# Power MOSFET, N Channel, 30 V, 55 A, 0.0105 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1495268/)

**URL**: https://novapart.co/products/FDD6680AS/power-mosfet-n-channel-30-v-55-a-00105-ohm-to-252
**SKU**: FDD6680AS
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4030
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 60mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 60mW |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0105ohm |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 55A |
| Drain Source On State Resistance | 0.0105ohm |
| Gate Source Threshold Voltage Max | 1.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1495268/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDD6680AS** 

## **30V N-Channel PowerTrench**[®] **SyncFET[™] General Description** 

The FDD6680AS is designed to replace a single MOSFET and Schottky diode in synchronous DC:DC power supplies.  This 30V MOSFET is designed to maximize power conversion efficiency, providing a low RDS(ON)  and low gate charge.  The FDD6680AS includes an integrated Schottky diode using Fairchild’s monolithic SyncFET technology.   The performance of the FDD6680AS as the low-side switch in a synchronous rectifier is indistinguishable from the performance of the FDD6680A in parallel with a Schottky diode. 

## **Applications** 

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March 2015<br>**----- End of picture text -----**<br>


## **Features** 

- 55 A, 30 V      RDS(ON) max= 10.5 mΩ @ VGS = 10 V RDS(ON) max= 13.0 mΩ @ VGS = 4.5 V 

- Includes SyncFET Schottky body diode 

- Low gate charge (21nC typical) 

- High performance trench technology for extremely low RDS(ON) 

- High power and current handling capability 

**==> picture [12 x 80] intentionally omitted <==**

**----- Start of picture text -----**<br>
FDD6680AS<br>**----- End of picture text -----**<br>


- DC/DC converter 

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- Low side notebook 

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**----- Start of picture text -----**<br>
D<br>D<br>G<br>S G<br>TO-252<br>S<br>Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol  Parameter  Ratings  Unit<br>s<br>VDSS Drain-Source Voltage  30  V<br>VGSS Gate-Source Voltage  ±20  V<br>ID Drain Current  – Continuous  (Note 3) 55  A<br>– Pulsed  (Note 1a) 100<br>PD Power Dissipation  (Note 1) 60  W<br>(Note 1a) 3.1<br>(Note 1b) 1.3<br>TJ, TSTG Operating and Storage Junction Temperature Range  –55 to +150  °C<br>Thermal Characteristics<br>RθJC Thermal Resistance, Junction-to-Case  (Note 1)  2.1  °C/W<br>RθJA Thermal Resistance, Junction-to-Ambient   (Note 1a)  40  °C/W<br>Te RθJA Thermal Resistance, Junction-to-Ambient   (Note 1b)  96  °C/W<br>Package Marking and Ordering Information<br>Device Marking Device  Reel Size  Tape width  Quantity<br>FDD6680AS FDD6680AS 13’’  16mm   2500 units<br>a a<br>©2008 Fairchild Semiconductor Corporation  FDD6680AS Rev. 1.2<br>**----- End of picture text -----**<br>


