# Power MOSFET, N Channel, 20 V, 7 A, 0.019 ohm, µFET, Surface Mount

![Product image](https://novapart.co/image/farnell:2083275/)

**URL**: https://novapart.co/products/FDME410NZT/power-mosfet-n-channel-20-v-7-a-0019-ohm-fet
**SKU**: FDME410NZT
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2240
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 6Pins |
| Channel Type | N Channel |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.1W |
| Rds(On) Test Voltage | 4.5V |
| On Resistance Rds(On) | 0.019ohm |
| Transistor Case Style | µFET |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7A |
| Drain Source On State Resistance | 0.019ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083275/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [58 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
October 2013<br>**----- End of picture text -----**<br>


## 

## **N-Channel PowerTrench[®] MOSFET 20 V, 7 A, 26 m** Ω **Features** 

Max rDS(on) = 26 mΩ at VGS = 4.5 V, ID = 7 A Max rDS(on) = 31 mΩ at VGS = 2.5 V, ID = 6 A Max rDS(on) = 39 mΩ at VGS = 1.8 V, ID = 5 A 

Max rDS(on) = 53 mΩ at VGS = 1.5 V, ID = 4 A 

## **General Description** 

This Single N-Channel MOSFET has been designed using Fairchild Semiconductor’s advanced Power Trench process to optimize the rDS(ON) @ VGS = 1.5 V on special MicroFET leadframe. 

## **Applications** 

> 7 Low profile:  0.55 mm maximum in the new package 7 Li-lon Battery Pack MicroFET 1.6x1.6 **Thin** 

> a Baseband Switch 7a Free from halogenated compounds and antimony oxides Load Switch | HBM ESD protection level > 1800V (Note3) DC-DC Conversion 

RoHS Compliant 

**==> picture [456 x 121] intentionally omitted <==**

**----- Start of picture text -----**<br>
G<br>D<br>Pin 1 D S<br>D D<br>— {> |<br>D D<br>S<br>D<br>D S G eed S<br>BOTTOM<br>TOP<br>**----- End of picture text -----**<br>


## **MicroFET 1.6x1.6 Thin** 

## **MOSFET Maximum Ratings** TA = 25 °C unless otherwise noted 

|**Symbol**|**Parameter**||||**Ratings**|**Ratings**|||**Units**|
|---|---|---|---|---|---|---|---|---|---|
|VDS|Drain to Source Voltage|||||20|||V|
|VGS|Gate to Source Voltage|||||±8|||V|
|ID|Drain Current    -Continuous                                  TA= 25 °C<br>-Pulsed||= 25 °C(Note 1a)|||7<br>15|||A|
|PD|Power Dissipation for Single Operation               TA= 25 °C<br>Power Dissipation for Single Operation               TA= 25 °C||= 25 °C(Note 1a)<br>= 25 °C(Note 1b)|||2.1<br>0.7|||W|
|TJ, TSTG|Operatingand Storage Junction Temperature Range||||-55 to +150|-55 to +150|||°C|
|**Thermal Characteristics**||||||||||
|RθJA|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1a)|||60|||°C/W|
|RθJA|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1b)|||175||||
|**Package Marking and Ordering Information**||||||||||
|**Device Marking**<br>**Device**<br>**Package**|||**Reel Size**||**Tape Width**|||**Quantity**||
|6T|FDME410NZT<br>MicroFET 1.6x1.6**Thin**||7 ’’||8 mm|||5000 units|5000 units|



**1** 

©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|
|---|---|
|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Switching Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250μA, VGS= 0 V<br>20<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250μA, referenced to 25 °C<br>18<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 16  V,  VGS = 0 V<br>1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±8 V, VDS = 0 V<br>±10<br>μA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 250μA<br>0.4<br>0.7<br>1.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250μA, referenced to 25 °C<br>-3<br>mV/°C<br>rDS(on)<br>Drain to Source On Resistance<br>VGS= 4.5 V,  ID= 7 A<br>19<br>26<br>mΩ<br>VGS= 2.5 V,  ID= 6 A<br>20<br>31<br>VGS= 1.8 V,  ID= 5 A<br>24<br>39<br>VGS= 1.5 V,  ID= 4 A<br>31<br>53<br>VGS= 4.5 V,  ID= 7 A ,<br>TJ= 125 °C<br>24<br>36<br>gFS<br>Forward Transconductance<br>VDS= 5 V,  ID= 7 A<br>35<br>S<br>Ciss<br>Input Capacitance<br>VDS= 10 V, VGS= 0 V,<br>f = 1 MHz<br>770<br>1025<br>pF<br>Coss<br>Output Capacitance<br>115<br>155<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>75<br>115<br>pF<br>Rg<br>Gate Resistance<br>1.9<br>Ω<br>~~=~~<br>~~==~~<br>~~i=:~~<br>~~====~~||
|td(on)<br>Turn-On DelayTime<br>VDD= 10 V, ID= 7 A<br>VGS= 4.5 V, RGEN= 6Ω<br>7.3<br>15<br>ns<br>tr<br>Rise Time<br>3.4<br>10<br>ns<br>td(off)<br>Turn-Off DelayTime<br>27<br>43<br>ns||
|tf<br>Fall Time<br>3.2<br>10<br>ns||
|Qg<br>Total Gate Charge<br>VDD= 10 V,  ID= 7 A<br>VGS= 4.5 V<br>9.2<br>13<br>nC<br>Qgs<br>Gate to Source Gate Charge<br>1.1<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>1.6<br>nC||
|**Drain-Source Diode Characteristics**||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0 V, IS = 1.6 A(Note 2)<br>0.7<br>1.2<br>V<br>trr<br>Reverse RecoveryTime<br>IF= 7 A, di/dt = 100 A/μs<br>15<br>27<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>3.5<br>10<br>nC<br>~~———~~||
|**Notes:**||
|1. RθJAis determined with the device mounted on a 1 in2pad 2 oz copper pad on a 1.5 x 1.5  in. board of FR-4 material. RθJCis guaranteed by design while RθCAis determined by||
|the user's board design.||



