# Power MOSFET, N Channel, 40 V, 28 A, 0.024 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2322587/)

**URL**: https://novapart.co/products/FDD8451/power-mosfet-n-channel-40-v-28-a-0024-ohm-to-252
**SKU**: FDD8451
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3130
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:28A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.019ohm; Rds(on) Test Voltage Vgs; Available until stocks are exhausted

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 30W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 28A |
| Drain Source On State Resistance | 0.024ohm |
| Gate Source Threshold Voltage Max | 2.1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2322587/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [442 x 592] intentionally omitted <==**

**----- Start of picture text -----**<br>
March 2015<br>FDD8451<br>N-Channel PowerTrench [®]  MOSFET<br>40V, 28A, 24m .@)<br>Features General Description<br>'. Max rDS(on) =  24m Q  at VGS = 10V, ID = 9A This N-Channel MOSFET has been designed specifically<br>to improve the overall efficiency of DC/DC converters using<br>'. Max rDS(on) =  30m Q  at VGS = 4.5V, ID = 7A   either synchronous or conventional switching PWM<br>controllers. It has been optimized for low gate charge, fast<br>| Low gate charge switching speed and extremely low rDS(on).<br>| Fast Switching Application<br>| High performance trench technology for extremely low<br>rDS(on) i DC/DC converter<br>Backlight inverter<br>RoHS compliant<br>: ”.) i<br>D<br>|<br>G<br>s<br>D-PAK<br>(TO-252)<br>S<br>MOSFET Maximum Ratings TC = 25°C unless otherwise noted<br>Symbol Parameter Ratings Units<br>VDS Drain to Source Voltage 40 V<br>VGS Gate to Source Voltage ±20 V<br>Drain Current   -Continuous @TC=25°C 28<br>ID                         -Continuous @TA=25°C (Note 1a) 9 A<br>                           -Pulsed                                                               78<br>EAS Single Pulse Avalanche Energy                                                       (Note 3) 20 mJ<br>PD Power Dissipation                            30 W<br>TJ, TSTG Operating and Storage Temperature -55 to 150 °C<br>Thermal Characteristics<br>po R JC Thermal Resistance, Junction to Case 4.1 °C/W<br>R JA Thermal Resistance, Junction to Ambient                                (Note 1a) 40 °C/W<br>ee O<br>R JA Thermal Resistance, Junction to Ambient                                (Note 1b) 96 °C/W<br>ee<br>Package Marking and Ordering Information<br>Device Marking Device Package Reel Size Tape Width Quantity<br>FDD8451 FDD8451 D-PAK(TO-252) 13’’ 16mm 2500 units<br>LEAD F R E E IMPLE<br>M<br>E<br>N<br>T<br>A<br>NOIT<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2009 Fairchild Semiconductor Corporation FDD8451 Rev. 1.2 

