# Power MOSFET, N Channel, 60 V, 37 A, 0.018 ohm, TO-252AA, Surface Mount

![Product image](https://novapart.co/image/farnell:3003913/)

**URL**: https://novapart.co/products/FDD5810-F085/power-mosfet-n-channel-60-v-37-a-0018-ohm-to-252aa
**SKU**: FDD5810-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6710
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | Trench |
| Qualification | AEC-Q101 |
| Power Dissipation | 72W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 72W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.018ohm |
| Transistor Case Style | TO-252AA |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 37A |
| Drain Source On State Resistance | 0.018ohm |
| Automotive Qualification Standard | AEC-Q101 |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3003913/)

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-<br>FDD5810 F085<br>N-Channel Logic Level Trench [®] MOSFET<br>60V, 36A, 27m<br>Applications<br>Features Motor / Body Load Control<br>RDS(ON) = 22m Typ.), VGS = 5V, ID = 29A ABS Systems<br>Qg(5) = 13nC (Typ.), VGS = 5V Powertrain Management<br>Injection System<br>Low Miller Charge<br>DC-DC converters and Off-line UPS<br>Low Qrr Body Diode<br>Distributed Power Architecture and VRMs<br>UIS Capability (Single Pulse / Repetitive Pulse)<br>Primary Switch for 12V and 24V systems<br>Qualified to AEC Q101<br>RoHS Compliant<br>D<br>D<br>G<br>G<br>S<br>D-PAKTO-252<br>Se ©<br>(TO-252) S<br>Publication Order Number:<br>©2010 Semiconductor Components Industries, LLC. FDD5810-F085/D<br> September-2017, Rev. 1<br>LEAD F R E E IMPLE<br>M<br>E<br>N<br>T<br>A<br>NOIT<br>**----- End of picture text -----**<br>


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FDD5810<br>-<br>F085<br> N-Channel Logic Level Trench<br>®<br> MOSFET<br>**----- End of picture text -----**<br>


|**Absolute Maximum Ratings  **TC= 25°C unless otherwise noted|**Absolute Maximum Ratings  **TC= 25°C unless otherwise noted|**Absolute Maximum Ratings  **TC= 25°C unless otherwise noted|**Absolute Maximum Ratings  **TC= 25°C unless otherwise noted|
|---|---|---|---|
|**Symbol**|**Parameter**|**Ratings**|**Units**|
|VDSS|Drain to Source Voltage|60|V|
|VGS|Gate to Source Voltage|�20|V|
|ID|Drain Current Continuous (VGS= 10V)|37|A|
||Drain Current Continuous (VGS= 5V)|33|A|
||Continuous (TA= 25oC, VGS= 10V, with R�JA= 52oC/W)|7.4|A|
||Pulsed|Figure 4|A|
|EAS|Single Pulse Avalanche Energy(Note 1)|45|mJ|
|PD|Power Dissipation|72|W|
||Derate above 25oC|0.48|W/oC|
|TJ, TSTG|Operatingand Storage Temperature|-55 to 175|oC|
|**Thermal**|**Characteristics**|||
|R�JC|Maximum Thermal resistance Junction to Case TO-252|2.1|oC/W|
|R�JA|Thermal Resistance Junction to Ambient TO-252, 1in2copper pad area|52|oC/W|



