# Power MOSFET, N Channel, 40 V, 50 A, 8500 µohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2101407/)

**URL**: https://novapart.co/products/FDD8447L/power-mosfet-n-channel-40-v-50-a-8500-ohm-to-252
**SKU**: FDD8447L
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3270
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:50A; Drain Source Voltage Vds:40V; On Resistance Rds(on):0.007ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.9V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 44W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 50A |
| Drain Source On State Resistance | 8500µohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2101407/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [472 x 327] intentionally omitted <==**

**----- Start of picture text -----**<br>
yf March 2015<br>FDD8447L<br>40V N-Channel PowerTrench [®]  MOSFET<br>40V, 50A, 8.5m Ω<br>Features General Description<br>Max rDS(on) = 8.5mΩ at VGS = 10V, ID = 14A This N-Channel MOSFET has been produced using Fairchild<br>Max rDS(on) = 11.0mΩ at VGS = 4.5V, ID = 11A deliver low rSemiconductor’s proprietary PowerTrenchDS(on)  and optimized BVDSS capability to offer  [®]  technology to<br>Fast Switching superior performance benefit in the application.<br>RoHS Compliant<br>Applications<br>Inverter<br>Power Supplies<br>D<br>D<br>G<br>G<br>SB<br>S<br>D-PAK<br>TO -252<br>(TO-252) S<br>**----- End of picture text -----**<br>


**MOSFET Maximum Ratings** TC = 25°C unless otherwise noted 

|**Symbol**<br>**Parameter**|||||||**Ratings**|**Ratings**||**Units**|
|---|---|---|---|---|---|---|---|---|---|---|
|VDS<br>Drain to Source Voltage||||||||40||V|
|VGS<br>Gate to Source Voltage||||||||±20||V|
|Drain Current    -Continuous(Package limited)T|T|TC= 25°C||||||50|||
|ID<br>  -Continuous(Silicon limited)  <br>  -Continuous|<br>|TC= 25°C<br> TA= 25°C|||(Note 1a)||<br> 1|57<br>15.2||A|
|-Pulsed||||||||100|||
|IS<br>Max Pulse Diode Current||||||||100||A|
|EAS<br>Drain-Source Avalanche Energy|||||(Note 3)|||153||mJ|
|Power Dissipation                 TC= 25°C||||||||44|||
|PD<br>  TA= 25°C|= 25°C|= 25°C|= 25°C||(Note 1a)3.1||3.1|3.1||W|
|TA= 25°C|||||(Note 1b)1.3||1.3|1.3|||
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range|||||||-55 to +150|55 to +150||°C|
|**Thermal Characteristics**|||||||||||
|RθJC<br>Thermal Resistance, Junction to Case<br>2.8<br>°C/W<br>RθJA<br>Thermal Resistance, Junction to Ambient(Note 1a)<br>40<br>RθJA<br>Thermal Resistance, Junction to Ambient(Note 1b)96<br>~~ee~~|||||||||||
|**Package Marking and Ordering Information**|||||||||||
|**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FDD8447L<br>FDD8447L<br>D-PAK(TO-252)<br>13’’<br>16mm<br>2500 units<br>~~ee~~|||||||||||



©2008 Fairchild Semiconductor Corporation **1** FDD8447L Rev. 1.2 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrica**|**l Characteristics**TJ= 25°C unless|otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**|||||||
|BVDSS|Drain to Source Breakdown Voltage|ID= 250µA, VGS= 0V|40|||V|
|∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250µA, referenced to 25°C||35||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= 32V,   VGS= 0V|||1|µA|
|IGSS|Gate to Source Leakage Current|VGS= ±20V, VGS= 0V|||±100|nA|
|**On Characteristics**<br> **(Note 2)**|||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS,  ID= 250µA|1.0|1.9|3.0|V|
|∆VGS(th)<br> ∆TJ|Gate to Source Threshold Voltage<br>Temperature Coefficient|ID= 250µA, referenced to 25°C||-5||mV/°C|
|rDS(on)|Static Drain to Source On Resistance|VGS= 10V, ID= 14A||7.0|<br>8.5|mΩ|
|||VGS= 4.5V, ID= 11A||8.5|11.0||
|||VGS= 10V, ID= 14A, TJ=125°C||10.4|14.0||
|gFS|Forward Transconductance|VDS= 5V,  ID= 14A||58||S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= 20V, VGS= 0V,<br>f = 1MHz||1970||pF|
|Coss|Output Capacitance|||250||pF|
|Crss|Reverse Transfer Capacitance|||150||pF|
|Rg|Gate Resistance|f = 1MHz||1.27||Ω|
|**Switching Characteristics**|||||||
|td(on)|Turn-On DelayTime|VDD= 20V, ID= 1A<br>VGS= 10V, RGEN= 6Ω||12|21|ns|
|tr|Rise Time|||12|21|ns|
|td(off)|Turn-Off DelayTime|||38|61|ns|
|tf|Fall Time|||9|18|ns|
|Qg(TOT)|Total Gate Charge, VGS= 10V|VDD= 20V, ID= 14A<br>VGS= 10V||37|52|nC|
|Qg(TOT)|Total Gate Charge, VGS= 5V|||20|28|nC|
|Qgs|Gate to Source Gate Charge|||6||nC|
|Qgd|Gate to Drain “Miller” Charge|||7||nC|
|**Drain-Source Diode Characteristics**|||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current (Note 1a)||||2.6|A|
|VSD|Source to Drain Diode  Forward Voltage<br>|VGS = 0V, IS =14A (Note 2)||0.8|1.2|V|
|trr|Reverse RecoveryTime<br>|IF=14A, di/dt = 100A/µs<br>||22||ns|
|Qrr|<br>Reverse RecoveryCharge|||11||nC|



## **Notes:** 

- **1:** RθJA is the sum of the junction-to-case and case-to- ambient  thermal resistance where the case thermal reference is defined  as the solder mounting surface of the drain pins. RθJC is guaranteed by design  while RθJA is determined by the user’s board design. 