**1** 

**Electrical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [434 x 622] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min|Typ|Max|Units|
|Po|
|Off Characteristics|
|O|BVDSS|Drain to Source Breakdown Voltage|ID = 250|O|A, VGS = 0V|40|V|
|BVDSS|Breakdown Voltage Temperature|ID = 250|A, referenced to|33.5|mV/°C|
|TJ|Coefficient|25°C|
|feG|IDSS|||Zero Gate Voltage Drain Current|VDS = 32V, V|e|GS = 0V|1|A|
|s|IGSS|Gate to Source Leakage Current|VGS = ±20V, V|D|DS = 0V|±100|nA|
|On Characteristics|
|VGS(th)|Gate to Source Threshold Voltage|VGS = VDS, ID = 250|A|1|2.1|3|V|
|ee|
|VGS(th)|Gate to Source Threshold Voltage|ID = 250|A, referenced to|-5.7|mV/°C|
|TJ|Temperature Coefficient|25°C|
|El|ee|VGS = 10V, ID = 9A|19|24|
|r|Drain to Source On Resistance|VGS = 4.5V, ID = 7A|23|30|m|
|DS(on)|
|VGS = 10V, ID = 9A|32|41|
|ee|TJ = 150°C|
|OC|gFS|Forward Transcondductance|VDS = 5V, ID = 9A|ee|29|S|
|Dynamic Characteristics|
|Ciss|Input Capacitance|780|990|pF|
|ee|Coss|Output Capacitance|Vf = 1MHzDS = 20V, VGS = 0V,|a|112|150|pF|
|ee|ee|
|Crss|Reverse Transfer Capacitance|72|110|pF|
|ee|a|
|R|Gate Resistance|f = 1MHz|1.1|
|ee|g|>|
|Switching Characteristics|
|td(on)|Turn-On Delay Time|7|14|ns|
|esee|tr|Rise Time|VVDDGS = 20V, I = 10V, RDGEN = A|;|= 6|eeee|3|10|ee|ns|
|td(off)|Turn-Off Delay Time|a|ee|19|34|ns|
|es|o|L_|||||||||
|tf|Fall Time|e|2|e|10|ns|
|ee|ee|
|Qg|Total Gate Charge at 10V|16|20|nC|
|ee|eeeeee|
|Qg|Total Gate Charge at 5V|VDS= 20V, ID = 9A|8.6|11|nC|
|ee|Qgs|Gate to Source Gate Charge|VGS = 10V|eeee|2.5|nC|ee|
|ee|eeeeee|
|Qgd|Gate to Drain “Miller”Charge|3.7|nC|
|ee|eeee|ee|
|Drain-Source Diode Characteristics|
|GG|VSD|Source to Drain Diode  Forward Voltage|VGS = 0V, IS = 9A|0.87|1.2|V|
|OG|trr|Reverse Recovery Time|IF = 9A, di/dt = 100A/|s|25|38|ns|
|pe|Qrr|Reverse Recovery Charge|IF = 9A, di/dt = 100A/|s|19|29|nC|
|Notes|:|
|1:|R|JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of|
|the drain pins. R|JC|is guaranteed by design while  R|JA is determined by the user’s board design.|
|a)|40 °C/W when mounted|on|a|b)|96 °C/W when|mounted on|
|1 in|[2]|pad of  2 oz|copper|a minimum pad|
|e6eee|©0000|
|eesee|
|2:|Pulse Test: Pulse Width < 300|mM|s, Duty cycle < 2.0%.|
|3:|Starting TJ = 25 °C, L = 0.1 mH, IAS = 20 A, VDD = 36 V, VGS = 10 V.|

**----- End of picture text -----**<br>


www.fairchildsemi.com 

**2** 

FDD8451 Rev. 1.2 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [437 x 602] intentionally omitted <==**

**----- Start of picture text -----**<br>
60 4.0<br>VGS = 10V PULSE DURATION = 80 � s PULSE DURATION = 80 � s<br>50 DUTY CYCLE = 0.5%MAX 3.5 DUTY CYCLE = 0.5%MAX<br>VGS = 4V 3.0<br>40 VGS =  3V VGS = 3.5V<br>VGS = 4.5V 2.5<br>30<br>2.0<br>20 VGS = 3.5V 1.5 VGS = 4V VGS = 5V<br>10 1.0<br>VGS = 3V VGS = 10V<br>0 0.5<br>0 1 2 3 4 0 10 20 30 40 50 60<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized On-Resistance vs Drain<br>Current and Gate Voltage<br>2.0 160<br> ID = 9A ID = 10A PULSE DURATION = 80 � s<br>1.8 VGS = 10V DUTY CYCLE = 0.5%MAX<br>120<br>1.6<br>1.4<br>80<br>1.2<br>1.0 TJ = 175 [o] C<br>40<br>0.8<br>TJ = 25 [o] C<br>0.6 0<br>-80 -40 0 40 80 120 160 200 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized On Resistance vs Junction  Figure 4.   On-Resistance vs Gate to Source<br>Temperature Voltage<br>40 100<br>PULSE DURATION = 80 � s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>10<br>30<br>TJ = 175 [o] C<br>1<br>20<br>TJ = 175 [o] C 0.1 TJ = 25 [o] C<br>10 TJ = 25 [o] C 0.01 TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 1E-3<br>1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.  Source to Drain  Diode Forward<br>Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>�<br>m<br>(<br>, DRAIN TO<br>NORMALIZED rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID<br>, REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDD8451 Rev. 1.2 

**Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [437 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>3000<br>8 1000 Ciss<br>VDD = 15V<br>6 VDD = 20V Coss<br>VDD = 25V<br>4 100<br>Crss<br>2 f = 1MHz<br>VGS = 0V<br>0 10<br>0 4 8 12 16 0.1 1 10 40<br>Qg, GATE CHARGE(nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain to Source VoltageCapacitance vs Drain to Source Voltage<br>100<br>30<br>25<br>TJ = 25 [o] C 20 VGS = 10VGS = 10V = 10V<br>10 TJ = 125 [o] C 15<br>VGS =4.5VGS =4.5V =4.5V<br>10<br>TJ = 150 [o] C<br>5<br>1 R � JC = 4.1 = 4.1 [[o]] C/W<br>0<br>1E-3 0.01 0.1 1 10 100<br>40 60 80 100 120 140 160 175<br>tAV, TIME IN AVALANCHE(ms) TC, CASE TEMPERATURE(C, CASE TEMPERATURE(, CASE TEMPERATURE(( [[o]] C))<br>Figure 9.  Unclamped Inductive Switching  Figure 10.  Maximum Continuous Drain Current vs Maximum Continuous Drain Current vs<br>Capability Case Temperature<br>100 10000<br>100us VGS = 10V TC = 25 [o] C<br>FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>1ms CURRENT AS FOLLOWS:<br>10 1000<br>LIMITED BY I = I25  175 -------------------- 150 – TC -<br>PACKAGE<br>1 OPERATION IN THIS  100<br>AREA MAY BE  10ms<br>LIMITED BY rDS(on)<br>SINGLE PULSE 100ms<br>TJ = MAX RATED DC SINGLE PULSE<br>TC = 25 [O] C<br>0.1 10<br>1 10 80 10-5 10-4 10-3 10-2 10-1 100 101<br>VDS, DRAIN-SOURCE VOLTAGE (V) t, PULSE WIDTH (s)<br>Figure 11.  Forward Bias Safe Operating Area Figure 12.  Single Pulse Maximum Power<br>Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>, AVALANCHE CURRENT(A) , DRAIN CURRENT (A)<br>IAS IDD<br>, DRAIN CURRENT (A)<br> ID , PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


**Figure 8.  Capacitance vs Drain to Source VoltageCapacitance vs Drain to Source Voltage** 

**==> picture [213 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>25<br>20 VGS = 10VGS = 10V = 10V<br>15<br>VGS =4.5VGS =4.5V =4.5V<br>10<br>5<br>R � JC = 4.1 = 4.1 [[o]] C/W<br>0<br>40 60 80 100 120 140 160 175<br>TC, CASE TEMPERATURE(C, CASE TEMPERATURE(, CASE TEMPERATURE(( [[o]] C))<br>Figure 10.  Maximum Continuous Drain Current vs Maximum Continuous Drain Current vs<br>Case Temperature<br>, DRAIN CURRENT (A)<br>IDD<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD8451 Rev. 1.2 

**4** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [430 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>      0.05 PDM<br>0.1       0.02<br>      0.01<br>t1<br>t2<br>SINGLE PULSE NOTES:<br>0.01 DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z �JC  x R �JC  + TC<br>0.005<br>10-5 10-4 10-3 10-2 10-1 100 101<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13.  Transient Thermal Response Curve<br>JA<br>�<br>IMPEDANCE, Z<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD8451 Rev. 1.2 

**5** 

**==> picture [37 x 58] intentionally omitted <==**

**==> picture [37 x 54] intentionally omitted <==**

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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