# Power MOSFET, N Channel, 40 V, 50 A, 0.007 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2992322RL/)

**URL**: https://novapart.co/products/FDD8447L-F085/power-mosfet-n-channel-40-v-50-a-0007-ohm-to-252
**SKU**: FDD8447L-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8180
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | PowerTrench |
| Qualification | AEC-Q101 |
| Power Dissipation | 65W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 65W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.007ohm |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 50A |
| Drain Source On State Resistance | 0.007ohm |
| Automotive Qualification Standard | AEC-Q101 |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2992322RL/)

## **FDD8447L-F085** 

## **N-Channel PowerTrench[®] MOSFET** 

## **40V, 50A, 11.0m** Ω 

## **Features** 

## **Applications** 

|| Typ rDS(on) = 7.0mΩ at VGS = 10V, ID = 14A Inverter a Typ rDS(on) = 8.5mΩ at VGS = 4.5V, ID = 11A rT Power Supplies 

7 Fast Switching | Automotive Engine Control | Qualified to AEC Q101 2 RoHS Compliant[|] Power Train Management | Solenoid and Motor Drivers | Electronic Transmission 

Primary Switch for 12V and 24V Systems 

**==> picture [251 x 98] intentionally omitted <==**

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D<br>D<br>G<br>G<br>S<br>D-PAK<br>TO-252<br>(TO-252) S<br>**----- End of picture text -----**<br>


Publication Order Number: FDD8447L-F085/D 

© 2009 Semiconductor Components Industries, LLC. September-2017, Rev. 1 

**MOSFET Maximum Ratings** TC = 25°C unless otherwise noted 

|**Symbol**|**Parameter**|**Ratings**|**Units**|
|---|---|---|---|
|VDSS|Drain to Source Voltage<br>(Note 1|)<br>40|V|
|VGS|Gate to Source Voltage|±20|V|
|ID|Drain Current Continuous (TC< 80oC, VGS= 10V)|50|A|
||Pulsed|See Figure 4||
|EAS|Single Pulse Avalanche Energy<br>(Note 2|)<br>40|mJ|
|PD|Power Dissipation|65|W|
||Dreate above 25oC|0.43|W/oC|
|TJ, TSTG|Operatingand Storage Temperature|-55 to + 175|oC|
|**Thermal Characteristics**||||
|RθJC|Maximum Thermal Resistance Junction to Case|2.3|oC/W|
|RθJA|Thermal Resistance Junction to Ambient TO-252, 1in2copper pad area|40|oC/W|



## **Package Marking and Ordering Information** 

|**Device Marking**|**Device**|**Package**|**Reel Size**|**Tape Width**|**Quantity**|
|---|---|---|---|---|---|
|FDD8447L|FDD8447L-F085|D-PAK(TO-252)|13’’|12mm|2500 units|



## **Electrical Characteristics** TC = 25°C unless otherwise noted 

|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Off Characteristics**|||||||
|BVDSS|Drain to Source Breakdown Voltage|ID= 250µA, VGS= 0V|40|-|-|V|
|IDSS|Zero Gate Voltage Drain Current|VDS= 32V, VGS= 0V|-|-|1|µA|
|IGSS|Gate to Source Leakage Current|VGS= ±20V, VGS= 0V|-|-|±100|nA|
|**On Characteristics**|||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS, ID= 250µA|1.0|1.9|3.0|V|
|rDS(on)|Drain to Source On Resistance|ID= 14A, VGS= 10V|-|7.0|8.5|mΩ|
|||ID= 11A, VGS= 4.5V|-|8.5|11.0||
|||ID= 14A, VGS= 10V, TJ= 125°C|-|10.4|14.0||
|gFS|Forward Transconductance|ID= 14A, VDS= 5V|-|58|-|S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= 20V, VGS= 0V,<br>f = 1MHz|-|1970|-|pF|
|Coss|Output Capacitance||-|250|-|pF|
|Crss|Reverse Transfer Capacitance||-|150|-|pF|
|Rg|Gate Resistance|f = 1MHz|-|1.27|-|Ω|
|Qg(TOT)|Total Gate Charge at 10V|VGS= 0 to 10V|-|37|52|nC|
|Qg(5)|Total Gate Charge at 5V|VGS= 0 to 5V|-|20|28|nC|
|Qgs|Gate to Source Gate Charge||-|6|-|nC|
|Qgd|Gate to Drain “Miller“ Charge||-|7|-|nC|



