# Power MOSFET, P Channel, 20 V, 6.6 A, 0.042 ohm, µFET, Surface Mount

![Product image](https://novapart.co/image/farnell:1324794RL/)

**URL**: https://novapart.co/products/FDMA291P/power-mosfet-p-channel-20-v-66-a-0042-ohm-fet
**SKU**: FDMA291P
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2250
**Stock**: 10+
**Lead Time**: 230 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:6.6A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.036ohm; Rds(on) Test Voltage Vgs:-700mV; Threshold Voltage Vgs:-700mV; Power Dissip

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.4W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 700mV |
| Transistor Case Style | µFET |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 6.6A |
| Drain Source On State Resistance | 0.042ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1324794RL/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [55 x 9] intentionally omitted <==**

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August 2014<br>**----- End of picture text -----**<br>


## **FDMA291P** 

## **Single P-Channel 1.8V Specified PowerTrench MOSFET** 

## **General Description** 

## **Features** 

This device is designed specifically for battery charge –6.6 A, –20V. rDS(ON)  = 42 mDS(ON)  = 42 m  = 42 m @ VGS = –4.5V  GS = –4.5V   = –4.5V or load switching in cellular handset and other ultrarDS(ON)  = 58 m @ VGS = –2.5V portable applications. It features a MOSFET with low rDS(ON)  = 98 m @ VGS = –1.8V on-state resistance. 

–6.6 A, –20V. rDS(ON)  = 42 mDS(ON)  = 42 m  = 42 m @ VGS = –4.5V  GS = –4.5V   = –4.5V 

Low profile – 0.8 mm maximum – in the new package MicroFET 2x2 mm 

The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications. 

**==> picture [442 x 441] intentionally omitted <==**

**----- Start of picture text -----**<br>
Free  from  halogenated compounds and  antimony<br>linear mode applications.  oxides<br>RoHS Compliant<br>Pin 1  [        D       D        G]<br>Bottom Drain Contact<br>Drain Source<br>D 1 6 D<br>D 2 5 D<br>G 3 4 S<br>Bo<br>ans<br>        D        D       S<br>MicroFET 2x2<br>Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol  Parameter  Ratings  Units<br>VDS ———————— Drain-Source Voltage   –20 V<br>VGS Gate-Source Voltage  8 V<br>Drain Current  – Continuous  (Note 1a) –6.6  A<br>ID<br>– Pulsed –24<br>Power Dissipation for Single Operation  (Note 1a) 2.4  W<br>PD<br>                                                                                                  (Note 1b) 0.9<br>TJ, TSTG pt Operating and Storage Junction Temperature Range  –55 to +150  C<br>Thermal Characteristics<br>R JC Thermal Resistance, Junction-to-Case 13<br>R JA Thermal Resistance, Junction-to-Ambient   (Note 1a)  52 C/W<br>ae R JA Thermal Resistance, Junction-to-Ambient   (Note 1b)  145<br>Package Marking and Ordering Information<br>Device Marking  Device  Reel Size  Tape width  Quantity<br>291 FDMA291P 7’’ 8mm 3000 units<br>a Ce<br>  FDMA291P  Rev B6<br>**----- End of picture text -----**<br>


2009 Fairchild Semiconductor Corporation 

|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ Max Units**<br>**Off Characteristics**<br>BVDSS<br>Drain–Source Breakdown Voltage<br>VGS= 0 V,<br>ID= –250 A<br>–20<br>BVDSS<br>TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= –250 A, Referenced to 25°C<br>–12<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= –16 V,<br>VGS= 0 V<br>–1<br>IGSS<br>Gate–BodyLeakage<br>VGS= ± 8 V,<br>VDS= 0 V<br>±100<br>**On Characteristics**<br>**(Note 2)**<br>VGS(th)<br>Gate Threshold Voltage<br>VDS= VGS,<br>ID= –250 A<br>–0.4<br>–0.7<br>–1.0<br>VGS(th)<br>TJ<br>Gate Threshold Voltage<br>Temperature Coefficient<br>ID= –250 A, Referenced to 25°C<br>3<br>rDS(on)<br>Static Drain–Source<br>On–Resistance<br>VGS= –4.5 V,  ID= –6.6 A<br>VGS= –2.5 V,  ID= –5.1 A<br>VGS= –1.8 V,  ID= –3.9 A<br>VGS= –4.5 V, ID= –6.6 A, TJ=125°C<br>36<br>51<br>79<br>49<br>42<br>58<br>98<br>64<br>gFS<br>Forward Transconductance<br>VDS= –5 V,<br>ID= –6.6 A<br>16<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>1000<br>Coss<br>Output Capacitance<br>190<br>Crss<br>Reverse Transfer Capacitance<br>VDS= –10 V,<br>VGS= 0 V,<br>f = 1.0 MHz<br>100<br>**Switching Characteristics(Note 2)**<br>td(on)<br>Turn–On Delay Time<br>13<br>23<br>tr<br>Turn–On Rise Time<br>9<br>18<br>td(off)<br>Turn–Off Delay Time<br>42<br>68<br>tf<br>Turn–Off Fall Time<br>VDD= –10 V,<br>ID= –1 A,<br>VGS= –4.5 V, RGEN= 6<br>25<br>40<br>Qg<br>Total Gate Charge<br>10<br>14<br>Qgs<br>Gate–Source Charge<br>2<br>Qgd<br>Gate–Drain Charge<br>VDS= –10 V,<br>ID= –6.6 A,<br>VGS= –4.5 V<br>3<br>**Drain–Source Diode Characteristics and Maximum Ratings**<br>IS<br>Maximum Continuous Drain–Source Diode Forward Current<br>–2<br>VSD<br>Drain–Source Diode Forward<br>Voltage<br>VGS= 0 V,  IS= –2 A(Note 2)<br>–0.8<br>–1.2<br>trr<br>Diode Reverse Recovery Time<br>20<br>Qrr<br>Diode Reverse Recovery Charge<br>IF= –6.6 A,<br>dIF/dt = 100 A/µs<br>8<br>~~pe~~<br>~~So~~<br>A eG<br>~~po~~<br>~~a~~<br>~~AU~~<br>|<br>~~pO~~<br>~~po~~<br>~~a~~<br>a<br>~~pO~~<br>° a<br>po<br>a<br>po<br>a<br>po<br>a<br>a<br>po<br>~~a~~<br>~~pO~~<br>~~| | |~~|**Typ Max Units**<br>V<br>mV/ C<br>A<br>nA<br>V<br>mV/ C<br>m<br>S<br>pF<br>pF<br>pF<br>ns<br>ns<br>ns<br>ns<br>nC<br>nC<br>nC<br>A<br>V<br>ns<br>nC<br>3|**FDMA291P Single P-Channel 1.8V Specified PowerTrench  MOSFET**<br>@|
|---|---|---|



