissipation                                                        T|ation                                                   TC= 25 °C<br>ation                                                        TA= 25 °C(Note 1a)|||39<br>2.5|||||W||
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||-55 to +150|||||°C||
|**Thermal Characteristics**|||||||||||
|**Package Marking and Ordering Information**<br>RθJC<br>Thermal Resistance, Junction to Case<br>RθJA<br>Thermal Resistance, Junction to Ambient<br>~~[_~~|Thermal Resistance, Junction to Ambient(Note 1a)|||3.2<br>50|||||°C/W||
|**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FDMS4435BZ<br>FDMS4435BZ<br>Power 56<br>13 ’’<br>12 mm<br>3000 units<br>~~[_|}~~<br>~~+}—_~~|||||||||||



www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation **1** FDMS4435BZ Rev.C4 

**Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0 V<br>-30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25 °C<br>-23<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -24 V, VGS = 0 V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±25 V, VDS = 0 V<br>±10<br>μA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= -250μA<br>-1.0<br>-1.9<br>-3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25 °C<br>6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10 V, ID= -9.0 A<br>15<br>20<br>mΩ<br>VGS= -4.5 V, ID= -6.5 A<br>22<br>37<br>VGS= -10 V, ID= -9.0 A<br>TJ = 125 °C<br>21<br>28<br>gFS<br>Forward Transconductance<br>VDS= -5 V, ID= -9.0 A<br>25<br>S<br>Ciss<br>Input Capacitance<br>VDS= -15 V, VGS= 0 V,<br>f = 1 MHz<br>1540<br>2050<br>pF<br>Coss<br>Output Capacitance<br>290<br>390<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>260<br>385<br>pF<br>~~DD~~<br>~~—]fo~~<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0 V<br>-30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25 °C<br>-23<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -24 V, VGS = 0 V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±25 V, VDS = 0 V<br>±10<br>μA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= -250μA<br>-1.0<br>-1.9<br>-3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25 °C<br>6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10 V, ID= -9.0 A<br>15<br>20<br>mΩ<br>VGS= -4.5 V, ID= -6.5 A<br>22<br>37<br>VGS= -10 V, ID= -9.0 A<br>TJ = 125 °C<br>21<br>28<br>gFS<br>Forward Transconductance<br>VDS= -5 V, ID= -9.0 A<br>25<br>S<br>Ciss<br>Input Capacitance<br>VDS= -15 V, VGS= 0 V,<br>f = 1 MHz<br>1540<br>2050<br>pF<br>Coss<br>Output Capacitance<br>290<br>390<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>260<br>385<br>pF<br>~~DD~~<br>~~—]fo~~<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0 V<br>-30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25 °C<br>-23<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -24 V, VGS = 0 V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±25 V, VDS = 0 V<br>±10<br>μA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= -250μA<br>-1.0<br>-1.9<br>-3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25 °C<br>6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10 V, ID= -9.0 A<br>15<br>20<br>mΩ<br>VGS= -4.5 V, ID= -6.5 A<br>22<br>37<br>VGS= -10 V, ID= -9.0 A<br>TJ = 125 °C<br>21<br>28<br>gFS<br>Forward Transconductance<br>VDS= -5 V, ID= -9.0 A<br>25<br>S<br>Ciss<br>Input Capacitance<br>VDS= -15 V, VGS= 0 V,<br>f = 1 MHz<br>1540<br>2050<br>pF<br>Coss<br>Output Capacitance<br>290<br>390<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>260<br>385<br>pF<br>~~DD~~<br>~~—]fo~~<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~|
|---|---|---|
|Rg<br>Gate Resistance|5<br>Ω||
|**Switching Characteristics**|||
|td(on)<br>Turn-On DelayTime<br>tr<br>Rise Time<br>td(off)<br>Turn-Off DelayTime<br>tf<br>Fall Time<br>Qg<br>Total Gate Charge<br>Qg<br>Total Gate Charge<br>Qgs<br>Gate to Source Charge<br>Qgd<br>Gate to Drain “Miller” Charge<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|VDD= -15 V, ID= -9.0 A,<br>VGS= -10 V, RGEN= 6Ω<br>9<br>17<br>ns<br>10<br>18<br>ns<br>35<br>56<br>ns<br>19<br>33<br>ns<br>VGS= 0 V to -10 V<br>VDD= -15 V,<br>ID= -9.0 A<br>34<br>47<br>nC<br>VGS= 0 V to -4.5 V<br>18<br>25<br>nC<br>5<br>nC<br>9<br>nC<br>~~ee ee ee~~<br>~~ee~~<br>~~po |~~<br>~~po |~~<br>~~ee ee ee eee~~<br>~~po |~~<br>~~po |~~<br>~~ee ee ee ee~~<br>~~ee ee ee ee~~||
|**Drain-Source Diode Characteristics**|||
|VSD<br>Source to Drain Diode Forward Voltage|VGS = 0 V, IS = -1.9 A(Note 2)<br>0.75<br>1.2<br>V<br>VGS = 0 V, IS = -9.0 A(Note 2)<br>0.86<br>1.5||
|trr<br>Reverse RecoveryTime<br>Qrr<br>Reverse RecoveryCharge|IF= -9.0 A, di/dt = 100 A/μs<br>25<br>39<br>ns<br>12<br>21<br>nC||



