# Power MOSFET, N Channel, 30 V, 20 A, 8500 µohm, MLP, Surface Mount

![Product image](https://novapart.co/image/farnell:2083261/)

**URL**: https://novapart.co/products/FDMC7696/power-mosfet-n-channel-30-v-20-a-8500-ohm-mlp
**SKU**: FDMC7696
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3510
**Stock**: 1000+
**Lead Time**: 148 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:20A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0085ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V;

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 25W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | MLP |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 20A |
| Drain Source On State Resistance | 8500µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083261/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FDMC7696** 

## **N-Channel PowerTrench[®] MOSFET 30 V, 12 A, 11.5 m** Ω 

## **Features** 

Max rDS(on) = 11.5 mΩ at  VGS = 10 V, ID = 12 A Max rDS(on) = 14.5 mΩ at  VGS = 4.5 V, ID = 10 A High performance technology for extremely low rDS(on) Termination is Lead-free and RoHS Compliant 

## **General Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced Power Trench **[®]** process that has been especially tailored to minimize the on-state resistance.This device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs. 

## **Applications** 

DC/DC Buck Converters 

Notebook battery power management Load Switch in Notebook 

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Top Bottom<br>D D D D<br>8 7 6 5<br>D 5 4 G<br>D 6 3 S<br>D 7 2 S<br>D 8 1 S<br>alind 1 2 3 4 G S S S Pin 1<br>MLP 3.3x3.3<br>**----- End of picture text -----**<br>


**MOSFET Maximum Ratings** TA = 25 °C unless otherwise noted 

|**MOSFET Maximum Ratings**|**MOSFET Maximum Ratings  **TA = 25 °C unless otherwise notedA = 25 °C unless otherwise noted= 25 °C unless otherwise noted|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Ratings**|**Units**|
|VDS|Drain to Source Voltage|30|V|
|VDSt|Drain to Source Transient Voltage(tTransient< 100 ns)|33|V|
|VGS|Gate to Source Voltage<br> (Note 4)|±20|V|
|ID|Drain Current   -Continuous(Package limited)TC = 25°C|20|A|
||-Continuous(Silicon limited)TC = 25°C|38||
||-Continuous<br>TA= 25°C(Note 1a)|12||
||-Pulsed|50||
|EAS|Single Pulse Avalanche Energy<br> (Note 3)|21|mJ|
|PD|Power Dissipation<br>TC= 25°C|25|W|
||Power Dissipation<br>TA= 25°C<br> (Note 1a)|2.4||
|TJ, TSTG|Operatingand Storage Junction Temperature Range|-55 to +150|°C|



**Device Marking Device Package Reel Size Tape Width Quantity** FDMC7696 FDMC7696 MLP 3.3x3.3 13 ’’ 12 mm 3000 units ~~ee~~ 

©2011 Fairchild Semiconductor Corporation **1** FDMC7696 Rev.C12 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|**Electrical Characteristics**TJ = 25 °C unless otherwise notedJ = 25 °C unless otherwise noted= 25 °C unless otherwise noted|
|---|---|---|---|---|---|
|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250 μA, VGS= 0 V<br>30<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250 μA, referenced to 25 °C<br>14<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 24 V, VGS = 0 V<br>1<br>μA<br>IGSS<br>Gate to Source Leakage Current, Forward<br>VGS= 20 V, VDS = 0 V<br>100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250 μA<br>1.2<br>2.0<br>3.0<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250 μA, referenced to 25 °C<br>-6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 12 A<br>8.5<br>11.5<br>mΩ<br>VGS= 4.5 V, ID= 10 A<br>11.5<br>14.5<br>VGS= 10 V, ID= 12 A,<br>TJ = 125 °C<br>11.6<br>15.7<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 12 A<br>45<br>S<br>Ciss<br>Input Capacitance<br>VDS= 15 V, VGS= 0 V,<br>f = 1 MHz<br>1075<br>1430<br>pF<br>Coss<br>Output Capacitance<br>380<br>505<br>pF<br>~~a~~<br>~~—fT~~<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~||||||
|Crss<br>Reverse Transfer Capacitance||40<br>55||pF||
|Rg<br>Gate Resistance||0.2<br>1.0<br>2.0||Ω||
|**Switching Characteristics**||||||
|td(on)<br>Turn-On DelayTime<br>tr<br>Rise Time<br>td(off)<br>Turn-Off DelayTime<br>tf<br>Fall Time<br>Qg<br>Total Gate Charge<br>Qg<br>Total Gate Charge<br>Qgs<br>Gate to Source Charge<br>Qgd<br>Gate to Drain “Miller” Charge<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~||VDD= 15 V, ID= 12 A,<br>VGS= 10 V, RGEN= 6 Ω<br>9<br>18<br>2<br>10<br>19<br>33<br>2<br>10<br>VGS= 0 V to 10 V<br>VDD= 15 V,<br>ID= 12 A<br>16<br>22<br>VGS= 0 V to 5 V<br>8<br>11<br>3.2<br>1.8<br>~~ee ee eee ~~<br>~~ee ee~~<br>~~ee ~~<br>~~ee ee~~<br>~~ee ~~<br>~~ee ee~~<br>~~ee ~~<br>~~ee ee ee ~~<br>~~ee ee~~<br>~~ee ~~<br>~~ee ee~~<br>~~ee ~~<br>~~ee ee ee ~~|<br> <br> <br> <br> <br> <br> <br>|ns<br>ns<br>ns<br>ns<br>nC<br>nC<br>nC<br>nC<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~<br> ~~ee~~||
|**Drain-Source Diode Characteristics**||||||
|VSD<br>Source to Drain Diode  Forward Voltage||VGS = 0 V, IS = 1.9 A(Note 2)<br>0.75<br>1.2<br>VGS = 0 V, IS = 12 A(Note 2)<br>0.84<br>1.2||V||
|trr<br>Reverse RecoveryTime<br>Qrr<br>Reverse RecoveryCharge||IF= 12 A, di/dt = 100 A/μs<br>25<br>40<br>9<br>18||ns<br>nC||



