# Power MOSFET, N Channel, 100 V, 4.4 A, 0.06 ohm, Power 33, Surface Mount

![Product image](https://novapart.co/image/farnell:2083242/)

**URL**: https://novapart.co/products/FDM3622/power-mosfet-n-channel-100-v-44-a-006-ohm-33
**SKU**: FDM3622
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4810
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:4.4A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.044ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | Power 33 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4.4A |
| Drain Source On State Resistance | 0.06ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2083242/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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August 2014<br>**----- End of picture text -----**<br>


## 

## **N-Channel PowerTrench[®] MOSFET** 

## **100V, 4.4A, 60m** Ω **Features** 

Max rDS(on) = 60mΩ at VGS = 10V, ID = 4.4A 

Max rDS(on) = 80mΩ at VGS = 6.0V, ID = 3.8A 

Low Miller Charge 

Low QRR Body Diode 

Optimized efficiency at high frequencies 

UIS Capability (Single Pulse and Repetitive Pulse) RoHS Compliant 

## **General Description** 

This N-Channel MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench **[®]** process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. 

## **Applications** 

Distributed Power Architectures and VRMs. 

Primary Switch for 24V and 48V Systems 

High Voltage Synchronous Rectifier 

Formerly developmental type 82744 

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Top Bottom<br>Pin 1<br>G<br>S<br>S<br>S<br>‘e<br>D<br>D<br>D<br>D<br>MLP 3.3x3.3<br>**----- End of picture text -----**<br>


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**MOSFET Maximum Ratings** TA = 25°C unless otherwise noted 

|**Symbol**||**Parameter**|||**Ratings**|||**Units**|
|---|---|---|---|---|---|---|---|---|
|VDS|Drain to Source Voltage||||100|||V|
|VGS|Gate to Source Voltage||||±20|||V|
|ID|Drain Current      -Continuous<br>-Pulsed|Drain Current      -Continuous|Drain Current      -Continuous(Note 1a)||4.4<br>20|||A|
|EAS|Single Pulse Avalanche Energy||(Note 3)||54|||mJ|
|PD|Power Dissipation<br>Power Dissipation|ation<br>ation|ation(Note 1a)<br>ation(Note 1b)||2.1<br>0.9|||W|
|TJ, TSTG|Operatingand Storage Junction Temperature Range||||-55 to +150|||°C|
|**Thermal Characteristics**|||||||||
|RθJC|Thermal Resistance, Junction to Case||Thermal Resistance, Junction to Case(Note 1)||3.0|||°C/W|
|RθJA|Thermal Resistance, Junction to Ambient||Thermal Resistance, Junction to Ambient(Note 1a)||60||||
|**Package Marking and Ordering Information**|||||||||
|**Device Marking**<br>**Device**||**Package**|**Reel Size**||**Tape Width**||**Quantity**||
|FDM3622<br>FDM3622||MLP 3.3x3.3|13’’||12 mm||3000 units||



www.fairchildsemi.com 

**1** 

©2014 Fairchild Semiconductor Corporation FDM3622 Rev.C6 

## **Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrical Characteristics**TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted|**Electrical Characteristics**TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted|
|---|---|
|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250μA, VGS= 0V<br>100<br>V<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 80V, VGS= 0V<br>1<br>μA<br>TJ= 100°C<br>250<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= 250μA<br>2<br>4<br>V<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V,  ID= 4.4A<br>44<br>60<br>mΩ<br>VGS= 6.0V,  ID= 3.8A<br>56<br>80<br>VGS= 10V,  ID= 4.4A , TJ= 150°C<br>92<br>120<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 25V, VGS= 0V,<br>f = 1MHz<br>820<br>1090<br>pF<br>Coss<br>Output Capacitance<br>125<br>170<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>35<br>55<br>pF<br>Rg<br>Gate Resistance<br>VDS= 15mV, f = 1MHz<br>0.1<br>3.1<br>6.2<br>Ω<br>**Switching Characteristics**<br>~~aeG~~<br>~~aee~~<br>~~eee ee~~<br>~~PsGG~~||
|td(on)<br>Turn-On DelayTime<br>VDD= 50V, ID= 4.4A<br>VGS= 10V, RGEN= 24Ω<br>11<br>20<br>ns<br>tr<br>Rise Time<br>25<br>40<br>ns<br>td(off)<br>Turn-Off DelayTime<br>35<br>56<br>ns||
|tf<br>Fall Time<br>26<br>42<br>ns||
|Qg<br>Total Gate Charge<br>VGS= 10V<br>13<br>17<br>nC||
|VDD= 50V<br>ID= 4.4A<br>Qgs<br>Gate to Source Gate Charge<br>3.6<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>3.4<br>nC||
|**Drain-Source Diode Characteristics**||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0V, IS = 4.4A<br>1.25<br>V<br>VGS = 0V, IS = 2.2A<br>1.0<br>V||
|trr<br>Reverse RecoveryTime<br>IF= 4.4A, di/dt = 100A/μs<br>56<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>108<br>nC||



