# Power MOSFET, N Channel, 500 V, 6 A, 0.76 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3368736RL/)

**URL**: https://novapart.co/products/FDD6N50TM-F085/power-mosfet-n-channel-500-v-6-a-076-ohm-to-252
**SKU**: FDD6N50TM-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.0100
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | N Channel |
| Qualification | AEC-Q101 |
| Power Dissipation | 89W |
| Transistor Mounting | Surface Mount |
| Drain Source On State Resistance | 0.76ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368736RL/)

## **FDD6N50TM-F085** 

## **500V N-Channel MOSFET** 

## **Features** 

- 6A, 500V, RDS(on) = 0.9Ω @VGS = 10 V 

- Low gate charge ( typical 12.8 nC) 

- Low Crss ( typical  9 pF) 

- Fast switching 

- 100% avalanche tested 

- Improved dv/dt capability 

## **Description** 

These N-Channel enhancement mode power field effect transistors are produced using ON Semiconductor' proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction. 

- Qualified to AEC Q101 

- RoHS Compliant 

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D<br>y<br>i.<br>G S D-PAK<br>**----- End of picture text -----**<br>


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D<br>G<br>S<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|**S**||
|---|---|---|---|
|**Symbol**|**Parameter**|**Ratings**|**Unit**|
|VDSS|Drain-Source Voltage|500|V|
|ID|Drain Current<br>- Continuous (TC= 25°C)<br>- Continuous (TC= 100°C)|6<br>3.8|A<br>A|
|IDM|Drain Current<br>- Pulsed<br>(Note 1)|24|A|
|VGSS|Gate-Source voltage|±30|V|
|EAS|Single Pulsed Avalanche Energy<br>(Note 2)|270|mJ|
|IAR|Avalanche Current<br>(Note 1)|6|A|
|EAR|Repetitive Avalanche Energy<br>(Note 1)|8.9|mJ|
|dv/dt|Peak Diode Recovery dv/dt<br>(Note 3)|4.5|V/ns|
|PD|Power Dissipation<br>(TC= 25°C)<br>- Derate above 25°C|89<br>0.71|W<br>W/°C|
|TJ,TSTG|Operating and Storage Temperature Range|-55 to +150|°C|
|TL|Maximum Lead Temperature for Soldering Purpose,<br>1/8” from Case for 5 Seconds|300|°C|



## **Thermal Characteristics** 

|**Symbol**|**Parameter**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|
|RθJC|Thermal Resistance, Junction-to-Case|--|1.4|°C/W|
|RθJA|Thermal Resistance, Junction-to-Ambient|--|83|°C/W|



©2010 Semiconductor Components Industries, LLC. September-2017, Rev. 3 

Publication Order Number: FDD6N50TM-F085/D 

## **Package Marking and Ordering Information** 

|**Device Marking**|**Device Marking**|**Device**|**Package**|**Package**|**Reel Size**|**Tape Width**|**Tape Width**|**Tape Width**|**Quantity**|**Quantity**|**Quantity**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|FDD6N50||FDD6N50TM-F085|D-PAK||380mm||16mm||2500|||
|**Electrical Characteristics**TC= 25°C unless otherwise noted||||||||||||
|**Symbol**|**Parameter**|||**Conditions**|||**Min.**|**Typ.**||**Max**|**Units**|
|**Off Characteristics**||||||||||||
|BVDSS|Drain-Source Breakdown Voltage|||VGS= 0V, ID= 250µA|||500|--||--|V|
|∆BVDSS<br>/∆TJ|Breakdown Voltage Temperature<br>Coefficient|||ID= 250µA, Referenced to 25°C|||--|0.5||--|V/°C|
|IDSS|Zero Gate Voltage Drain Current|||VDS= 500V, VGS= 0V<br>VDS= 400V, TC= 125°C|||--<br>--|--<br>--||1<br>10|µA<br>µA|
|IGSSF|Gate-Body Leakage Current, Forward|||VGS= 30V, VDS= 0V|||--|--||100|nA|
|IGSSR|Gate-Body Leakage Current, Reverse|||VGS= -30V, VDS= 0V|||--|--||-100|nA|
|**On Characteristics**||||||||||||
|VGS(th)|Gate Threshold Voltage|||VDS= VGS, ID= 250µA|||3.0|--||5.0|V|
|RDS(on)|Static Drain-Source<br>On-Resistance|||VGS= 10V, ID= 3A|||--|0.76||0.9|Ω|
|gFS|Forward Transconductance|||VDS= 40V, ID= 3A<br>(Note 4)|||--|2.5||--|S|
|**Dynamic Characteristics**||||||||||||
|Ciss|Input Capacitance|||VDS= 25V, VGS= 0V,<br>f = 1.0MHz|||--|720||940|pF|
|Coss|Output Capacitance||||||--|95||190|pF|
|Crss|Reverse Transfer Capacitance||||||--|9||13.5|pF|
|**Switching Characteristics**||||||||||||
|td(on)|Turn-On Delay Time|||VDD= 250V, ID= 6A<br>RG= 25Ω<br>(Note 4, 5)|||--|6||20|ns|
|tr|Turn-On Rise Time||||||--|55||120|ns|
|td(off)|Turn-Off Delay Time||||||--|25||60|ns|
|tf|Turn-Off Fall Time||||||--|35||80|ns|
|Qg|Total Gate Charge|||VDS= 400V, ID= 6A<br>VGS= 10V<br>(Note 4, 5)|||--|12.8||16.6|nC|
|Qgs|Gate-Source Charge||||||--|3.7||--|nC|
|Qgd|Gate-Drain Charge||||||--|5.8||--|nC|
|**Drain-Source Diode Characteristics and Maximum Ratings**||||||||||||
|IS|Maximum Continuous Drain-Source Diode Forward Current||||||--|--||6|A|
|ISM|Maximum Pulsed Drain-Source Diode Forward Current||||||--|--||24|A|
|VSD|Drain-Source Diode Forward Voltage|||VGS= 0V, IS= 6A|||--|--||1.4|V|
|trr|Reverse Recovery Time|||VGS= 0V, IS= 6A<br>dIF/dt =100A/µs<br>(Note 4)|||--|275||--|ns|
|Qrr|Reverse Recovery Charge||||||--|1.7||--|µC|



