# Power MOSFET, P Channel, 35 V, 13 A, 0.0116 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2453400RL/)

**URL**: https://novapart.co/products/FDD6637/power-mosfet-p-channel-35-v-13-a-00116-ohm-to-252
**SKU**: FDD6637
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8010
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-13A; Drain Source Voltage Vds:-35V; On Resistance Rds(on):0.0097ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 57W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 35V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 13A |
| Drain Source On State Resistance | 0.0116ohm |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453400RL/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [50 x 7] intentionally omitted <==**

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March 2015<br>**----- End of picture text -----**<br>


## **FDD6637** 

## **35V P-Channel PowerTrench[] MOSFET** 

## **General Description** 

## **Features** 

- This P-Channel MOSFET has been produced using • –55 A, –35 V RDS(ON) = 11.6 mΩ @ VGS = –10 V Fairchild Semiconductor’s proprietary PowerTrench RDS(ON) = 18 mΩ @ VGS = –4.5 V technology to deliver low Rdson and optimized Bvdss • High performance trench technology for extremely 

- capability to offer superior performance benefit in the applications. low RDS(ON)DS(ON) 

   - High performance trench technology for extremely low RDS(ON)DS(ON) 

   - • RoHS Compliant Yot REE _e N 3 

   - s A 

   - **D** 

   - **G S** 

## **Applications** 

- Inverter 

- Power Supplies 

**==> picture [87 x 62] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>G<br>S<br>D-PAKTO-252<br>(TO-252)<br>**----- End of picture text -----**<br>


**Absolute Maximum Ratings** T A=25[o] C unless otherwise noted 

|**Symbol**|**Parameter**|||**Ratings **|**Ratings **||**Units**|
|---|---|---|---|---|---|---|---|
|VDSS|Drain-Source Voltage||||–35||V|
|VDS(Avalanche)|Drain-Source Avalanche Voltage (maximum)|Drain-Source Avalanche Voltage (maximum)<br> (Note 4)|||–40||V|
|VGSS|Gate-Source Voltage||||±25||V|
|ID|Continuous Drain Current<br>@TC=25°C|=25°C(Note 3)|||–55||A|
||@TA=25°C|=25°C(Note 1a)|||–13|||
||Pulsed|(Note 1a)|||–100|||
|PD|Power Dissipation<br>@TC=25°C|=25°C(Note 3)|||57||W|
||@TA=25°C|(Note 1a)|||3.1|||
||@TA=25°C|(Note 1b)|||1.3|||
|TJ, TSTG|Operating and Storage Junction Temperature Range|Operating and Storage Junction Temperature Range||–55 to +150|||°C|
|**Thermal Characteristics**|**Thermal Characteristics**|||||||
|RθJC|Thermal Resistance, Junction-to-Case|(Note 1)|||2.2||°C/W|
|RθJA|Thermal Resistance, Junction-to-Ambient|(Note 1a)|||40|||
|RθJA|Thermal Resistance, Junction-to-Ambient|(Note 1b)|||96|||
|**Package Marking and Ordering Information**||||||||
|**Device Marking**<br>**Device**<br>**Package**|||**Reel Size**|**Reel Size**|**Tape width**|**Quantity**||
|FDD6637<br>FDD6637<br>D-PAK (TO-252)|||13’’||16mm|2500 units||