Notes **:** 1. RθJA is determined with the device mounted on a 1 in[2] pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a) 50 °C/W when mounted  on  a b) 125 °C/W when mounted 1 in[2 ] pad of  2 oz  copper on a minimum pad of 2 oz copper. 

2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 

3. EAS of 18 mJ is based on starting TJ = 25 °C, L = 1 mH, IAS = -6 A, VDD = -27 V, VGS = -10 V. 100% tested at  L = 0.3 mH, IAS = -8 A. 

4. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. 

©2011 Fairchild Semiconductor Corporation FDMS4435BZ Rev.C4 

**2** 

www.fairchildsemi.com 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [471 x 582] intentionally omitted <==**

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50 4.0<br>VGS = -10 V VGS = -3.5 V<br>40 V GS  = -6 V 3.5 V GS  = -4 V<br>VGS =  -4.5 V 3.0 PULSE DURATION = 80  μ s<br>30 VGS = -4 V DUTY CYCLE = 0.5% MAX VGS = -4.5 V<br>2.5<br>20 2.0<br>VGS = -3.5 V 1.5 VGS = -6 V<br>10<br>PULSE DURATION = 80DUTY CYCLE = 0.5% MAX  μ s 1.0 VGS = -10 V<br>0 0.5<br>0 1 2 3 4 0 10 20 30 40 50<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 80<br>IVDGS = - 9 A = -10 V ID = -9 A PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX μ s<br>1.4<br>60<br>1.2<br>40<br>1.0 TJ = 125  [o] C<br>20<br>0.8 TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>50 50<br>PULSE DURATION = 80  μ s VGS = 0 V<br>DUTY CYCLE = 0.5% MAX 10<br>40<br>VDS = -5 V<br>1 T J  = 125  [o] C<br>30<br>TJ = 125 [ o] C 0.1 T J  = 25  [o] C<br>20<br>TJ = 25  [o] C TJ = -55  [o] C<br>10 0.01<br>TJ = -55  [o] C<br>0 0.001<br>1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I , REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDMS4435BZ Rev.C4 

**3** 

www.fairchildsemi.com 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [471 x 578] intentionally omitted <==**