## **Notes:** 

- **1:** RθJA is determined with the device mounted on a 1 in[2] oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθJA is determined by the user's board design. 

- θJA = 60°C/W when mounted on a 1 in[2] pad of 2 oz copper, 1.5’x1.5’x0.062’ thick PCB. θJA = 135°C/W when mounted on a minimum pad of 2 oz copper. 

   - a. 60°C/W when mounted  on b. 135°C/W when mounted on  a a 1 in[2 ] pad of  2 oz  copper minimum pad of 2 oz copper 

- **2:** Pulse Test: Pulse Width < 300μs, Duty cycle < 2.0%. 

- **3:** EAS of 54 mJ is based on starting TJ = 25 C; N-ch: L = 3 mH, IAS = 6 A,  VDD = 100 V, VGS= 10 V. 

www.fairchildsemi.com 

**2** 

FDM3622  Rev.C6 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

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10 2.5<br>VGS = 10V PULSE DURATION = 80DUTY CYCLE = 0.5% MAX μ s PULSE DURATION = 80DUTY CYCLE = 0.5% MAX μ s<br>8  T A  = 25 [o] C 2.0<br>VGS = 5V<br>6 1.5<br>4 V GS  = 4.7V 1.0<br>VGS = 4.5V<br>2 0.5<br>VGS = 10V, ID = 4.4A<br>0 0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 -80 -40 0 40 80 120 160<br>VDS, DRAIN TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE ( [o] C)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Junction Temperature<br>80 10<br>PULSE DURATION = 80 μ s  PULSE DURATION = 80 μ s<br>DUTY CYCLE = 0.5% MAX DUTY CYCLE = 0.5% MAX<br>8 VDD = 15V<br>70<br>ID = 4.4A<br>6<br>60  TJ = 150 [o] C<br>4<br>ID = 0.2A  TJ = -55 [o] C<br> TJ = 25 [o] C<br>50<br>2<br>40 0<br>4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0<br>VGS, GATE TO SOURCE VOLTAGE (V) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  On-Resistance vs  Gate to                                  Figure 4.  Transfer Characteristics<br>Source Voltage<br>10 1200<br>VDD = 50V 1000<br>8 CISS  =  CGS + CGD<br>C OSS  ≅  C DS  + C GD<br>6<br>100 CRSS  =  CGD<br>4<br>2 WAVEFORMS IN<br>DESCENDING ORDER:<br>IID D  = 4.4A= 1A VGS = 0V, f = 1MHz<br>0 10<br>0 3 6 9 12 15 0.1 1 10 100<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 5.  Gate Charge Characteristics Figure 6.   Capacitance vs Drain<br>ON RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>NORMALIZED DRAIN TO SOURCE<br>) Ω<br>, DRAIN TO SOURCE<br>rDS(ON) ON RESISTANCE (m , DRAIN CURRENT (A)ID<br>C, CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**to Source Voltage** 