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|**Electrical Characteristics**TC= 25oC unless otherwise noted|**Electrical Characteristics**TC= 25oC unless otherwise noted|**Electrical Characteristics**TC= 25oC unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Switching Characteristics**|||||||
|td(on)|Turn-On DelayTime|VDD= 20 V, ID= 1 A,<br>VGS= 10 V, RGEN= 6Ω|-|12|21|ns|
|tr|Rise Time||-|12|21|ns|
|td(off)|Turn-Off DelayTime||-|38|61|ns|
|tf|Fall Time||-|9|18|ns|
|**Drain-Source Diode Characteristics**|||||||
|VSD|Source to Drain Diode Voltage|ISD= 14A|-|0.8|1.2|V|
|trr|Reverse RecoveryTime|IF= 14A, dISD/dt = 100A/µs|-|22|29|ns|
|Qrr|Reverse RecoveryCharge||-|11|14|nC|



**Notes:** 

- **1:** Starting TJ = 25[o] C to 175[o] C. 

- **2:** Starting TJ = 25[o] C, L = 0.05mH, IAS = 40A 

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## **Typical Characteristics** 

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1.2 70<br>CURRENT LIMITED<br>1.0 60 BY PACKAGE<br>0.8 50 VGS = 10V<br>40<br>0.6<br>30<br>0.4<br>20<br>0.2<br>10<br>0.0 0<br>0 25 50 75 100 125 150 175 25 50 75 100 125 150 175<br>TC, CASE TEMPERATURE( [o] C) TC, CASE TEMPERATURE( [o] C)<br>Figure 1.  Normalized Power Dissipation vs Case  Figure 2.  Maximum Continuous Drain Current vs<br>Temperature       Case Temperature<br>2<br>DUTY CYCLE - DESCENDING ORDER<br>1<br>D = 0.50<br>   0.20<br>   0.10<br>0.1    0.05 PDM<br>   0.02<br>   0.01<br>t1<br>t2<br>0.01 NOTES:<br>DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z θ JA x R θ JA + TC<br>SINGLE PULSE<br>0.001<br>10-5 10-4 10-3 10-2 10-1 1 10<br>t, RECTANGULAR  PULSE DURATION(s)<br>Figure 3.  Normalized Maximum Transient Thermal Impedance<br>, DRAIN CURRENT (A)<br>ID<br>POWER DISSIPATION MULTIPLIER<br>IMPEDANCE, ZJC θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


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1000<br>VGS = 10V TRANSCONDUCTANCE  TC = 25 [o] C<br>MAY LIMIT CURRENT  FOR TEMPERATURES<br>IN THIS REGION ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>I = I2 175 - TC<br>150<br>100<br>SINGLE PULSE<br>10<br>10-5 10-4 10-3 10-2 10-1 1 10<br>t, RECTANGULAR PULSE DURATION(s)<br>PEAK CURRENT (A)<br>,<br>IDM<br>**----- End of picture text -----**<br>


**Figure 4.  Peak Current Capability** 

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## **Typical Characteristics** 