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10 5000<br>ID = -9 A<br>8 C iss<br>VDD = -10 V<br>6 1000<br>VDD = -15 V<br>4 C oss<br>VDD = -20 V<br>2 f = 1 MHz Crss<br>VGS = 0 V<br>0 100<br>0 8 16 24 32 40 0.1 1 10 30<br>Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>20 40<br>32<br>10<br>VGS = -10 V<br>TJ = 25 [ o] C 24<br>TJ = 100 [ o] C 16<br>TJ = 125  [o] C Package Limited VGS = -4.5 V<br>8<br>R θ JC = 3.2  [o] C/W<br>1 0<br>0.01 0.1 1 10 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE ( [o] C)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current vs Cate Temperature<br>10-1 100<br>10-2 VGS = 0 V<br>100  μ s<br>10-3<br>10<br>10-4 1 ms<br>10-5 TJ = 125 [ o] C 1 THIS AREA IS  10 ms<br>-6 100 ms<br>10 LIMITED BY rDS(on)<br>10-7 TJ = 25  [o] C SINGLE PULSE 1 s<br>10-8 0.1 RTJ θ J=A = 125 MAX RATED [ o] C/W 10 s<br>10-9 TA = 25 [ o] C DC<br>-10 0.01<br>10 0.05 0.1 1 10 100<br>0 3 6 9 12 15 18 21 24 27 30 33<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 11. Gate Leakage Current vs Gate to                      Figure 12.  Forward Bias Safe<br>Source Voltage Operating Area<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>-V<br>DRAIN CURRENT (A)<br>,<br>D<br>-I<br>, AVALANCHE CURRENT (A)<br>AS<br>-I<br>, DRAIN CURRENT (A)<br>D<br>, GATE LEAKAGE CURRENT (A) -I<br>g<br>-I<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDMS4435BZ Rev.C4 

**4** 

www.fairchildsemi.com 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [469 x 361] intentionally omitted <==**

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1000<br>100<br>10<br>SINGLE PULSE<br>R θ JA  = 125  [o] C/W<br>1 T A  = 25  [o] C<br>0.5<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, PULSE WIDTH (sec)<br>Figure 13.  Single Pulse Maximum Power Dissipation<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>       0.2<br>       0.1<br>0.1        0.05<br>       0.02 PDM<br>       0.01<br>t 1<br>0.01 t2<br>SINGLE PULSE NOTES:<br>R θ JA = 125  [o] C/W DUTY FACTOR: D = tPEAK T J  = P DM  x Z θJA 1 x R/t2 θJA  + T A<br>0.001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 14.  Junction-to-Ambient Transient Thermal Response Curve<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>ZJA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDMS4435BZ Rev.C4 

**5** 

www.fairchildsemi.com 

## **Dimensional Outline and Pad Layout** 

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5.204.80 A 5.103.91<br>8 PKGCL 5 B SEEDETAIL B 8 7 6 0.645 1.27<br>0.77<br>4.52<br>PKG CL 6.255.90 5.855.65 3.75 6.61<br>KEEP OUT<br>AREA<br>1.27<br>1 4<br>1 2 3 4<br>TOP VIEW<br>1.27 0.61<br>3.81<br>LAN D PATTERN<br>OPTIONAL DRAFT REC OM MEND ATION<br>ANGLE MAY APPEAR<br>5.004.80 SEEDETAIL C OF THE PACKAGEON FOUR SIDES<br>0.35<br>0.15<br>0.10 C<br>SIDE VIEW 0.050.00 0.300.06<br>8X<br>0.08 C<br>0.35 C<br>0.15<br>1.10 SEATING<br>0.90 PLANE<br>3.81 DETAIL C DETAIL B<br>SCALE: 2:1 SCALE: 2:1<br>1.27 0.51<br>(0.34) 0 .31 [ (8X)] N OTES: UNLESS OTHERWISE SPECIFIED<br>0.10 C A B    A.  PACKAGE STAND ARD REFERENCE:  JEDEC M O-240,<br>1 2 3 4          ISSUE A, VAR. AA, DATED OCTOBER  2002.<br>   B.  DIMENSIONS DO N OT INCLUDE BURRS OR MOLD FLASH.<br>0.76          MOLD FLASH  OR BURRS DOES NOT EXCEED 0.10MM.<br>0.44 (0.52)    C .  ALL DIMEN SIONS ARE IN MILLIMETERS.<br>   D .  DIMENSIONING AND TOLERANCING PER   ASME Y14.5M-1994.<br>   E.  IT IS RECOMMENDED TO HAVE NO TRACES OR<br>         VIAS WITHIN TH E KEEP  OUT AREA.<br>(0.50)(0.30) 3.783.38 4.223.99    F.  DRAWING FILE NAME: PQFN08AREV8<br>(3.40) (2X )<br>8 7 6 5<br>0.64<br>3 .96 0.34<br>3.61<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: https://www.fairchildsemi.com/evaluate/package-specifications/packageDetails.html?id=PN_PQOAM-008_ 