-------------- **-** 

- a. 40°C/W when mounted  on  a 1 in2 pad of  2 oz  copper 

- b. 96°C/W when mounted on  a minimum pad. 

- **2:** Pulse Test: Pulse Width < 30 0 µs, Duty cycle < 2.0%. 

- **3:** Starting TJ = 25 C, L = 1mH, IAS = 17.5A, VDD = 40V, VGS = 10V.[o] 

**4** 

www.fairchildsemi.com 

**2** 

FDD8447L Rev. 1.2 

## **Typical Characteristics** 

**==> picture [429 x 538] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 3<br>VGS = 10V 4.0V VGS = 3.0V<br>2.6<br>80<br>6.0V 4.5V<br>5.0V 2.2<br>60<br>3.5V 1.8<br>40 3.5V<br>1.4 4.0V<br>4.5V 5.0V 6.0V<br>20 10.0V<br>1<br>3.0V<br>0 0.6<br>0 0.5 1 1.5 2 2.5 0 20 40 60 80 100<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage<br>1.6 0.02<br>ID = 14A ID = 7A<br>VGS = 10V 0.0175<br>1.4<br>0.015<br>1.2 TA = 125oC<br>0.0125<br>1<br>0.01<br>TA = 25oC<br>0.8<br>0.0075<br>0.6 0.005<br>-50 -25 T 0 J, JUNCTION TEMPERATURE ( 25 50 75 100 oC) 125 150 2 VGS 4 , GATE TO SOURCE VOLTAGE (V) 6 8 10<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature  Gate-to-Source Voltage<br>1000<br>100<br>VGS = 0V<br>VDS = 5V 100<br>80<br>10<br>60 1<br>TA = 125 [o] C<br>0.1<br>40 25 [o] C<br>TA = 125oC -55oC 0.01<br>-55 [o] C<br>20<br>0.001<br>25oC<br>0 0.0001<br>1 1.5 2 2.5 3 3.5 4 4.5 0 0.2 0.4 0.6 0.8 1 1.2 1.4<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature<br>NORMALIZED<br>, DRAIN CURRENT (A)ID<br>DRAIN-SOURCE ON-RESISTANCE<br> NORMALIZED<br>, ON-RESISTANCE (OHM)<br>rDS(ON)<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDD8447L Rev. 1.2                                                                               3                                                                                     www.fairchildsemi.com 

## **Typical Characteristics** 

**==> picture [426 x 527] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 3000<br>f = 1MHz<br>ID = 14A VDS = 10V 30V VGS = 0 V<br>2500<br>8<br>20V 2000<br>6 Ciss<br>1500<br>4<br>1000<br>Coss<br>2<br>500<br>Crss<br>0 0<br>0 10 20 30 40 0 10 20 30 40<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics  Figure 8. Capacitance Characteristics<br>1000 100<br>SINGLE PULSE<br>RθJA = 96°C/W<br>100 RDS(ON) LIMIT 100µs 80 T A  = 25°C<br>1ms<br>10 10ms 60<br>100ms<br>1s<br>1 DC 40<br>V GS  = 10V<br>0.1 SINGLE PULSE 20<br>RθJA = 96 [o] C/W<br>T A  = 25 [o] C<br>0.01 0<br>0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area  Figure 10. Single Pulse Maximum<br>Power Dissipation<br>100 100<br>SINGLE PULSE<br>80 RθTJAA = 96°C/W = 25°C<br>TJ = 25 [o] C<br>60<br>10<br>40<br>20<br>0 1<br>0.0001 0.001 0.01 0.1 1 10 100 1000 0.1 1 10<br>t1, TIME (sec) tAV, TIME IN AVANCHE(ms)<br>Figure 11. Single Pulse Maximum Peak  Figure 12. Unclamped Inductive Switching<br>Current  Capability<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>, AVALANCHE CURRENT (A)<br>I(AS)<br>I(pk), PEAK TRANSIENT CURRENT (A)<br>**----- End of picture text -----**<br>


FDD8447L Rev. 1.2                                                                                4                                                                                  www.fairchildsemi.com 

## **Typical Characteristics** 

**==> picture [374 x 128] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>D = 0.5 RθJA(t) = r(t) * RθJA<br>0.2 RθJA = 96°C/W<br>0.1 0.1<br>0.05 P(pk)<br>0.02 t1<br>0.01 0.01 SINGLE  TJ - TA t = 2  P * RθJA(t)<br>Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 13. Transient Thermal Response Curve** 

**Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.** 

FDD8447L Rev. 1.2                                                                                5                                                                                  www.fairchildsemi.com 

**==> picture [37 x 58] intentionally omitted <==**

**==> picture [37 x 54] intentionally omitted <==**

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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