2006 Fairchild Semiconductor Corporation FDD6637 Rev. 1.2 

www.fairchildsemi.com 

||**Electrical Characteristics**|**Electrical Characteristics**|TA= 25°C unless otherwise noted||||**Units**<br>mJ<br>A<br>V<br>µA<br>nA<br>V<br>mΩ<br>S<br>pF<br>pF<br>pF<br>Ω<br>ns<br>ns<br>ns<br>ns<br>nC<br>nC<br>nC<br>nC|
|---|---|---|---|---|---|---|---|
||**Symbol**<br>**Parameter**<br>**Drain-Source Avalanche Ratings **|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**||
|||||||||
||EAS|Drain-Source Avalanche Energy<br>(SinglePulse)|VDD= -35 V,  ID= -11 A,  L=1mH||61|||
||IAS|Drain-Source Avalanche Current|||–14|||
||**Off Characteristics(Note 2)**|||||||
||BVDSS|Drain–Source Breakdown<br>Voltage|VGS= 0 V,<br>ID= –250µA|–35||||
||IDSS|Zero Gate Voltage Drain Current|VDS= –28  V, VGS= 0 V|||–1||
||IGSS|Gate–Body Leakage|VGS=±25 V,<br>VDS= 0 V|||±100||
||**On Characteristics**<br>**(Note 2)**|||||||
||VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= –250µA|–1|–1.6|–3||
||RDS(on)|Static Drain–Source<br>On–Resistance|VGS= –10 V,<br>ID= –14 A<br>VGS= –4.5 V,<br>ID= –11 A<br>VGS= –10V,ID= –14 A,TJ=125°C||9.7<br>14.4<br>14.7|11.6<br>18<br>19||
||gFS|Forward Transconductance|VDS=–5 V,      ID= –14 A||35|||
||**Dynamic Characteristics**|||||||
||Ciss|Input Capacitance|VDS= –20 V,<br>VGS= 0 V,<br>f = 1.0 MHz||2370|||
||Coss|Output Capacitance|||470|||
||Crss|Reverse Transfer Capacitance|||250|||
||RG|Gate Resistance|f = 1.0 MHz||3.6|||
||**Switching Characteristics**<br>**(Note 2)**|||||||
||td(on)|Turn–On Delay Time|VDD= –20 V,<br>ID= –1 A,<br>VGS= –10 V,<br>RGEN= 6Ω||18|32||
||tr|Turn–On Rise Time|||10|20||
||td(off)|Turn–Off Delay Time|||62|100||
||tf|Turn–Off Fall Time|||36|58||
||Qg|Total Gate Charge, VGS= –10V|VDS= – 20 V,   ID= –14 A||45|63||
||Qg|Total Gate Charge, VGS= –5V|||25|35||
||Qgs|Gate–Source Charge|||7|||
||Qgd|Gate–Drain Charge|||10|||
|||||||||



www.fairchildsemi.com 

FDD6637 Rev. 1.2 

|**Electrical Characteristics**|**Electrical Characteristics**|TA= 25°C unless otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Drain–Source Diode Characteristics**|||||||
|VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V, IS= –14 A(Note 2)||–0.8|–1.2|V|
|trr|Diode Reverse Recovery Time|IF = –14  A,<br>diF/dt = 100 A/µs||28||ns|
|Qrr|Diode Reverse Recovery Charge|||15||nC|



- **Notes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design while RθCA is determined by the user's board design. 

**==> picture [73 x 73] intentionally omitted <==**

   - a) RθJA = 40°C/W when mounted on a b) RθJA = 96°C/W when mounted 1in[2] pad of 2 oz copper on a minimum pad. 

- Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

- PD 

- **3.** Maximum current is calculated as: R DS(ON) where PD is maximum power dissipation at T C = 25°C and RDS(on) is at T J(max) and VGS = 10V.   Package current limitation is 21A 

**4.** BV(avalanche) Single-Pulse rating is guaranteed if device is operated within the UIS SOA boundary of the device. 

www.fairchildsemi.com 

FDD6637 Rev. 1.2 

## **Typical Characteristics** 

**==> picture [424 x 538] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 2.4<br>VGS = -10V -6.0V -5.0V VGS = -3.5V<br>-4.5V 2.2<br>80<br>2<br>60 -4. 0 V 1.8<br>1.6  -4.0V<br>40 -3.5V 1.4  -4.5V  -5.0V<br> -6. 0V<br>1.2<br>20 -3.0V  -8 .0V -10V<br>1<br>0 0.8<br>0 1 2 3 4 0 20 40 60 80 100<br>-VDS, DRAIN-SOURCE VOLTAGE (V) -I D, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage<br>1.8 0.05<br>ID = -14A<br>V GS  = -10V ID = -7A<br>1.6<br>0.04<br>1.4<br>0.03<br>1.2 TA = 125oC<br>0.02<br>1<br>TA = 25 [o] C<br>0.01<br>0.8<br>0.6 0<br>-50 -25 T 0 J, JUNCTION TEMPERATURE ( 25 50 75 o 100 C) 125 150 2 -V 4 GS, GATE TO SOURCE VOLTAGE (V) 6 8 10<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature  Gate-to-Source Voltage<br>100 1000<br>VDS = -5V VGS = 0V<br>100<br>80 TA = -55 oC 125oC 10<br>60 1 T A  = 125 [o] C<br>25oC<br>40 0.1 25oC<br>0.01 -55oC<br>20<br>0.001<br>0 0.0001<br>1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD,  BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5. Transfer Characteristics  Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature<br>NORMALIZED<br>, DRAIN CURRENT (A)D<br>-I<br>DRAIN-SOURCE ON-RESISTANCE<br>NORMALIZED<br>, ON-RESISTANCE (OHM)<br>DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I<br>, REVERSE DRAIN CURRENT (A)-IS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD6637 Rev. 1.2 