Notes **:** 

1. RθJA is determined with the device mounted on a 1 in[2] pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. 

a. 53 °C/W when mounted  on a b. 125 °C/W when mounted on  a 1 in[2 ] pad of  2 oz  copper. minimum pad of 2 oz copper. 

2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 

3. EAS of 21 mJ is based on starting TJ = 25 °C, L = 0.3 mH, IAS = 12 A, VDD = 27 V, VGS = 10 V. 

4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied. 

©2011 Fairchild Semiconductor Corporation FDMC7696 Rev.C12 

www.fairchildsemi.com 

**2** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

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**----- Start of picture text -----**<br>
50 6<br>VGS =  10 V VGS = 4.0 V 5 VGS = 3.5 V PULSE DURATION = 80DUTY CYCLE = 0.5% MAX  μ s<br>40<br>VGS = 6 V 4<br>30<br>VGS = 4.5 V 3 VGS = 4.0 V<br>20<br>2 V GS  = 4.5 V<br>VGS = 3.5 V<br>10<br>1<br>PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX μ s VGS = 6 V VGS = 10 V<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 0 10 20 30 40 50<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 40<br>ID = 12 A PULSE DURATION = 80  μ s<br>VGS = 10 V 35 DUTY CYCLE = 0.5% MAX<br>1.4 30 ID = 12 A<br>25<br>1.2<br>20<br>1.0<br>15 T J  = 125  [o] C<br>10<br>0.8<br>5 TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>50 100<br>PULSE DURATION = 80  μ s VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>40 10<br>VDS = 5 V<br>TJ = 150  [o] C<br>30 1<br>TJ = 150  [o] C TJ = 25 [ o] C<br>20 0.1<br>TJ = 25  [o] C<br>TJ = -55  [o] C<br>10 0.01<br>TJ = -55  [o] C<br>0 0.001<br>1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6. Forward Voltage vs Source Current** 

©2011 Fairchild Semiconductor Corporation FDMC7696 Rev.C12 

www.fairchildsemi.com 

**3** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [472 x 612] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 3000<br>ID = 12 A<br>8 1000<br>Ciss<br>VDD = 10 V<br>6 VDD = 15 V<br>Coss<br>VDD = 20 V<br>4 100<br>2<br>f = 1 MHz Crss<br>VGS = 0 V<br>0 10<br>0 4 8 12 16 0.1 1 10 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>40 40<br>VGS = 10 V<br>30<br>TJ = 25 [ o] C<br>10<br>VGS = 4.5 V<br>20<br>T J  = 125  [o] C TJ = 100 [o] C<br>Limited by Package<br>10<br>R θ JC = 5.0  [o] C/W<br>1 0<br>0.001 0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10. Maximum Continuous Drain<br>Switching Capability Current  vs Case Temperature<br>100 1000<br>10 100  μ s<br>100<br>1 ms<br>1 THIS AREA IS<br>LIMITED BY rDS(on) 10 ms 10<br>100 ms<br>SINGLE PULSE<br>0.1 TJ = MAX RATED 1 s SINGLE PULSE<br>RT A θ JA= 25 = 125 [o] C [ o] C/W 10 sDC 1 TRA θ JA = 25 = 125  [o] C [o] C/W<br>0.010.01 0.1 1 10 100200 0.510-4 10-3 10-2 10-1 1 10 100 1000<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                        Figure 12.  Single  Pulse Maximum<br>Operating Area  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDMC7696 Rev.C12 

www.fairchildsemi.com 

**4** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [470 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>0.1       0.1<br>0.05 PDM<br>      0.02<br>      0.01<br>t 1<br>0.01 SINGLE PULSE t2<br>NOTES:<br>R θ JA = 125  [o] C/W DUTY FACTOR: D = t1/t2<br>PEAK T J  = P DM  x Z θJA  x R θJA  + T A<br>0.001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Junction-to-Ambient Transient Thermal Response Curve<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


©2011 Fairchild Semiconductor Corporation FDMC7696 Rev.C12 

www.fairchildsemi.com 

**5** 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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