||**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted||||**Units**<br>mJ<br>A<br>V<br>mV/°C<br>µA<br>nA<br>V<br>mV/°C<br>mΩ<br>A<br>S<br>pF<br>pF<br>pF<br>Ω<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>nC<br>nC<br>nC<br>nC<br>A<br>V<br>nS<br>nC|
|---|---|---|---|---|---|---|---|
||**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**||
||**Drain-Source Avalanche Ratings (Note 2)**|||||||
||WDSS|Drain-Source Avalanche Energy|Single Pulse, VDD= 15 V,<br>ID=13.5A||54|205||
||IAR|Drain-Source Avalanche Current||||13.5||
||**OffCharacteristics**|||||||
||BVDSS|Drain–Source Breakdown<br>Voltage|VGS= 0 V, ID= 1 mA|30||||
||∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 1 mA, Referenced to 25°C||29|||
||IDSS|Zero Gate Voltage Drain Current|VDS= 24 V,<br>VGS= 0 V|||500||
||IGSS|Gate–BodyLeakage|VGS=±20 V,<br>VDS= 0 V|||±100||
||**On Characteristics**<br>**(Note 2)**|||||||
||VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= 1 mA|1|1.4|3||
||∆VGS(th)<br> <br>∆TJ|Gate Threshold Voltage<br>Temperature Coefficient|ID= 1 mA, Referenced to 25°C||–3|||
||RDS(on)|Static Drain–Source<br>On–Resistance|VGS= 10 V,<br>ID= 12.5 A<br>VGS= 4.5 V,<br>ID= 10 A<br>VGS= 10 V, ID= 12.5A, TJ= 125°C||8.6<br>10.3<br>12.5|10.5<br>13.0<br>16.0||
||ID(on)|On–State Drain Current|VGS= 10 V,<br>VDS= 5 V|50||||
||gFS|Forward Transconductance|VDS= 15 V,<br>ID= 12.5 A||44|||
||**Dynamic Characteristics**|||||||
||Ciss|Input Capacitance|VDS= 15 V,<br>VGS= 0 V,<br>f = 1.0 MHz||1200|||
||Coss|Output Capacitance|||350|||
||Crss|Reverse Transfer Capacitance|||120|||
||RG<br>Gate Resistance<br>VGS= 15 mV,<br>f = 1.0 MHz<br>**Switching Characteristics (Note 2)**|Gate Resistance|VGS= 15 mV,<br>f = 1.0 MHz||1.6|||
|||||||||
||td(on)|Turn–On DelayTime|VDD= 15 V,<br>ID= 1 A,<br>VGS= 10 V,<br>RGEN= 6Ω||10|20||
||tr|Turn–On Rise Time|||6|12||
||td(off)|Turn–Off DelayTime|||28|45||
||tf|Turn–Off Fall Time|||12|22||
||td(on)|Turn–On DelayTime|VDD= 15 V,<br>ID= 1 A,<br>VGS= 4.5 V,<br>RGEN= 6Ω||14|25||
||tr|Turn–On Rise Time|||13|23||
||td(off)|Turn–Off DelayTime|||20|32||
||tf|Turn–Off Fall Time|||11|20||
||Qg(TOT)|Total Gate Charge at Vgs=10V|VDD= 15 V,    ID= 12.5 A||21|29||
||Qg|Total Gate Charge at Vgs=5V|||11|15||
||Qgs|Gate–Source Charge|||3|||
||Qgd|Gate–Drain Charge|||4|||
||**Drain–Source Diode Characteristics and Maximum Ratings**|||||||
||IS|Maximum Continuous Drain–Source Diode Forward Current||||4.4||
||VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 4.4 A<br>(Note 2)<br>VGS=0V,<br>IS= 7 A<br>(Note 2)||0.5<br>0.6|0.7||
||trr|Diode Reverse Recovery Time|IF= 12.5A,<br>diF/dt= 300 A/µs<br>(Note 3)||17|||
||Qrr|Diode Reverse RecoveryCharge|||11|||
|||||||||



FDD6680AS Rev. 1.2 

**Electrical Characteristics** TA = 25°C unless otherwise noted 

## **Notes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

**==> picture [86 x 75] intentionally omitted <==**

- a) RθJA = 40°C/W when mounted on a b) RθJA = 96°C/W when mounted 1in[2] pad of 2 oz copper on a minimum pad. 

Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

- PD 

- **3.** Maximum current is calculated as: R DS(ON) 

where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V.   Package current limitation is 21A 

FDD6680AS Rev. 1.2 

## **Typical Characteristics** 

**==> picture [428 x 540] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 2<br>VGS = 10V 4.0V VGS = 3.0V<br>80 1.8<br>6.0V 4.5V 3.5V<br>1.6<br>60<br>1.4 3.5V<br>4.0V<br>40<br>3.0V 4.5V<br>1.2 5.0V<br>6.0V<br>20 10V<br>1<br>2.5V<br>0 0.8<br>0 0.5 1 1.5 2 2.5 3 0 20 40 60 80 100<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>1.6 0.032<br>ID = 12.5A<br>VGS =10V ID = 6.3A<br>1.4<br>0.026<br>1.2<br>0.02<br>1 TA = 125 [o] C<br>0.014<br>0.8<br>TA =25 [o] C<br>0.6 0.008<br>-50 -25 0 25 50 75 100 125 150 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>100 100<br>VDS = 5V VGS = 0V<br>80<br>10<br>60<br>1 TA = 125 [o] C<br>40 TA = 125 [o] C<br>25 [o] C<br>-55 [o] C<br>0.1 -55 [o] C<br>20<br>25 [o] C<br>0 0.01<br>1 1.5 2 2.5 3 3.5 4 4.5 0 0.2 0.4 0.6 0.8 1<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics.  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>, NORMALIZED<br>, DRAIN CURRENT (A) ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