## **NOTES:** 

1. Repetitive Rating: Pulse width limited by maximum junction temperature 

2. IAS = 6A, VDD = 50V, L=13.5mH, RG = 25Ω, Starting TJ = 25°C 

3. ISD ≤ 6A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C 

4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2% 

5. Essentially Independent of Operating Temperature Typical Characteristics 

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## **Typical Performance Characteristics** 

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Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>20<br>Top :         10.0 VVGS<br>8.0V7.5 V 101<br>15 7.0 V<br>6.5 V<br>6.0 V 150∩<br>5.5 V<br>Bottom :    5.0 V 100<br>10<br>25∩<br>-55∩<br>5 ∝ 1. 250 Notes : レ s Pulse Test 10-1<br>2. TC = 25∩ ∝  Note<br> 1. VDS = 40V<br> 2. 250 レ s Pulse Test<br>0<br>0 10 20 30 40 50 10-2<br>2 4 6 8 10<br>VDS, Drain-Source Voltage [V] VGS , Gate-Source Voltage  [V]<br>Figure 3. On-Resistance Variation vs.  Figure 4. Body Diode Forward Voltage<br>Drain Current and Gate Voltage Variation vs. Source Current<br>and Temperature<br>2.5<br>101<br>2.0<br>VGS = 10V<br>1.5<br>100<br>1.0 VGS = 20V<br>150∩ 25∩<br>0.5 ∝  Notes :<br>1. VGS = 0V<br>∝  Note : TJ [ = 25∩] 2. 250 レ s Pulse Test<br>0.0 10-1<br>0 5 10 15 20 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>ID, Drain Current [A] VSD , Source-Drain Voltage  [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>12<br>CCissoss = C = Cgsds + C + Cgdgd (Cds = shorted) VDS = 100V<br>Crss = Cgd 10 VDS = 250V<br>1000 Ciss VDS = 400V<br>8<br>Coss<br>6<br>100<br>Crss<br>∝  Notes : 4<br> 1. VGS = 0 V<br>2. f = 1 MHz<br>2<br>10 ∝  Note : ID [ = 6A]<br>100 101 0 0 5 10 15<br>VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]<br>, Drain Current [A]ID  , Drain Current  [A]ID<br>],Drain-Source On-Resistance<br>ヘ  , Reverse Drain Current  [A]<br> [DS(ON) IDR<br>R<br>Capacitance [pF]<br>, Gate-Source Voltage [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


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Typical Performance Characteristics  (Continued)<br>**----- End of picture text -----**<br>


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Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation<br>vs. Temperature  vs. Temperature<br>1.2 3.0<br>2.5<br>1.1<br>2.0<br>1.0 1.5<br>1.0<br>♦ Notes :<br>0.9  2. I 1. VDGS = 250  = 0 VµA 0.5 ♦ 1. VNotes :GS = 10 V<br>2. ID = 3 A<br>0.8-100 -50 0 50 100 150 200 0.0-100 -50 0 50 100 150 200<br>TJ, Junction Temperature [oC] TJ, Junction Temperature [oC]<br>Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current<br>vs. Case Temperature<br>102 Operation in This Area  8<br>is Limited by R DS(on)<br>10 us<br>101 100 us 6<br>1 ms<br>10 ms<br>100 DC 4<br>∝  Notes :<br>10-1 1. TC = 25 oC 2<br>2. TJ = 150 oC<br>3. Single Pulse<br>10-2100 101 102 103 025 50 75 100 125 150<br>VDS, Drain-Source Voltage [V] TC, Case Temperature [∩]<br>   Figure 11. Transient Thermal Response Curve<br>10 0<br>D=0.5<br>0.2 ∝  N otes :<br>   1. Z  ヨ JC(t) = 1.4 ∩/W  M ax.<br>0.1    2. D uty Factor, D =t 1/t2<br>10 -1 0.05    3. T JM - T C = P DM * Z  ヨ JC(t)<br>0.02<br>0.01 PDM<br>t1<br>t2<br>single pulse<br>10 -210 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1<br>t 1, Square W ave Pulse Duration [sec]<br>, (Normalized) , (Normalized)<br>DSS DS(ON)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br>, Drain Current [A]ID , Drain Current [A]ID<br>(t), Thermal ResponseJC<br>ヨ<br>Z<br>**----- End of picture text -----**<br>


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## **Peak Diode Recovery dv/dt Test Circuit & Waveforms** 

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## **Mechanical Dimensions** 

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Dimensions in Millimeters 

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