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1000 400 If R = 0<br>tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)<br>If R  ≠ 0<br>100 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]<br>100<br>100us<br>10 STARTING TJ = 25 [o] C<br>OPERATION IN THIS  10<br>AREA MAY BE<br>LIMITED BY rDS(on)<br>1<br>SINGLE PULSE 1ms STARTING TJ = 150 [o] C<br>TJ = MAX RATED<br>10ms<br>0.1 TC = 25 [o] C DC 1<br>0.001 0.01 0.1 1 10 100<br>1 10 100 tAV, TIME IN AVALANCHE (ms)<br>VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 5.  Forward Bias Safe Operating Area Figure 6.  Unclamped Inductive Switching<br>Capability<br>100 100<br>PULSE DURATION = 80 µ s VGS = 10V PULSE DURATION = 80 µ s<br>DUTY CYCLE = 0.5% MAX VGS = 6V DUTY CYCLE = 0.5% MAX<br>80 VDD = 5V 80 VGS = 5V<br>VGS = 4.5V VGS = 3.5V<br>VGS = 4V<br>60 60<br>40 TJ = 175 [o] C 40<br>20 TJ = -55 [o] C 20 VGS = 3V<br>TJ = 25 [o] C<br>0 0<br>1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 0.5 1.0 1.5 2.0 2.5<br>VGS, GATE TO SOURCE VOLTAGE (V) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Transfer Characteristics Figure 8.  Saturation Characteristics<br>40 2.0<br>ID = 14A DUTY CYCLE = 0.5% MAXPULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>1.8 DUTY CYCLE = 0.5% MAX<br>30<br>1.6<br>1.4<br>20<br>TJ = 175 [o] C 1.2<br>10 1.0<br>TJ = 25 [o] C 0.8  ID = 14A<br>0 0.6 VGS = 10V<br>2 4 6 8 10 -80 -40 0 40 80 120 160 200<br>VGS, GATE TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE( [o] C)<br>Figure 9.  Drain to Source On-Resistance Drain to Source On-Resistance  Figure 10.  Normalized Drain to Source On<br>Variation vs Gate to Source Voltage  Resistance vs Junction Temperature<br>, DRAIN CURRENT (A)<br> ID , AVALANCHE CURRENT (A)IAS<br>, DRAIN CURRENT (A)<br>, DRAIN CURRENT (A) ID<br>ID<br>)<br>Ω<br>m<br>(<br>, DRAIN TO SOURCE<br>NORMALIZED<br>ON-RESISTANCE<br>rDS(on)<br> DRAIN TO SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


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Figure 9.  Drain to Source On-Resistance Drain to Source On-Resistance<br>Variation vs Gate to Source Voltage<br>**----- End of picture text -----**<br>


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## **Typical Characteristics** 

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1.4 1.15<br>VGS = VDS ID = 1mA<br>ID = 250 µ A<br>1.2 1.10<br>1.0 1.05<br>0.8 1.00<br>0.6 0.95<br>0.4 0.90<br>-80 -40 0 40 80 120 160 200 -80 -40 0 40 80 120 160 200<br>TJ, JUNCTION TEMPERATURE( [o] C) TJ, JUNCTION TEMPERATURE ( [o] C)<br>Figure 11.  Normalized Gate Threshold Voltage vs  Figure 12.  Normalized Drain to Source<br>Junction Temperature Breakdown Voltage vs Junction Temperature<br>4000 10<br>ID = 14A<br>Ciss<br>8<br>VDD = 10V<br>1000 VDD = 20V<br>6<br>VDD = 30V<br>4<br>Coss<br>2<br>f = 1MHz<br>VGS = 0V Crss<br>100 0<br>0.1 1 10 80 0 8 16 24 32 40<br>VDS, DRAIN TO SOURCE VOLTAGE (V) Qg ,  GATE CHARGE(nC)<br>NORMALIZED GATE<br>THRESHOLD VOLTAGE  BREAKDOWN VOLTAGE<br>NORMALIZED DRAIN TO SOURCE<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 13.  Capacitance vs Drain to Source Voltage** 

**Figure 14.  Gate Charge vs Gate to Source Voltage** 

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**6** 

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