# Power MOSFET, N Channel, 220 V, 7 A, 0.366 ohm, MLP, Surface Mount

![Product image](https://novapart.co/image/farnell:2825162RL/)

**URL**: https://novapart.co/products/FDMC2674/power-mosfet-n-channel-220-v-7-a-0366-ohm-mlp
**SKU**: FDMC2674
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6350
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:7A; Drain Source Voltage Vds:220V; On Resistance Rds(on):0.305ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.4V; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | UltraFET Trench |
| Qualification | - |
| Power Dissipation | 42W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | MLP |
| Drain Source Voltage Vds | 220V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7A |
| Drain Source On State Resistance | 0.366ohm |
| Gate Source Threshold Voltage Max | 3.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2825162RL/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [78 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
September 2014<br>**----- End of picture text -----**<br>


**FDMC2674 N-Channel UltraFET Trench MOSFET 220V, 7.0A, 366m** Ω **Features General Description** Max rDS(on) = 366mΩ at VGS = 10V, ID = 1.0A UltraFET device combines characteristics that enable Typ Qg = 12.7nC at  VGS = 10V benchmark efficiency in power conversion applications. Optimized for rDS(on), low ESR, low total and Miller gate charge, Low Miller charge these devices are ideal for high frequency DC to DC converters. Low Qrr Body Diode **Application** Optimized efficiency at high frequencies DC/DC converters and Off-Line UPS UIS Capability ( Single Pulse and  Repetitive Pulse) RoHS Compliant Distributed Power Architectures **Top Bottom D D D D 8 7 6 5 D 5 4 G D 6 3 S D 7 2 S D 8 1 S** ee | **1 2 3 4 G S S S MLP 3.3x3.3 MOSFET Maximum Ratings** TA = 25°C unless otherwise noted **Symbol Parameter Ratings Units** VDS Drain to Source Voltage 220 V VGS Gate to Source Voltage ±20 V Drain Current  -Continuous (Silicon limited)                TC= 25°C 7.0 ID -Continuous                                            TA = 25°C          (Note 1b) 1.0 A -Pulsed 13.8 EAS Single Pulse Avalanche Energy (Note 3) 11 mJ PD Power DissiPower Dissippation                                                            Tation                                                       TCA = 25°C = 25°C          (Note 1a) 2.142 W TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C **Thermal Characteristics** RθJC Thermal Resistance, Junction to Case                                                        (Note 1) 3.0 °C/W ~~EE~~ RθJA Thermal Resistance, Junction to Ambient                                                 (Note 1a) 60 **Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity** FDMC2674 FDMC2674 MLP 3.3X3.3 13 ’’ 12 mm 3000 units ~~[ss~~ 

©2012 Fairchild Semiconductor Corporation **1** FDMC2674 Rev.F4 

www.fairchildsemi.com 

**Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrical Characteristics**TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted|TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted||||||
|---|---|---|---|---|---|---|
|**Symbol**<br>**Parameter**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ΔBVDSS<br>ΔTJ<br>Breakdown Voltage Temperature<br>Coefficient<br>IDSS<br>Zero Gate Voltage Drain Current<br>IGSS<br>Gate to Source Leakage Current<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>ΔVGS(th)<br>ΔTJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>rDS(on)<br>Static Drain to Source On Resistance<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>Coss<br>Output Capacitance<br>Crss<br>Reverse Transfer Capacitance<br>**Switching Characteristics**|**Test Conditions**<br>ID= 250μA, VGS= 0V<br>ID= 250μA, referenced to 25°C<br>VDS= 176V, VGS= 0V<br>VGS= ±20V, VDS = 0V<br>VGS= VDS,  ID= 250μA<br>ID= 250μA, referenced to 25°C<br>VGS= 10V,  ID= 1.0A<br>VGS= 10V,  ID= 1.0A , TJ= 150°C<br>VDS= 100V, VGS= 0V,<br>f = 1MHz|**Min**<br>220<br>2||**Typ**<br>248<br>3.4<br>-10.2<br>305<br>678<br>880<br>70<br>11|**Max**<br>1<br>±100<br>4<br>366<br>814<br>1180<br>95<br>20|**Units**<br>V<br>mV/°C<br>μA<br>nA<br>V<br>mV/°C<br>mΩ<br>pF<br>pF<br>pF|
|td(on)<br>Turn-On DelayTime<br>tr<br>Rise Time<br>td(off)<br>Turn-Off DelayTime|VDD= 100V, ID= 1.0A<br>VGS= 10V, RGEN= 2.4Ω|||9<br>13<br>15|18<br>23<br>27|ns<br>ns<br>ns|
|tf<br>Fall Time||||21|34|ns|
|Qg(TOT)<br>Total Gate Charge at 10V|VGS = 0V to 10V VDD= 15V|||12.7|18|nC|
|Qgs<br>Gate to Source Gate Charge|ID= 1.0A|||3.8||nC|
|Qgd<br>Gate to Drain “Miller” Charge||||2.9||nC|
|**Drain-Source Diode Characteristics**|||||||
|VSD<br>Source to Drain Diode  Forward Voltage|VGS = 0V, IS = 2.2A(Note 2)|||0.8|1.5|V|
|trr<br>Reverse RecoveryTime<br>Qrr<br>Reverse RecoveryCharge|IF= 1.0A, di/dt = 100A/μs||||60<br>109|ns<br>nC|



## **Notes:** 

- **1:** RθJA is determined with the device mounted on a 1 in[2] oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθJA is determined by the user's board design. 

- θJA = 60°C/W when mounted on a 1 in[2] pad of 2 oz copper, 1.5’x1.5’x0.062’ thick PCB. θJA = 135°C/W when mounted on a minimum pad of 2 oz copper. 

