# Power MOSFET, P Channel, 20 V, 8 A, 0.02 ohm, MicroFET, Surface Mount

![Product image](https://novapart.co/image/farnell:3368747RL/)

**URL**: https://novapart.co/products/FDME910PZT/power-mosfet-p-channel-20-v-8-a-002-ohm-microfet
**SKU**: FDME910PZT
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2580
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | P Channel |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Drain Source On State Resistance | 0.02ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368747RL/)

## **FDME910PZT** 

## **P-Channel PowerTrench[®] MOSFET** 

## **-20 V, -8 A, 24 m** Ω 

## **Features** 

Max rDS(on) = 24 mΩ at VGS = -4.5 V, ID = -8 A 

Max rDS(on) = 31 mΩ at VGS = -2.5 V, ID = -7 A 

## **General Description** 

This device is designed specifically for battery charging or load switching in cellular handset and other ultraportable applications. It features a MOSFET with low on-state resistance and zener diode protection against ESD. The MicroFET 1.6x1.6 Thin package offers exceptional thermal performance for its physical size and is well suited to switching and linear mode applications. 

Max rDS(on) = 45 mΩ at VGS = -1.8 V, ID = -6 A 

Low profile: 0.55 mm maximum in the new package MicroFET 1.6x1.6 Thin 

HBM ESD protection level > 2 kV typical (Note 3) 

Free from halogenated compounds and antimony oxides 

RoHS Compliant 

**==> picture [449 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
G<br>D Bottom Drain Contact<br>D S D 1 6 D<br>Pin 1<br>D 2 5 D<br>S<br>D<br>G 3 4 S<br>D<br>oe<br>BOTTOM<br>TOP<br>MicroFET 1.6x1.6 Thin<br>MOSFET Maximum Ratings TA = 25 °C unless otherwise notedA = 25 °C unless otherwise noted= 25 °C unless otherwise noted<br>**----- End of picture text -----**<br>


**MicroFET 1.6x1.6 Thin MOSFET Maximum Ratings** TA = 25 °C unless otherwise notedA = 25 °C unless otherwise noted= 25 °C unless otherwise noted **Symbol Parameter Ratings Units** VDS Drain to Source Voltage -20 V VGS Gate to Source Voltage ±8 V ID -Continuous-Pulsed TA = 25°C              (Note 1a) -32-8 A PD Power DissiPower Dissippation      ation T   TAA = 25°C      = 25°C ((Note 1aNote 1b)) 0.72.1 W ~~—=~~ TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C **Thermal Characteristics** RθJA Thermal Resistance, Junction to Ambient (Note 1a) 60 °C/W ~~ye~~ RθJA Thermal Resistance, Junction to Ambient (Note 1a) 175 ~~_~~ **Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity** E91 FDME910PZT MicroFET 1.6x1.6 Thin 7 ’’ 8 mm 5000 units ~~Ee~~ 

©2012 Semiconductor Components Industries, LLC. October-2017, Rev. 3 

Publication Order Number: FDME910PZT/D 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

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||||||||||
|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min|Typ|Max|Units|
|Off Characteristics|
|BVDSS|Drain to Source Breakdown Voltage|ID = -250 μA, VGS = 0 V|-20|V|
|Δ  ΔBVTDSSJ|Breakdown Voltage TemperatureCoefficient|ID = -250 μA, referenced to 25 °C|-16|mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS = -16 V, VGS|= 0 V|-1|μA|
|Sean|IGSS|Gate to Source Leakage Current|VGS = ±8 V, VDS|= 0 V|±10|μA|
|On Characteristics|
|VGS(th)|Gate to Source Threshold Voltage|VGS = VDS,  ID = -250 μA|-0.4|-0.6|-1.5|V|
|—|Δ  ΔVTGS(tJ|h)|Gate to Source Threshold VoltageTemperature Coefficient|ID = -250 μA, referenced to 25 °C|2.7|mV/°C|
|VGS = -4.5 V, ID = -8 A|20|24|
|VGS = -2.5 V, ID = -7 A|25|31|
|r|Static Drain to Source On Resistance|mΩ|
|DS(on)|VGS = -1.8 V, ID = -6 A|32|45|
|VGS = -4.5 V, ID = -8 A,TJ = 125°C|26|36|
|gFS|Forward Transconductance|VDD = -5 V,  ID = -8 A|38|S|
|Dynamic Characteristics|
|CCiossss|InOutput Caput Capacitancepacitance|Vf = 1 MHzDS = -10 V, VGS = 0 V,|1586236|2110355|ppFF|
|=—————|Crss|Reverse Transfer Capacitance|218|330|pF|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|9|18|ns|
|ttd(or|ff)|Rise TimeTurn-Off Delay Time|VVDDGS = -10 V, I = -4.5 V, RD = -8 A,GEN = 6 Ω|8711|13920|nsns|
|tf|Fall Time|46|74|ns|
|Qg|Total Gate Charge|VGS = -4.5 V, VDD = -10 V,|15|21|nC|
|Qgs|Gate to Source Charge|ID = -8 A|2.2|nC|
|Qgd|Gate to Drain “Miller” Charge|3.6|nC|
|Drain-Source Diode Characteristics|
|VSD|Source to Drain Diode  Forward Voltage|VVGSGS|= 0 V, I= 0 V, ISS|= - 8 A   = -1.8 A        ((Note 2Note 2))|-0.57|-0.7-0.8|-1.2-1.2|VV|
|tQrrrr|Reverse RecoverReverse Recoveryy Char Timege|IF = -8 A, di/dt = 100 A/μs|4.117|1031|nCns|
|Notes:|
|——|1. RθJA is determined with the device mounted on a 1 in|is determined with the device mounted on a 1 in|[[2]]|——|

