# Power MOSFET, P Channel, 60 V, 5.7 A, 0.084 ohm, Power 33, Surface Mount

![Product image](https://novapart.co/image/farnell:1495169/)

**URL**: https://novapart.co/products/FDMC5614P/power-mosfet-p-channel-60-v-57-a-0084-ohm-33
**SKU**: FDMC5614P
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5870
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 2.1W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.084ohm |
| Transistor Case Style | Power 33 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 5.7A |
| Drain Source On State Resistance | 0.084ohm |
| Gate Source Threshold Voltage Max | 1.95V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1495169/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FDMC5614P P-Channel PowerTrench[®] MOSFET** 

**-60V, -13.5A, 100m** Ω **Features** 

Max rDS(on) = 100mΩ at VGS = -10V, ID = -5.7A 

Max rDS(on) = 135mΩ at VGS = -4.5V, ID = -4.4A Low gate charge Fast switching speed 

## **General Description** 

This P-Channel MOSFET is a rugged gate version of Fairchild Semiconductor's advanced PowerTrench **[®]** process. It has been optimized for power management applications requiring a wide range of gate drive voltage ratings (4.5V-20V). 

**==> picture [487 x 513] intentionally omitted <==**

**----- Start of picture text -----**<br>
High performance trench technology for extremely low rDS(on) Application<br>High power and current handling capability<br>Power management<br>RoHS Compliant  Load switch<br>Battery protection<br>Top Bottom D 5 4 G<br>Pin 1<br>G D 6 3 S<br>S<br>S<br>S<br>D 7 2 S<br>D D D 8 1 S<br>D<br>oe D<br>MLP 3.3x3.3<br>MOSFET Maximum Ratings TA = 25°C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDS Drain to Source Voltage  -60 V<br>VGS Gate to Source Voltage ±20 V<br>Drain Current   -Continuous (Package limited)           TC = 25°C -13.5<br>ID                             -Continuous                                            T                         -Continuous (Silicon limited)               TA C = 25°C          = 25°C (Note 1a) -5.7-14 A<br>                         -Pulsed -23<br>PD Power Dissipation                                                               TPower Dissipation                                                        TCA = 25°C = 25°C         (Note 1a) 2.142 W<br>TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C<br>Thermal Characteristics<br>RθJC Thermal Resistance, Junction to Case 3.0<br>°C/W<br>— RθJA Thermal Resistance, Junction to Ambient                                                (Note 1a) 60<br>Package Marking and Ordering Information<br>Device Marking Device Package Reel Size Tape Width Quantity<br>5614P FDMC5614P Power 33 7’’ 8mm 3000 units<br>©2010 Fairchild Semiconductor Corporation 1<br>FDMC5614P Rev.C2<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

|**Electrical Characteristics**TJ= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0V<br>-60<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25°C<br>-54<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -48V, VGS= 0V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS= 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= -250μA<br>-1<br>-1.95<br>-3<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25°C<br>4.7<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10V,  ID= -5.7A<br>84<br>100<br>mΩ<br>VGS= -4.5V,   ID= -4.4A<br>108<br>135<br>VGS= -10V,  ID= -5.7A , TJ= 125°C<br>140<br>168<br>gFS<br>Forward Transconductance<br>VDS= -15V,  ID= -5.7A<br>11<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= -30V, VGS= 0V,<br>f = 1MHz<br>795<br>1055<br>pF<br>Coss<br>Output Capacitance<br>140<br>185<br>pF<br>~~**a**~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Electrical Characteristics**TJ= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0V<br>-60<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25°C<br>-54<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -48V, VGS= 0V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS= 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= -250μA<br>-1<br>-1.95<br>-3<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25°C<br>4.7<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10V,  ID= -5.7A<br>84<br>100<br>mΩ<br>VGS= -4.5V,   ID= -4.4A<br>108<br>135<br>VGS= -10V,  ID= -5.7A , TJ= 125°C<br>140<br>168<br>gFS<br>Forward Transconductance<br>VDS= -15V,  ID= -5.7A<br>11<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= -30V, VGS= 0V,<br>f = 1MHz<br>795<br>1055<br>pF<br>Coss<br>Output Capacitance<br>140<br>185<br>pF<br>~~**a**~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Electrical Characteristics**TJ= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= -250μA, VGS= 0V<br>-60<br>V<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= -250μA, referenced to 25°C<br>-54<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= -48V, VGS= 0V<br>-1<br>μA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS= 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= -250μA<br>-1<br>-1.95<br>-3<br>V<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= -250μA, referenced to 25°C<br>4.7<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= -10V,  ID= -5.7A<br>84<br>100<br>mΩ<br>VGS= -4.5V,   ID= -4.4A<br>108<br>135<br>VGS= -10V,  ID= -5.7A , TJ= 125°C<br>140<br>168<br>gFS<br>Forward Transconductance<br>VDS= -15V,  ID= -5.7A<br>11<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= -30V, VGS= 0V,<br>f = 1MHz<br>795<br>1055<br>pF<br>Coss<br>Output Capacitance<br>140<br>185<br>pF<br>~~**a**~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|---|---|---|
|Crss<br>Reverse Transfer Capacitance|60<br>90|pF|
|**Switching Characteristics**|||
|td(on)<br>Turn-On DelayTime<br>tr<br>Rise Time<br>td(off)<br>Turn-Off DelayTime|VDD= -30V, ID= -1A<br>VGS= -10V, RGEN= 6Ω<br>10<br>21<br>11<br>23<br>32<br>65|ns<br>ns<br>ns|
|tf<br>Fall Time|11<br>22|ns|
|Qg(TOT)<br>Total Gate Charge at 10V|VGS= -10V<br>15<br>20|nC|
|Qgs<br>Gate to Source Gate Charge<br>Qgd<br>Gate to Drain “Miller” Charge|VDD= -30V<br>ID= -5.7A<br>1.6<br>2.1<br>2.7<br>3.5|nC<br>nC|
|**Drain-Source Diode Characteristics**|||
|VSD<br>Source to Drain Diode  Forward Voltage|VGS = 0V, IS = -3.2A<br>-0.8<br>-1.2|V|
|trr<br>Reverse RecoveryTime<br>Qrr<br>Reverse RecoveryCharge|IF= -3.2A, di/dt = 100A/μs<br>36<br>29|ns<br>nC|



