# Power MOSFET, N Channel, 40 V, 42 A, 9000 µohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2453853/)

**URL**: https://novapart.co/products/FDD8647L/power-mosfet-n-channel-40-v-42-a-9000-ohm-to-252
**SKU**: FDD8647L
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6830
**Stock**: 50+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:42A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.0071ohm; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (14-Jun-2023) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 43W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 42A |
| Drain Source On State Resistance | 9000µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453853/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**March 2015 FDD8647L N-Channel PowerTrench[®] MOSFET 40 V, 42 A, 9 m** Ω **Features General Description** Max rDS(on) = 9 mΩ at  VGS = 10 V, ID = 13 A This N-Channel MOSFET has been produced using Fairchild Semiconductor’s proprietary PowerTrench **[®]** technology to Max rDS(on) = 13 mΩ at  VGS = 4.5 V, ID = 11 A deliver low rDS(on) and optimized BVDSS capability to offer superior performance benefit in the application. Fast Switching 100% UIL tested **Applications** RoHS Compliant Inverter Power Supplies **D D G G S D-PAK TO -252** & **(TO-252) S** 

## **MOSFET Maximum Ratings** TC = 25 °C unless otherwise noted 

|**Symbol**<br>**Parameter**||||**Ratings**|||**Units**|
|---|---|---|---|---|---|---|---|
|VDS<br>Drain to Source Voltage||||40|||V|
|VGS<br>Gate to Source Voltage||||±20|||V|
|Drain Current   -Continuous(Package limited)TC = 25 °C||= 25 °C||42||||
|ID<br>-Continuous(Silicon limited)TC = 25 °C<br>-Continuous                                        TA= 25 °C||= 25 °C(Note 1a)||52<br>14|||A|
|-Pulsed||||100||||
|EAS<br>Single Pulse Avalanche Energy||(Note 3)||33|||mJ|
|PD<br>Power Dissipation                                                   TC= 25 °C<br>Power Dissipation                                                         TA= 25 °C||= 25 °C(Note 1a)||43<br>3.1|||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range||||-55 to +150|||°C|
|**Thermal Characteristics**||||||||
|RθJC<br>Thermal Resistance, Junction to Case<br>RθJA<br>Thermal Resistance, Junction to Ambient<br>~~[- 77~~|Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1a)||2.9<br>40|||°C/W|
|**Package Marking and Ordering Information**||||||||
|**Device Marking**<br>**Device**<br>**Package**<br>FDD8647L<br>FDD8647L<br>D-PAK (TO-252)<br>~~[_~~||**Reel Size**<br>13 ’’||**Tape Width**<br>16 mm||**Quantity**<br>2500 units||