**Notes:** 

**1.** R JA is determined with the device mounted on a 1 in[2] oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R JC is guaranteed by design while R JA is determined by the user's board design. 

a. 52 °C/W when mounted b. 145 °C/W when mounted on  a on a 1 in[2] pad of  2 oz copper. minimum pad of 2 oz copper. 

**2.** Pulse Test: Pulse Width < 300 mv s, Duty Cycle < 2.0% 

FDMA291P Rev B6 

**==> picture [466 x 605] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics<br>24 2.6<br>VGS = -4.5V -3.0V 2.4 VGS = -1.8V<br>20 -2.5V<br>2.2<br>16 2<br>-4.0V -3.5V<br>1.8<br>12 -2.0V<br>-2.0V 1.6<br>8 -1.8V 1.4 -2.5V<br>-3.0V<br>1.2 -3.5V<br>4 -4.0V -4.5V<br>1<br>0 0.8<br>0 1 2 3 4 5 0 4 8 12 16 20 24<br>-VDS, DRAIN-SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.6 0.15<br>VIDGS = -6.6A = -10V ID = -3.3A<br>1.4 0.12<br>1.2 0.09<br>TA = 125 [o] C<br>1 0.06<br>TA = 25 [o] C<br>0.8 0.03<br>0.6 0<br>-50 -25 0 25 50 75 100 125 150 0 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>24 100<br>VDS = -10V V GS  = 0V<br>20 10<br>TA = -55 [o] C 125 [o] C<br>16 1<br>25 [o] C<br>12 0.1<br>TA = 125 [o] C<br>8 0.01<br>25 [o] C<br>4 0.001<br>-55 [o] C<br>0 0.0001<br>0 1 2 3 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>, DRAIN CURRENT (A)D RDS(ON)<br>-I<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>FDMA291P Single P-Channel 1.8V Specified PowerTrench<br>�<br> MOSFET<br>, DRAIN CURRENT (A)-ID<br>, REVERSE DRAIN CURRENT (A)-IS<br>**----- End of picture text -----**<br>


FDMA291P Rev B6 

## **Typical Characteristics** 

**==> picture [424 x 535] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 1600<br>ID = -6.6A VDS = -5V -15V Vf = 1MHzGS = 0 V<br>8<br>1200<br>-10V<br>6 Ciss<br>800<br>4<br>Coss<br>400<br>2<br>Crss<br>0 0<br>0 4 8 12 16 20 24 0 4 8 12 16 20<br>Qg, GATE CHARGE (nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>1000 100<br>SINGLE PULSE<br>R�JA = 145°C/W<br>100 80 TA = 25 ° C<br>100us<br>10 R DS(ON)  LIMIT 10ms1ms<br>100ms 60<br>1s<br>1 10s<br>DC<br>40<br>0.1<br>VGS = -10V<br>SINGLE PULSE<br>0.01 R�JA = 145 [o] C/W 20<br>TA = 25 [o] C<br>0.001 0<br>0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000<br>-VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Single Pulse Maximum Power<br>Dissipation.<br>1<br>D = 0.5<br>R�JA(t) = r(t) * R�JA<br>0.2 R�JA =145 °C/W<br>0.1 0.1<br>0.05 P(pk)<br>0.02 t1<br>0.01 0.01 t2<br>TJ - TA = P * R�JA(t)<br>SINGLE PULSE<br>Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 11. Transient Thermal Response Curve.<br>                          Thermal characterization performed using the conditions described in Note 1b.<br>                           Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>-V<br>, DRAIN CURRENT (A)-ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


FDMA291P Rev B6 

## **Dimensional Outline and Pad Layout** 

**==> picture [16 x 451] intentionally omitted <==**

**----- Start of picture text -----**<br>
FDMA2<br>91P<br>Single<br>P<br>-Channel<br>1.8<br>V specified PowerTrench<br>®<br>MOSFET<br>**----- End of picture text -----**<br>


_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_MLDEB-C06_ 

FDMA291P Rev B6 

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Rev. I71 

FDMA291P Rev B6 

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