FDD6680AS Rev. 1.2 

## **Typical Characteristics** (continued) 

**==> picture [426 x 535] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 1800<br>f = 1MHz<br>ID = 12.5A VDS = 10V 1500 VGS = 0 V<br>8<br>20V<br>1200<br>6 Ciss<br>15V 900<br>4<br>600 Coss<br>2<br>300 C rss<br>0 0<br>0 5 10 15 20 25 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>1000 100<br>SINGLE PULSE<br>100 RDS(ON) LIMIT 100us 80 RθTJAA = 96°C/W = 25°C<br>1ms<br>10 100ms 10ms 60<br>1s<br>10s<br>1 DC 40<br>V GS  = 10V<br>SINGLE PULSE<br>0.1 RθJA = 96 [o] C/W 20<br>T A = 25 [o] C<br>0.01 0<br>0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5 RθJA(t) = r(t) * RθJA<br>0.2 R θJA  = 96 °C/W<br>0.1 0.1<br>0.05<br>P(pk<br>0.02<br>0.01 t1<br>0.01 TJ - TAt2= P * RθJA(t)<br>SINGLE PULSE Duty Cycle, D = t1 / t2<br>0.001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 11. Transient Thermal Response Curve.<br>                                                           Thermal characterization performed using the conditions described in Note 1b.<br>                                                           Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br>


FDD6680AS Rev. 1.2 

## **Typical Characteristics** (continued) 

## **SyncFET Schottky Body Diode Characteristics** 

Fairchild’s SyncFET process embeds a Schottky diode in parallel with PowerTrench MOSFET.  This diode exhibits similar characteristics to a discrete external Schottky diode in parallel with a MOSFET.  Figure 12 shows the reverse recovery characteristic of the FDD6680AS. 

**==> picture [118 x 363] intentionally omitted <==**

**----- Start of picture text -----**<br>
10nS/div<br>reverse recovery characteris<br>SyncFET (FDD6680).<br>10nS/div<br>Current:  3A/div<br>Current:  3A/div<br>**----- End of picture text -----**<br>


**Figure 12. FDD6680AS SyncFET body diode reverse recovery characteris** 

For comparison purposes, Figure 13 shows the reverse recovery characteristics of the body diode of an equivalent size MOSFET produced without SyncFET (FDD6680). 

Schottky barrie diodes exhibit significant leakage at high temperature and high reverse voltage. This will increase the power in the device. 

**==> picture [193 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.1<br>TA = 125 [o] C<br>0.01<br>0.001<br>TA = 100 [o] C<br>0.0001<br>0.00001 TA = 25 [o] C<br>0.000001<br>0 5 10 15 20 25 30<br>VDS, REVERSE VOLTAGE (V)<br>, REVERSE LEAKAGE CURRENT (A)<br>IDSS<br>**----- End of picture text -----**<br>


**Figure 14. SyncFET body diode reverse leakage versus drain-source voltage and temperature.** 

**Figure 13. Non-SyncFET (FDD6680) body diode reverse recovery characteristic.** 

FDD6680AS Rev. 1.2 

## **Typical Characteristics** 

**==> picture [418 x 519] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VDS  BVDSS<br>VGS  tP VDS<br>RGE DUT + IAS<br>VDD  VDD<br>0V -<br>VGS  tp IAS<br>vary tP to obtain<br>required peak IAS  0.01Ω<br>tAV<br>Figure 12. Unclamped Inductive Load Test      Figure 13. Unclamped Inductive<br>Circuit  Waveforms<br>Drain Current<br>Same type as<br>+<br>50kΩ<br>10V<br>-  10µF  1µF  +<br>- VDD  QG(TOT)<br>VGS  10V<br>DUT<br>VGS  QGS  QGD<br>I<br>g(REF<br>Charge, (nC)<br>Figure 14. Gate Charge Test Circuit  Figure 15. Gate Charge Waveform<br>tON  tOFF<br>RL  td(ON)  td(OFF<br>VDS  VDS  90% tr ) tf 90%<br>VGS  +<br>10% 10%<br>RGEN  DUT VDD  0V<br>- 90%<br>VGS<br>VGS  50% 50%<br>Pulse Width ≤ 1µs<br>Duty Cycle ≤ 0.1% 0V 10% Pulse Width<br>Figure 16. Switching Time Test  Figure 17. Switching Time Waveforms<br>Circuit<br>**----- End of picture text -----**<br>


FDD6680AS Rev. 1.2 

**==> picture [37 x 58] intentionally omitted <==**

**==> picture [37 x 54] intentionally omitted <==**

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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