- b. 135°C/W when mounted on  a minimum pad of 2 oz copper 

a. 60°C/W when mounted  on  a 1 in[2 ] pad of  2 oz  copper 

- **2:** Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%. 

- **3:** Starting TJ = 25°C; N-ch: L = 1mH, IAS = 4.7A, VDD = 25V, VGS = 10V. 

www.fairchildsemi.com 

**2** 

FDMC2674 Rev.F4 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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3.0 1.6<br>2.5 VGS = 10V VGS = 4.5V PULSE DURATION = 80DUTY CYCLE = 0.5%MAX μ s<br>VGS = 7V 1.4<br>2.0 V GS  = 5V VGS = 5.0V<br>1.5 1.2<br>1.0 VGS = 4.5V VGS = 7V<br>1.0<br>0.5 PULSE DURATION = 80 μ s VGS = 10V<br>DUTY CYCLE = 0.5%MAX<br>0.0 0.8<br>0.0 0.5 1.0 1.5 0.5 1.0 1.5 2.0 2.5 3.0<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>2.4 0.8<br> ID = 1A ID = 1A PULSE DURATION = 80 μ s<br>VGS = 10V 0.7 DUTY CYCLE = 0.5%MAX<br>2.0<br>0.6<br>1.6 TJ = 150 [o] C<br>0.5<br>1.2<br>0.4<br>0.8<br>0.3<br>TJ = 25 [o] C<br>0.4 0.2<br>-50 -25 0 25 50 75 100 125 150 4 8 12 16 20<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>4 20<br>PULSE DURATION = 80 μ s 10 VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>3 V DD  = 5V 1<br>TJ = 150 [o] C<br>2 TJ = 150 [o] C 0.1 TJ = 25 [o] C<br>0.01<br>1 TJ = 25 [o] C TJ = -55 [o] C<br>1E-3<br>TJ = -55 [o] C<br>0 1E-4<br>2 3 4 5 6 0.0 0.3 0.6 0.9 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>(<br>, DRAIN TO<br>NORMALIZED DS(on)<br>R<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Forward Voltage vs Source Current** 

www.fairchildsemi.com 

**3** 

FDMC2674 Rev.F4 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [469 x 577] intentionally omitted <==**

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10 2000<br>ID = 1A 1000<br>8 Ciss<br>VDD = 100V<br>6<br>100<br>4<br>C oss<br>2 f = 1MHz<br>10 VGS = 0V Crss<br>0 5<br>0 3 6 9 12 15 0.1 1 10 100<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>2 30<br>10   r DS(on) LIMITED<br>1 100us<br>1<br>1ms<br>10ms<br>TJ = 25 [o] C 0.1<br>SINGLE PULSE 100ms<br>TJ = MAX RATED 1s<br>TJ = 125 [o] C 0.01 R θ JA = 135 [o] C/W 10s<br>TA = 25 [o] C DC<br>0.1 1E-3<br>0.01 0.1 1 10 100 0.1 1 10 100 1000<br>tAV, TIME IN AVALANCHE(ms) VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Forward Bias Safe<br>Switching Capability Operating Area<br>500<br>100 TA = 25 [o] C<br>FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>10 I = I25  150 ---------------------- 125 – TA -<br>SINGLE PULSE<br>1 R θ JA = 135 [o] C/W<br>0.5<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, PULSE WIDTH (s)<br>Figure 11.   Single Pulse Maximum  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>)<br>A<br>( , DRAIN CURRENT (A)<br>D<br> I<br>, AVALANCHE CURRENT<br>IAS<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDMC2674 Rev.F4 

**==> picture [469 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>0.1       0.05 PDM<br>      0.02<br>0.01<br>t 1<br>t2<br>0.01 NOTES:<br>SINGLE PULSE ZR θ θ JA JA (t) = r(t) x R = 135  [o] C/W θ JA<br>Peak TJ = PDM x Z θ JA(t) + TA<br>Duty Cycle, D = t1 / t2<br>1E-3<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 12.  Transient Thermal Response Curve<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


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FDMC2674 Rev.F4<br>**----- End of picture text -----**<br>


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www.fairchildsemi.com<br>**----- End of picture text -----**<br>


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0.05 C 3.30 A a B<br>2X<br>3.30<br>Ma<br>0.05 C<br>PIN#1 IDENT<br>TOP VIEW li ,<br>2X<br>**----- End of picture text -----**<br>


0.10 C 21 0.75+0.05 0.08 C O ~~T~~[TT] ~~tooo~~ 0.025+0.025 SIDE VIEW ct C SEATING PLANE 

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2.27+0.05<br>(0.50)4X<br> PIN #1 IDENT (0.79)<br>1  ab 4<br>(0.35)<br>(1.15)<br>p ea |<br>| = 3.3020.05<br>R0.15<br>)<br>0.30+0.05(3X) ‘ | 2.00+0.05<br>|<br>8 5<br>0.65 Us Us ff il 0.35+0.05(8X)<br>0.10 C A B<br>- 1.95<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


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(3.40)<br>2.37<br>8 — 5 |<br>0.45(4X)<br>|<br>2.15<br>(1.70)<br>(0.40)<br>(0.65) KEEP OUT<br>AREA<br>0.70(4X)<br>O 1  O o 4<br>0.65<br>0.42(8X)<br>1.95<br>|<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

## NOTES: 

- A. DOES NOT CONFORM TO JEDEC REGISTRATION MO-229 

- B.  DIMENSIONS ARE IN MILLIMETERS. 

- C.  DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. 

- D.  LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. 

- E.  DRAWING FILENAME: MKT-MLP08Srev3. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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