www.fairchildsemi.com 

**3** 

FDM3622  Rev.C6 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

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50 20<br>If R = 0<br>10 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)<br>10 If RtAV = (L/R)ln[(I  ≠  0 AS*R)/(1.3*RATED BVDSS - VDD) +1]<br>100us<br>1<br>1 ms<br>STARTING TJ = 25 [o] C<br>THIS AREA IS  10 ms<br>0.1 LIMITED BY rDS(on) 100 ms<br>SINGLE PULSE 1 s<br>0.01 TJ = MAX RATED 10 s<br>R θ JA = 135 [ o] C/W DC STARTING TJ = 150 [o] C<br>TA = 25  [o] C<br>0.001<br>1<br>0.1 1 10 100 400<br>0.001 0.01 0.1 1 10 100<br>VDS, DRAIN to SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (ms)<br>Figure 7.  Forward Bias Safe                                               Figure 8.   Uncalamped  Inductive<br>Operating Area  Switching Capability<br>1.2 6<br>1.0<br>VGS = 10V<br>0.8 4<br>0.6<br>0.4 2<br>0.2<br>0 0<br>0 25 50 75 100 125 150 25 50 75 100 125 150<br>TA, AMBIENT TEMPERATURE ( [o] C) TA, AMBIENT TEMPERATURE ( [o] C)<br>Figure 9.  Normalized  Power  dissipation                           Figure 10.  Maximum  Continuous Drain Current<br>vs Ambient Temperature  vs Ambient Temperature<br>1.2 1.2<br>VGS = VDS, ID = 250 μ A  ID = 250 μ A<br>1.0 1.1<br>0.8 1.0<br>0.6 0.9<br>-80 -40 0 40 80 120 160 -80 -40 0 40 80 120 160<br>TJ, JUNCTION TEMPERATURE ( [o] C) TJ, JUNCTION TEMPERATURE ( [o] C)<br>, DRAIN CURRENT (A)<br>ID , AVALANCHE CURRENT (A)IAS<br>, DRAIN CURRENT (A)<br>ID<br>POWER DISSIPATION MULTIPLIER<br>NORMALIZED GATE<br>THRESHOLD VOLTAGE BREAKDOWN VOLTAGE<br>NORMALIZED DRAIN TO SOURCE<br>**----- End of picture text -----**<br>


**Figure 11.  Normalized Gate Threshold voltage vs Junction Temperature** 

**Figure 12.  Normalized Drain to Source Breakdown Voltage vs Junction Temperature** 

www.fairchildsemi.com 

**4** 

FDM3622  Rev.C6 

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Typical Characteristics  TJ = 25°C unless otherwise noted<br>500<br>V GS  = 10V<br>100 TA = 25 [o] C<br>FOR TEMPERATURES<br>SINGLE PULSE ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>10 R θ JA  = 135 [o] C/W I = I25  150 ---------------------- 125 – T A -<br>1<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, PULSE WIDTH (s)<br>Figure 13.  Peak Current Capability<br>1<br>DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>0.1       0.05<br>      0.02 PDM<br>      0.01<br>t 1<br>0.01 t2<br>NOTES:<br>SINGLE PULSE DUTY FACTOR: D = t 1 /t 2<br>R θ JA = 135 [o] C/W PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>1E-3<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION(s)<br>Figure 14.  Transient Thermal Response Curve<br>, PEAK TRANSIENT POWER (W)P)(PK<br>IMPEDANCE, ZJA θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


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FDM3622  Rev.C6<br>**----- End of picture text -----**<br>


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0.10 C 21 0.75+0.05 0.08 C O ~~T~~[TT] ~~tooo~~ 0.025+0.025 SIDE VIEW ct C SEATING PLANE 

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2.27+0.05<br>(0.50)4X<br> PIN #1 IDENT (0.79)<br>1  ab 4<br>(0.35)<br>(1.15)<br>p ea |<br>| = 3.3020.05<br>R0.15<br>)<br>0.30+0.05(3X) ‘ | 2.00+0.05<br>|<br>8 5<br>0.65 Us Us ff il 0.35+0.05(8X)<br>0.10 C A B<br>- 1.95<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


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(3.40)<br>2.37<br>8 — 5 |<br>0.45(4X)<br>|<br>2.15<br>(1.70)<br>(0.40)<br>(0.65) KEEP OUT<br>AREA<br>0.70(4X)<br>O 1  O o 4<br>0.65<br>0.42(8X)<br>1.95<br>|<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

## NOTES: 

- A. DOES NOT CONFORM TO JEDEC REGISTRATION MO-229 

- B.  DIMENSIONS ARE IN MILLIMETERS. 

- C.  DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. 

- D.  LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. 

- E.  DRAWING FILENAME: MKT-MLP08Srev3. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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