©2008 Fairchild Semiconductor Corporation FDD8647L Rev. 1.2 

www.fairchildsemi.com 

**1** 

**Electrical Characteristics** TJ = 25 °C unless otherwise noted 

|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>31<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250µA<br>1.0<br>2.0<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 13 A<br>7.1<br>9.0<br>mΩ<br>VGS= 4.5 V, ID= 11 A<br>9.9<br>13.0<br>VGS= 10 V, ID= 13 A, TJ = 125 °C<br>10.7<br>13.6<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 13 A<br>49<br>S<br>Ciss<br>Input Capacitance<br>VDS= 20 V, VGS= 0 V,<br>f = 1 MHz<br>1230<br>1640<br>pF<br>Coss<br>Output Capacitance<br>340<br>455<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>55<br>80<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~OE~~<br>~~===~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>31<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250µA<br>1.0<br>2.0<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 13 A<br>7.1<br>9.0<br>mΩ<br>VGS= 4.5 V, ID= 11 A<br>9.9<br>13.0<br>VGS= 10 V, ID= 13 A, TJ = 125 °C<br>10.7<br>13.6<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 13 A<br>49<br>S<br>Ciss<br>Input Capacitance<br>VDS= 20 V, VGS= 0 V,<br>f = 1 MHz<br>1230<br>1640<br>pF<br>Coss<br>Output Capacitance<br>340<br>455<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>55<br>80<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~OE~~<br>~~===~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>31<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250µA<br>1.0<br>2.0<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 13 A<br>7.1<br>9.0<br>mΩ<br>VGS= 4.5 V, ID= 11 A<br>9.9<br>13.0<br>VGS= 10 V, ID= 13 A, TJ = 125 °C<br>10.7<br>13.6<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 13 A<br>49<br>S<br>Ciss<br>Input Capacitance<br>VDS= 20 V, VGS= 0 V,<br>f = 1 MHz<br>1230<br>1640<br>pF<br>Coss<br>Output Capacitance<br>340<br>455<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>55<br>80<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~OE~~<br>~~===~~|**Off Characteristics**<br>**On Characteristics**<br>**Dynamic Characteristics**<br>**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0 V<br>40<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25 °C<br>31<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 32 V, VGS = 0 V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20 V, VDS = 0 V<br>±100<br>nA<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250µA<br>1.0<br>2.0<br>3.0<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25 °C<br>-6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10 V, ID= 13 A<br>7.1<br>9.0<br>mΩ<br>VGS= 4.5 V, ID= 11 A<br>9.9<br>13.0<br>VGS= 10 V, ID= 13 A, TJ = 125 °C<br>10.7<br>13.6<br>gFS<br>Forward Transconductance<br>VDS= 5 V, ID= 13 A<br>49<br>S<br>Ciss<br>Input Capacitance<br>VDS= 20 V, VGS= 0 V,<br>f = 1 MHz<br>1230<br>1640<br>pF<br>Coss<br>Output Capacitance<br>340<br>455<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>55<br>80<br>pF<br>Rg<br>Gate Resistance<br>0.9<br>Ω<br>~~OE~~<br>~~===~~|
|---|---|---|---|
|**Switching Characteristics**||||
|td(on)<br>Turn-On DelayTime<br>8||16<br>ns||
|VDD= 20 V, ID= 13 A,<br>tr<br>Rise Time<br>3||10<br>ns||
|VGS= 10 V, RGEN= 6Ω<br>td(off)<br>Turn-Off DelayTime<br>19||34<br>ns||
|tf<br>Fall Time<br>2||10<br>ns||
|Qg<br>Total Gate Charge<br>VGS= 0 V to 10 V<br>VDD= 20 V,<br>ID= 13 A<br>20<br>28<br>nC<br>Qg<br>Total Gate Charge<br>VGS= 0 V to 4.5 V<br>10<br>14<br>nC<br>Qgs<br>Gate to Source Charge<br>3.8<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>3.1<br>nC<br>~~EE~~||||
|**Drain-Source Diode Characteristics**||||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0 V, IS = 2.6 A(Note 2)<br>0.75<br>1.2<br>V<br>VGS = 0 V, IS = 13 A(Note 2)<br>0.84<br>1.3<br>trr<br>Reverse RecoveryTime<br>IF= 13 A, di/dt = 100 A/µs<br>28<br>45<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>15<br>27<br>nC<br>~~ee~~||||
|Notes**:**||||
|**1:** RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.||is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.|is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.|
|RθJC is guaranteed by design while  RθJAis determined by the user’s board design.||||
|40 °C/W when mounted  on  a<br>1 in2pad of  2 oz  copper<br>96 °C/W when mounted on<br>a minimum pad<br>a)<br>b)||||



- **2:** Pulse Test: Pulse Width < 30 0 µs, Duty cycle < 2.0%. **3:** Starting TJ = 25 °C , L = 0.3 mH, IAS = 15.0 A, VDD = 36 V, VGS = 10.0 V. 

