# Power MOSFET, N Channel, 25 V, 35 A, 0.0116 ohm, TO-252AA, Surface Mount

![Product image](https://novapart.co/image/farnell:2453401RL/)

**URL**: https://novapart.co/products/FDD8778/power-mosfet-n-channel-25-v-35-a-00116-ohm-to
**SKU**: FDD8778
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2820
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | N Channel |
| Power Dissipation | 39W |
| Drain Source On State Resistance | 0.0116ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453401RL/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [471 x 659] intentionally omitted <==**

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March 2015<br>FDD8778/FDU8778<br>N-Channel PowerTrench [®]  MOSFET<br>25V, 35A, 14m Ω<br>Features General Description<br>Max rDS(on) =  14.0mΩ at VGS = 10V, ID = 35A This N-Channel MOSFET has been designed specifically<br>to improve the overall efficiency of DC/DC converters using<br>Max rDS(on) =  21.0mΩ at VGS = 4.5V, ID = 33A   either synchronous or conventional switching PWM<br>controllers. It has been optimized for low gate charge, low<br>Low gate charge: Qg(TOT) = 12.6nC(Typ),  VGS = 10V rDS(on) and fast switching speed.<br>Low gate resistance<br>RoHS compliant  Application<br>DC-DC for Desktop Computers and Servers<br>VRM for Intermediate Bus Architecture<br>D<br>G<br>D G<br>G D S I-PAK S<br>Short Lead I-PAK<br>(TO-251AA)<br>S<br>MOSFET Maximum Ratings TC = 25°C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDS Drain to Source Voltage 25 V<br>VGS Gate to Source Voltage ±20 V<br>Drain Current   -Continuous (Package Limited) 35<br>ID                          -Continuous (Die Limited) 40 A<br>                            -Pulsed                                                                     (Note 1) 145<br>EAS Single Pulse Avalanche Energy (Note 2) 24 mJ<br>PD Power Dissipation                            39 W<br>TJ, TSTG Operating and Storage Temperature -55 to 175 °C<br>Thermal Characteristics<br>RθJC Thermal Resistance, Junction to Case TO-252,TO-251 3.8 °C/W<br>RθJA Thermal Resistance, Junction to Ambient TO-252,TO-251 100 °C/W<br>—————————— RθJA Thermal Resistance, Junction to Ambient TO-252,1in [2]  copper pad area  52 °C/W<br>Package Marking and Ordering Information<br>Device Marking Device Package Reel Size Tape Width Quantity<br>FDD8778 FDD8778 TO-252AA 13’’ 16mm 2500 units<br>FDU8778 FDU8778 TO-251AA N/A(Tube) N/A 75 units<br>SSS FDU8778 FDU8778_F071 TO-251AA N/A(Tube) == N/A 75 units<br>LEAD F R E E IMPLE<br>M<br>E<br>N<br>FDD8778/FDU8778 N-Channel PowerTrench<br>®<br> MOSFET<br>T<br>A<br>NOIT<br>**----- End of picture text -----**<br>


©2006 Fairchild Semiconductor Corporation **1** www.fairchildsemi.com FDD8778/FDU8778 Rev. 1.2 

|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|**Electrical Characteristics**TJ= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**||**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**||||||||
|BVDSS|Drain to Source Breakdown Voltage|ID= 250µA, VGS= 0V||25|||V|
|∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250µA, referenced to<br>25°C|||17.2||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 20V,<br>VGS= 0V||||1|µA|
||||TJ= 150°C|||250||
|IGSS|Gate to Source Leakage Current|VGS= ±20V||||±10|µA|
|**On Characteristics**||||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS,  ID=|250µA|1.2|1.5|2.5|V|
|∆VGS(th)<br>∆TJ|Gate to Source Threshold Voltage<br>Temperature Coefficient|ID= 250µA, referenced to<br>25°C|||-5.3||mV/°C|
|rDS(on)|Drain to Source On Resistance|VGS= 10V, ID= 35A|||11.6|14.0|mΩ|
|||VGS= 4.5V, ID= 33A|||15.7|21.0||
|||VGS= 10V, ID= 35A<br>TJ= 175°C|||18.2|23.8||
|**Dynamic Characteristics**||||||||
|Ciss|Input Capacitance|VDS= 13V, VGS= 0V,<br>f = 1MHz|||635|845|pF|
|Coss|Output Capacitance||||160|215|pF|
|Crss|Reverse Transfer Capacitance||||108|162|pF|
|Rg|Gate Resistance|f = 1MHz|||1.3||Ω|
|**Switching Characteristics**||||||||
|td(on)|Turn-On DelayTime|VDD= 13V, ID= 35A<br>VGS= 10V, RGS= 27Ω|||6|12|ns|
|tr|Rise Time||||22|35|ns|
|td(off)|Turn-Off DelayTime||||43|69|ns|
|tf|Fall Time||||32|51|ns|
|Qg(TOT)|Total Gate Charge at 10V|VGS = 0V to 10V|||12.6|18|nC|
|Qg(5)|Total Gate Charge at 5V|VGS = 0V to 5V|||6.7|9.4|nC|
|Qgs|Gate to Source Gate Charge||||2.1||nC|
|Qgd|Gate to Drain “Miller”Charge||||3.2||nC|
|**Drain-Source Diode Characteristics**||||||||
|VSD|Source to Drain Diode  Forward Voltage|VGS= 0V, IS= 35A|||1.03|1.25|V|
|||<br>VGS= 0V, IS= 15A|||0.89|1.2||
|trr|Reverse RecoveryTime|IF= 35A, di/dt = 100A/µs|||25|38|ns|
|Qrr|Reverse RecoveryCharge|IF= 35A, di/dt = 100A/µs|||17|26|nC|



**Notes:** 

- **1:** Pulse time < 300µs, Duty cycle = 2%. 