**----- End of picture text -----**<br>


1. RθJA is determined with the device mounted on a 1 in[[2]] pad 2 oz copper pad on a 1.5 x 1.5  in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a. 60 °C/W when mounted   on a 1 in[2 ] pad of  2 oz  copper. 

b. 175 °C/W when mounted on  a minimum pad of 2 oz copper. 

2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 

3. The diode connected between the gate and source serves only as protection ESD. No gate overvoltage rating is implied. 

**www.onsemi.com** 

**2** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
32 3<br>VGS =  -4.5 V VGS = -1.5 V<br>VGS = -3 V<br>24 VGS = -1.8 V<br>2<br>VGS = -2.5 V<br>16 VGS = -2.5 V<br>VGS =  -1.8 V<br>1<br>8 V GS  = -1.5 V VGS =  -3 V VGS = -4.5 V<br>PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX μ s PULSE DURATION = 80DUTY CYCLE = 0.5% MAX  μ s<br>0 0<br>0 1 2 3 0 8 16 24 32<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.4 120<br>ID = -8 A PULSE DURATION = 80  μ s<br>VGS = -4.5 V DUTY CYCLE = 0.5% MAX<br>1.2 ID = -8 A<br>80<br>1.0<br>TJ = 125  [o] C<br>40<br>0.8<br>TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance    Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>32 100<br>PULSE DURATION = 80  μ s VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>24 V DS  = -5 V 10<br>TJ = 150  [o] C<br>1<br>16 TJ = 150  [o] C TJ = 25 [ o] C<br>0.1<br>TJ = 25  [o] C<br>8 TJ = -55  [o] C<br>0.01<br>TJ = -55  [o] C<br>0 0.001<br>0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>) Ω<br>(m<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I , REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6.    Source to Drain  Diode Forward Voltage vs Source Current** 

**www.onsemi.com** 

**3** 

**Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [471 x 598] intentionally omitted <==**

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4.5 3000<br>ID = -8 A C iss<br>VDD = -8 V<br>3.0 1000<br>VDD = -10 V<br>C oss<br>VDD = -12 V<br>1.5<br>Crss<br>f = 1 MHz<br>VGS = 0 V<br>0.0 100<br>0 4 8 12 16 0.1 1 10 20<br>Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>10-1 50<br>10-2 VDS = 0 V<br>10-3 10<br>10-4<br>10-5 TJ = 125 [ o] C 1 1 ms<br>10-6 THIS AREA IS  10 ms<br>10-7 LIMITED BY r DS(on) 100 ms<br>SINGLE PULSE<br>10-8 0.1 TJ = MAX RATED 1 s<br>10-9 TJ = 25  [o] C R θ JA = 175 [ o] C/W 10 sDC<br>T A = 25  [o] C<br>10-10 0.01<br>0 3 6 9 12 15 0.01 0.1 1 10 100<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 9. Gate Leakage Current   Figure 10.  Forward Bias Safe<br>vs Gate to Source Voltage Operating Area<br>100<br>SINGLE PULSE<br>R θ JA = 175  [o] C/W<br>10 T A  = 25  [o] C<br>1<br>0.1<br>10-3 10-2 10-1 100 101 100 1000<br>t, PULSE WIDTH (sec)<br>Figure 11.  Single Pulse Maximum Power Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>-V<br>, DRAIN CURRENT (A)<br>D<br>-I<br>GATE LEAKAGE CURRENT (A)<br>,<br>g<br>-I<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


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**==> picture [470 x 199] intentionally omitted <==**

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Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>0.1       0.1<br>PDM<br>0.05<br>      0.02<br>      0.01<br>t 1<br>0.01 SINGLE PULSE t 2<br>NOTES:<br>R θ JA = 175  [o] C/W DUTY FACTOR: D = t1/t2<br>(Note 1b) PEAK T J  = P DM  x Z θJA  x R θJA  + T A<br>0.001<br>10-3 10-2 10-1 100 101 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**Figure 12.  Junction-to-Ambient Transient Thermal Response Curve** 

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**5** 

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