a. 60 °C/W when mounted   on b. 175 °C/W when mounted on  a a 1 in[2 ] pad of  2 oz  copper. minimum pad of 2 oz copper. 

2. Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%. 

3. The diode connected between the gate and source serves only as protection ESD. No gate overvoltage rating is implied. 

©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

www.fairchildsemi.com 

**2** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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15 2.5<br>VGS = 4.5 V PULSE DURATION = 80  μ s<br>VGS =  3 V DUTY CYCLE = 0.5% MAX<br>2.0<br>10 VGS =1.5 V<br>VGS =  2.5 V VGS = 1.8 V<br>1.5<br>VGS = 1.8 V VGS = 2.5 V<br>5<br>VGS = 1.5 V 1.0<br>PULSE DURATION = 80  μ s VGS = 3 V VGS =  4.5 V<br>DUTY CYCLE = 0.5% MAX<br>0 0.5<br>0.0 0.2 0.4 0.6 0.8 1.0 0 5 10 15<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 100<br>ID = 7 A PULSE DURATION = 80  μ s<br>VGS = 4.5 V DUTY CYCLE = 0.5% MAX<br>1.4 80<br>ID = 7 A<br>1.2 60<br>TJ = 125  [o] C<br>1.0 40<br>0.8 20<br>TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.  On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>15 20<br>PULSE DURATION = 80  μ s 10 VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>VDS = 5 V<br>10 1 TJ = 150  [o] C<br>TJ = 150  [o] C<br>0.1 TJ = 25 [ o] C<br>5<br>TJ = 25  [o] C 0.01<br>TJ = -55  [o] C<br>TJ = -55  [o] C<br>0 0.001<br>0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source  to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

www.fairchildsemi.com 

**3** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
4.5 5000<br>ID = 7 A<br>VDD = 8 V<br>Ciss<br>1000<br>3.0 VDD = 10 V Coss<br>100 Crss<br>1.5<br>VDD = 12 V<br>f = 1 MHz<br>VGS = 0 V<br>0.0 10<br>0 2 4 6 8 10 0.01 0.1 1 10 20<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance   vs  Drain<br>to Source Voltage<br>-1 20<br>10<br>10-2 VDS = 0 V 10 100 us<br>10-3 1 ms<br>10-4 1<br>10 ms<br>10-5 TJ = 125 [ o] C THIS AREA IS<br>LIMITED BY r<br>10-6 DS(on) 100 ms<br>0.1 SINGLE PULSE<br>1010-7-8 TJ = 25  [o] C TRJ θ JA= MAX RATED= 175 [ o] C/W 1 sDC10 s<br>T A = 25  [o] C<br>-9 0.01<br>10<br>0 3 6 9 12 15 0.01 0.1 1 10 100<br>VGS, GATE TO SOURCE VOLTAGE (V) VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 10.  Forward Bias Safe Operating Area<br>Figure 9.  Gate  Leakage Current vs<br>Gate to Source Voltage<br>300<br>SINGLE PULSE<br>100 R θ JA = 175  [o] C/W<br>TA = 25  [o] C<br>10<br>1<br>0.5<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, PULSE WIDTH (sec)<br>Figure 11.  Single Pulse Maximum Power Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>GATE LEAKAGE CURRENT (A)<br>,<br>Ig<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

**4** 

**==> picture [453 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>0.1       0.2<br>      0.1 PDM<br>      0.05<br>      0.02<br>      0.01 t1<br>0.01 t2<br>SINGLE PULSE NOTES:<br>R θ JA =175  [o] C/W DUTY FACTOR: D = t PEAK TJ = PDM x Z θJA 1  x R /t2 θJA  + TA<br>0.001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>ZJA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


**Figure 12.  Junction-to-Ambient Transient Thermal Response Curve** 

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5<br>**----- End of picture text -----**<br>


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www.fairchildsemi.com<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

## **Dimensional Outline and Pad Layout** 

©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

www.fairchildsemi.com 

**6** 

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Rev. I66 

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©2011 Fairchild Semiconductor Corporation FDME410NZT Rev.C3 

**7** 

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