©2008 Fairchild Semiconductor Corporation FDD8647L Rev. 1.2 

www.fairchildsemi.com 

**2** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [469 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 3.5<br>VGS = 10 V VGS = 5 V VGS = 3.5 V PULSE DURATION = 80  µ s<br>80 VGS =  4.5 V 3.0 DUTY CYCLE = 0.5% MAX<br>VGS =  4 V<br>2.5<br>60<br>VGS = 4.5 V<br>VGS = 4 V 2.0<br>40 PULSE DURATION = 80  µ s<br>DUTY CYCLE = 0.5% MAX 1.5<br>VGS = 5 V<br>20<br>VGS = 3.5 V 1.0 VGS =  10 V<br>0 0.5<br>0.0 0.5 1.0 1.5 2.0 2.5 0 20 40 60 80 100<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.8 40<br>1.6 IVDGS = 13 A = 10 V ID = 13 A PULSE DURATION = 80 DUTY CYCLE = 0.5% MAX µ s<br>30<br>1.4<br>1.2 20<br>TJ = 125  [o] C<br>1.0<br>10<br>0.8<br>TJ = 25  [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>100 100<br>PULSE DURATION = 80  µ s VGS = 0 V<br>DUTY CYCLE = 0.5% MAX<br>80 10<br>VDS = 5 V<br>60 1 TJ = 150  [o] C<br>TJ = 25 [ o] C<br>40 0.1<br>TJ = 150  [o] C<br>20 0.01 TJ = -55  [o] C<br>TJ = 25  [o] C TJ = -55  [o] C<br>0 0.001<br>1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>NORMALIZED<br>DRAIN CURRENT (A)<br>,<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>NORMALIZED rDS(on),<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID , REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 5.  Transfer Characteristics** 

**Figure 6.    Source to Drain  Diode Forward Voltage vs Source Current** 

©2008 Fairchild Semiconductor Corporation FDD8647L Rev. 1.2 

www.fairchildsemi.com 

**3** 

## **Typical Characteristics** TJ = 25 °C unless otherwise noted 

**==> picture [469 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 3000<br>ID = 13 A<br>8 1000 Ciss<br>VDD = 20 V<br>6<br>VDD = 15 V VDD = 25 V Coss<br>4 100<br>2 Crss<br>f = 1 MHz<br>VGS = 0 V<br>0 10<br>0 5 10 15 20 0.1 1 10 40<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>100 60<br>50<br>42<br>40<br>VGS = 10 V<br>10 30<br>TJ = 25 [ o] C<br>Limited by Package<br>20<br>TJ = 125  [o] C VGS = 4.5 V<br>10<br>R θ JC = 2.9 oC/W<br>1 0<br>0.001 0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current  vs Case Temperature<br>200 105<br>100 VGS = 10 V<br>104<br>10 100 us SINGLE PULSE<br>THIS AREA IS  103 R θ JC = 2.9  [o] C/W<br>LIMITED BY rDS(on) TC = 25  [o] C<br>1 ms<br>1 SINGLE PULSE<br>TJ = MAX RATED 10 ms 102<br>R θ JC = 2.9  [o] C/W 100 ms<br>TC = 25  [o] C DC<br>0.1 10<br>0.1 1 10 100 200 10-6 10-5 10-4 10-3 10-2 10-1 1<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                      Figure 12.   Single  Pulse Maximum<br>Operating Area  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT (A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>PEAK TRANSIENT POWER (W)<br>P)(PK,<br>**----- End of picture text -----**<br>


©2008 Fairchild Semiconductor Corporation FDD8647L Rev. 1.2 

www.fairchildsemi.com 

**4** 

**==> picture [470 x 418] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Characteristics  TJ = 25 °C unless otherwise noted<br>2<br>1<br>DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1 PDM<br>      0.05<br>      0.02<br>      0.01 t1<br>t2<br>0.01 NOTES:<br>SINGLE PULSE DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z θJC  x R θJc  + TC<br>R θ JC = 2.9 [ o] C/W<br>0.001<br>10-6 10-5 10-4 10-3 10-2 10-1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Junction-to-Case Transient Thermal Response Curve<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1<br>      0.05 PDM<br>      0.02<br>      0.01<br>t1<br>0.01 t2<br>NOTES:<br>SINGLE PULSE DUTY FACTOR: D = t1/t2<br>R θ JA = 96  [o] C/W PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>(Note 1b)<br>0.001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 14.  Junction-to-Ambient Transient Thermal Response Curve<br>ZJC θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


©2008 Fairchild Semiconductor Corporation FDD8647L Rev. 1.2 

www.fairchildsemi.com 

**5** 

**==> picture [37 x 58] intentionally omitted <==**

**==> picture [37 x 54] intentionally omitted <==**

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**1** 



## Links

- [View this product on Novapart](https://novapart.co/products/FDD8647L/power-mosfet-n-channel-40-v-42-a-9000-ohm-to-252)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/onsemi/fdd8647l/mosfet-n-ch-40v-42a-to-252-3/dp/2453853)
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> Novapart is a B2B electronic component broker that sources across 500+ verified
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> [Request a quote](https://novapart.co/quote/) — it's free and there's no
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