©2011 Fairchild Semiconductor Corporation FDMS4435BZ Rev.C4 

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**6** 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

|AccuPower™<br>Awinda®<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>®<br>~~-~~|AccuPower™<br>Awinda®<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>®<br>~~-~~|AccuPower™<br>Awinda®<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>®<br>~~-~~|AccuPower™<br>Awinda®<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>®<br>~~-~~|AccuPower™<br>Awinda®<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>®<br>~~-~~|F-PFS™<br>FRFET®<br>Global Power ResourceSM<br>GreenBridge™<br>Green FPS™<br>Green FPS™ e-Series™<br>G_max_™<br>GTO™<br>IntelliMAX™<br>ISOPLANAR™<br>Marking Small Speakers Sound Louder<br>and Better™<br>MegaBuck™<br>MICROCOUPLER™<br>MicroFET™<br>MicroPak™<br>MicroPak2™<br>MillerDrive™<br>MotionMax™<br>MotionGrid®<br>MTi®<br>MTx®<br>MVN®<br>mWSaver®|PowerTrench®<br>PowerXS™<br>Programmable Active Droop™<br>QFET®<br>QS™<br>Quiet Series™<br>RapidConfigure™<br>Saving our world, 1mW/W/kW at a time™<br>SignalWise™<br>SmartMax™<br>SMART START™<br>Solutions for Your Success™<br>SPM®<br>STEALTH™<br>SuperFET®<br>SuperSOT™-3<br>SuperSOT™-6<br>SuperSOT™-8<br>SupreMOS®<br>SyncFET™<br>™<br>tm®<br>we,|®*<br>TinyBoost®<br>TinyBuck®<br>TinyCalc™<br>TinyLogic®<br>TINYOPTO™<br>TinyPower™<br>TinyPWM™<br>TinyWire™<br>TranSiC™<br>TriFault Detect™<br>TRUECURRENT®*<br>μSerDes™<br>UHC®<br>Ultra FRFET™<br>UniFET™<br>VCX™<br>VisualMax™<br>VoltagePlus™<br>XS™<br>[Ecce<br>WZ...|
|---|---|---|---|---|---|---|---|
|FPS™|||||OptoHiT™|Sync-Lock™|Xsens™|
||||||||仙童™|



*Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. TO OBTAIN THE LATEST, MOST UP-TO-DATE DATASHEET AND PRODUCT INFORMATION, VISIT OUR WEBSITE AT HTTP://WWW.FAIRCHILDSEMI.COM. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used here in: 

1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to cause and (c) whose failure to perform when properly used in accordance with the failure of the life support device or system, or to affect its safety or instructions for use provided in the labeling, can be reasonably effectiveness. expected to result in a significant injury of the user. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild<br>Semiconductor. The datasheet is for reference information only.|



Rev. I71 

©2011 Fairchild Semiconductor Corporation 

www.fairchildsemi.com 

**7** 

FDMS4435BZ Rev.C4 

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## Links

- [View this product on Novapart](https://novapart.co/products/FDMS4435BZ/power-mosfet-p-channel-30-v-18-a-0015-ohm-56)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/on-semiconductor/fdms4435bz/mosfet-p-ch-30v-18a-power56/dp/2083281)
---

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