**==> picture [431 x 574] intentionally omitted <==**

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Typical Characteristics<br>10 3200<br>ID = -14A VDS = 10V f = 1MHz<br>30V VGS = 0 V<br>8<br>2400<br>20V Ciss<br>6<br>1600<br>4<br>Coss<br>800<br>2<br>Crss<br>0 0<br>0 10 20 30 40 50 0 5 10 15 20 25 30<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics  Figure 8. Capacitance Characteristics<br>1000 100<br>SINGLE PULSE<br>Rθ JA = 96°C/W<br>100 1ms100µs 80 TA = 25°C<br>RDS(ON) LIMIT 10ms<br>10 100ms 60<br>1s<br>10s<br>1 DC 40<br>V GS  = -10V<br>SINGLE PULSE<br>0.1 RθJA = 96 o C/W 20<br>TA = 25oC<br>0<br>0.01 0.01 0.1 1 10 100 1000<br>0 0 1 10 100<br>-VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area  Figure 10. Single Pulse Maximum<br>Power Dissipation<br>100 1000<br>SINGLE PULSE<br>Rθ JA = 96°C/W<br>80 TA = 25°C<br> TJ = 25oC<br>100<br>60<br>40<br>10<br>20<br>0 1<br>0.01 0.1 1 10 100 1000 0.001 0.01 0.1 1 10<br>t1, TIME (sec) tAV, TIME IN AVANCHE(ms)<br>Figure 11. Single Pulse Maximum Peak<br>Current  Figure 12. Unclamped Inductive<br>Switching Capability<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>-V<br>, DRAIN CURRENT (A)D<br>-I<br>P(pk), PEAK TRANSIENT POWER (W)<br>, AVALANCHE CURRENT<br>I(AS)<br>I(pk), PEAK TRANSIENT CURRENT (A)<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD6637 Rev. 1.2 

## **Typical Characteristics** 

**==> picture [414 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>D = 0 5<br>R [θ] JA(t) = r(t) * R [θ] JA<br>0.2<br>R [θ] JA = 96 °C/W<br>0.1 0.1<br>0.05<br>P(pk)<br>0.02<br>0 01 t1<br>0.01 t2<br>SINGLE PULSE TJ - TA = P * R [θ] JA(t)<br>Duty Cycle, D = t1 / t2<br>0.001<br>0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 13. Transient Thermal Response Curve<br>                                                          Thermal characterization performed using the conditions described in Note 1b.<br>                                                          Transient thermal response will change depending on the circuit board design.<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD6637 Rev. 1.2 

## **Test Circuits and Waveforms** 

**==> picture [422 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDS  L BVDSS<br>tP<br>VG  VDS<br>RGEN  DUT -  IAS<br>VDD  VDD<br>0V +<br>VGS  tp IAS<br>vary tP to obtain<br>required peak IAS  0.01Ω<br>tAV<br>Figure 14. Unclamped Inductive Load Test  Figure 15. Unclamped Inductive Waveforms<br>Circuit<br>**----- End of picture text -----**<br>


**==> picture [426 x 337] intentionally omitted <==**

**----- Start of picture text -----**<br>
Drain Current Regulator<br>Same type as DUT<br>- 50kΩ 10V QG<br>10V<br>+  10µF  1µF  - VDD  VGS QGS QGD<br>+<br>VG<br>DUT<br>Ig(REF)  Charge, (nC)<br>Figure 16. Gate Charge Test Circuit  Figure 17. Gate Charge Waveform<br>VDS  RL  tON tOFF<br>t<br>d(ON) t<br>d(OFF)<br>VGS  - VDS tr tf<br>RGEN  DUT VDD  90% 90%<br>+<br>VGS  0V 10% 10%<br>Pulse Width ≤ 1µs<br>Duty Cycle ≤ 0.1% 90%<br>VGS<br>50% 50%<br>Pulse Width<br>10%<br>0V<br>Figure 18. Switching Time Test Circuit  Figure 19. Switching Time Waveforms<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

FDD6637 Rev. 1.2 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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