- **2:** Starting TJ = 25[o] C, L = 0.1mH, IAS = 22A ,VDD = 23V,  VGS = 10V. 

FDD8778/FDU8778 Rev. 1.2 

www.fairchildsemi.com 

**2** 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [437 x 589] intentionally omitted <==**

**----- Start of picture text -----**<br>
70 4.0<br>PULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>60 DUTY CYCLE = 0.5%MAX 3.5 DUTY CYCLE = 0.5%MAX<br>VGS =  3.0V<br>50 VGS = 10V VGS = 4.0V 3.0 VGS =  3.5V<br>40 VVGSGS = = 4.5V5.0V 2.5<br>30 VGS = 3.5V 2.0 VGS = 4V VGS = 4.5V<br>20 1.5<br>10 VGS = 3V 1.0<br>VGS = 10V VGS = 5V<br>0 0.5<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 10 20 30 40 50 60 70<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance vs Drain<br>Current and Gate Voltage<br>1.8 50<br> ID = 35A ID = 35A PULSE DURATION = 80 µ s<br>1.6 VGS = 10V DUTY CYCLE = 0.5%MAX<br>40<br>1.4<br>30<br>1.2 TJ = 175 [o] C<br>20<br>1.0<br>10<br>0.8<br>TJ = 25 [o] C<br>0.6 0<br>-80 -40 0 40 80 120 160 200 3.0 4.5 6.0 7.5 9.0 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized On Resistance vs Junction  Figure 4.   On-Resistance vs Gate to Source<br>Temperature Voltage<br>70 100<br>PULSE DURATION = 80 µ s VDD = 5V VGS = 0V<br>60 DUTY CYCLE = 0.5%MAX<br>10<br>50<br>TJ = 175 [o] C<br>1<br>40<br>30 TJ = 25 [o] C<br>0.1<br>TJ = 175 [o] C<br>20<br>TJ = 25 [o] C 0.01 TJ = -55 [o] C<br>10<br>TJ = - 55 [o] C<br>0 1E-3<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward<br>Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


FDD8778/FDU8778 Rev. 1.2 

www.fairchildsemi.com 

**3** 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [438 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 2000<br>f = 1MHz<br>8 1000 Ciss VGS = 0V<br>6 VDD = 10V VDD = 13V Coss<br>4 VDD = 16V<br>Crss<br>100<br>2<br>0 40<br>0 3 6 9 12 15 0.1 1 10 30<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source Voltage<br>50<br>50<br>40<br>VGS=10V<br>10 TJ = 25 [o] C 30<br>TJ = 125 [o] C 20<br>TJ = 150 [o] C VGS=4.5V<br>10<br>R θ JC = 3.8oC/W<br>1 0<br>1E-3 0.01 0.1 1 10 100 25 50 75 100 125 150 175<br>tAV, TIME IN AVALANCHE(ms) TC, CASE TEMPERATURE (oC)<br>Figure 9.  Unclamped Inductive Switching  Figure 10.  Maximum Continuous Drain Current vs<br>Capability Case Temperature<br>400 5000<br>TC = 25 [o] C<br>100 10us VGS = 10V FOR TEMPERATURES<br>1000 ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>10 100us I = I25  175 --------------------- 150 – TC -<br>100<br>LIMITED BY<br>1ms<br>PACKAGE<br>1<br>10ms<br>OPERATION IN THIS  SINGLE PULSE DC SINGLE PULSE<br>AREA MAY BE  TJ = MAX RATED<br>0.1 LIMITED BY rDS(on) TC = 25 [O] C 1010-5 10-4 10-3 10-2 10-1 100 101<br>1 10 50 t, PULSE WIDTH (s)<br>VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11.  Forward Bias Safe Operating Area Figure 12.  Single Pulse Maximum Power<br>Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>)<br>A<br>(<br>, DRAIN CURRENT (A)<br>ID<br>, AVALANCHE CURRENT<br>IAS<br>, DRAIN CURRENT (A) ID , PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


FDD8778/FDU8778 Rev. 1.2 

www.fairchildsemi.com 

**4** 

**==> picture [434 x 213] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>      0.1<br>      0.05<br>      0.02<br>      0.01 PDM<br>0.1<br>t1<br>t2<br>SINGLE PULSE NOTES:<br>DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z θJC  x R θJC  + TC<br>0.01<br>10-5 10-4 10-3 10-2 10-1 100 101<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13.  Transient Thermal Response Curve<br>IMPEDANCE, ZJC θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


FDD8778/FDU8778 Rev. 1.2 

www.fairchildsemi.com 

**5** 

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**==> picture [37 x 54] intentionally omitted <==**

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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