- **Notes: 1:** RθJA is determined with the device mounted on a 1 in[2] oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθJA is determined by the user's board design. 

- RθJA = 60°C/W when mounted on a 1 in[2] pad of 2 oz copper, 1.5’x1.5’x0.062’ thick PCB. 

- RθJA = 135°C/W when mounted on a minimum pad of 2 oz copper. 

> a. 60°C/W when mounted  on ale b.135°C/W when mounted on  a a 1 in[2 ] pad of  2 oz  copper minimum pad of 2 oz copper 

- **2:** Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%. 

www.fairchildsemi.com 

**2** 

FDMC5614P Rev.C2 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

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25 2.0<br>VGS = -10V VGS = -3.0V PULSE DURATION = 300 μ s<br>1.8 DUTY CYCLE = 2.0%MAX<br>20 VGS =  -5V<br>VGS = -4.5V<br>1.6 VGS = -3.5V<br>15<br>VGS =  -3.5V 1.4 VGS = -5V<br>10<br>VGS = -3.0V 1.2 VGS = -4.5V<br>5 1.0 VGS = -10V<br>PULSE DURATION = 300 μ s<br>DUTY CYCLE = 2.0%MAX<br>0 0.8<br>0 1 2 3 4 5 0 5 10 15 20 25<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT(A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>2.0 350<br>1.8  ID = -5.7A ID = -5.7A PULSE DURATION =300DUTY CYCLE = 2.0%MAX μ s<br>VGS = -10V 300<br>1.6<br>250<br>1.4<br>1.2 200<br>TJ = 125 [o] C<br>1.0<br>150<br>0.8<br>100<br>0.6 TJ = 25 [o] C<br>0.4 50<br>-50 -25 0 25 50 75 100 125 150 2 3 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>30<br>30<br>PULSE DURATION = 300 μ s 10 VGS = 0V<br>25 DUTY CYCLE = 2.0%MAX<br>VDD = -5V 1 TJ = 125 [o] C<br>20<br>0.1<br>15 TJ = 25 [o] C<br>10 0.01<br>TJ = 125 [o] C TJ = 25 [o] C<br>5 1E-3<br>TJ =-55 [o] C TJ = -55 [o] C<br>0 1E-4<br>0 1 2 3 4 5 6 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>mOHM<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>I-D<br>, REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDMC5614P Rev.C2 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [472 x 574] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 2000<br>ID = -5.7A 1000<br>8 VDD = -20V Ciss<br>6<br>VDD = -30V<br>100<br>4 Coss<br>VDD = -40V<br>2 Crss<br>f = 1MHz<br>VGS = 0V<br>0 10<br>0 4 8 12 16 0.1 1 10 60<br>Qg, GATE CHARGE(nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>8 60<br>7  rDS(on) LIMITED<br>6 10 100us<br>5<br>4 1ms<br>1<br>TJ = 25 [o] C 10ms<br>3<br>100ms<br>0.1<br>1s<br>2 SINGLE PULSE<br>10s<br>TJ = MAX RATED<br>TJ = 125 [o] C 0.01 R θ JA = 135 [o] C/W DC<br>TA = 25 [o] C<br>1 1E-3<br>0.01 0.1 1 10 100 0.1 1 10 100 200<br>tAV, TIME IN AVALANCHE(ms) -VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Forward Bias Safe<br>Switching Capability Operating Area<br>1000<br>VGS = -10V TA = 25 [o] C<br>FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>100 CURRENT AS FOLLOWS:<br>I = I25  ---------------------- 150125 – TA -<br>10<br>SINGLE PULSE<br>1 R θ JA = 135oC/W<br>0.5<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, PULSE WIDTH (s)<br>Figure 11.  Single  Pulse Maximum Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>-V<br>, DRAIN CURRENT (A)<br>D<br>-I<br>, AVALANCHE CURRENT(A)<br>IAS-<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDMC5614P Rev.C2 

**==> picture [469 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>1<br>DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1 PDM<br>      0.05<br>      0.02<br>      0.01 t1<br>0.01 t2<br>NOTES:<br>Z θJA (t) = r(t) x R θJA<br>SINGLE PULSE R θJA  = 135 °C/W<br>Peak TJ = PDM x Z θJA (t) + TA<br>0.001 Duty Cycle, D = t1 / t2<br>0.0005<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 12.  Transient Thermal Response Curve<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**5** 

FDMC5614P Rev.C2 

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