## **Package Marking and Ordering Information** 

|**Device Marking**|**Device Marking**|**Device**|**Package**|**Package**|**Reel Size**|**Reel Size**|**Tape Width**|**Tape Width**|**Quantity**|**Quantity**|**Quantity**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|FDD5810||FDD5810-F085|TO-252AA||330mm||16mm||2500 units|||
|**Electrical Characteristics**TJ= 25°C unless otherwise noted||||||||||||
|**Symbol**|**Parameter**|||**Test Conditions**|||**Min**|**Typ**||**Max**|**Units**|
|**Off Characteristics**||||||||||||
|BVDSS|Drain to Source Breakdown Voltage|||ID= 250�A, VGS= 0V|||60|-||-|V|
|IDSS|Zero Gate Voltage Drain Current|||VDS= 48V<br>VGS= 0V|||-|-||1|�A|
|||||||TC= 150oC|-|-||250||
|IGSS|Gate to Source Leakage Current|||VGS=�20V|||-|-||�100|nA|
|**On Characteristics**||||||||||||
|VGS(TH)|Gate to Source Threshold Voltage|||VGS= VDS, ID=||250�A|1|1.6||2|V|
|RDS(ON)|Drain to Source On Resistance|||ID= 32A, VGS=||10V|-|18||22|m�|
|||||ID= 29A, VGS=||5V|-|22||27||
|||||ID= 32A, VGS=<br>TJ= 175oC||10V,|-|43||53||
|**Dynamic Characteristics**||||||||||||
|Ciss|Input Capacitance|||VDS= 25V, VGS <br>f = 1MHz||= 0V,|-|1420||1890|pF|
|Coss|Output Capacitance||||||-|150||200|pF|
|Crss|Reverse Transfer Capacitance||||||-|65||100|pF|
|RG|Gate Resistance|||f = 1MHz|||-|3.5||-|�|
|Qg|Total Gate Charge at 10V|||VGS= 0V to 10V|||-|24||34|nC|
|Qg|Total Gate Charge at 5V|||VGS= 0V to 5V|||-|13||18|nC|
|Qg(th)|Threshold Gate Charge|||VGS= 0V to 1V|||-|1.3||-|nC|
|Qgs|Gate to Source Gate Charge||||||-|4.0||-|nC|
|Qgs2|Gate Charge Threshold to Plateau||||||-|2.7||-|nC|
|Qgd|Gate to Drain “Miller” Charge||||||-|5.0||-|nC|



**www.onsemi.com** 

**2** 

## **Switching Characteristics** 

|**Switching**|**Characteristics**||||||
|---|---|---|---|---|---|---|
|ton|Turn-On Time|VDD= 30V, ID= 35A<br>VGS= 5V, RGS= 11�|-|-|130|ns|
|td(on)|Turn-On DelayTime||-|12|-|ns|
|tr|Rise Time||-|75|-|ns|
|td(off)|Turn-Off DelayTime||-|26|-|ns|
|tf|Fall Time||-|34|-|ns|
|toff|Turn-Off Time||-|-|90|ns|
|**Drain-Source Diode Characteristics**|||||||
|VSD|Source to Drain Diode Voltage|ISD= 32A|-|-|1.25|V|
|||ISD= 16A|-|-|1.0|V|
|trr|Reverse Recovery Time|IF= 35A, di/dt = 100A/�s|-|-|39|ns|
|Qrr|Reverse Recovery Charge|IF= 35A, di/dt = 100A/�s|-|-|35|nC|



**Notes:** 

**1:** Starting TJ  = 25°C, L = 110µH, IAS = 28A, VDD = 54V, VGS = 10V. 

**www.onsemi.com 3** 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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1.2 40<br>1.0<br>30<br>0.8 VGS = 10V<br>0.6 20 VGS = 5V<br>0.4<br>10<br>0.2<br>0 0<br>0 25 50 75 100 125 150 175 25 50 75 100 125 150 175<br>TC, CASE TEMPERATURE ( [o] C) TC, CASE TEMPERATURE( [o] C)<br>Figure 1.  Normalized Power Dissipation vs Case  Figure 2.  Maximum Continuous Drain Current vs<br>Temperature Case Temperature<br>2<br>DUTY CYCLE - DESCENDING ORDER<br>1 0.5<br>0.2<br>0.1<br>0.05<br>0.02<br>0.01<br>PDM<br>0.1<br>t 1<br>t 2<br>SINGLE PULSE NOTES:<br>DUTY FACTOR: D = t 1 /t 2<br>PEAK TJ = PDM x R � JC + TC<br>0.01<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1]<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 3.  Normalized Maximum Transient Thermal Impedance<br>600<br>TRANSCONDUCTANCE T C  = 25 [o] C<br>MAY LIMIT CURRENT<br>IN THIS REGION FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>CURRENT AS FOLLOWS:<br>I = I25  175 - TC<br>150<br>100<br>V GS  = 5V<br>30<br>10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0] 10 [1]<br>t, PULSE WIDTH (s)<br>Figure 4.  Peak Current Capability<br>, DRAIN CURRENT (A)<br>ID<br>POWER DISSIPATION MULTIPLIER<br>, NORMALIZED<br>ZJC �<br>THERMAL IMPEDANCE<br>, PEAK CURRENT (A)<br>IDM<br>**----- End of picture text -----**<br>


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Figure 1.  Normalized Power Dissipation vs Case  Figure 2.  Maximum Continuous Drain Current vs<br>Temperature Case Temperature<br>**----- End of picture text -----**<br>


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Typical Characteristics  TJ = 25°C unless otherwise noted<br>**----- End of picture text -----**<br>


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200 500<br>100 10us If R = 0 t AV  = (L)(I AS )/(1.3*RATED BV DSS  - V DD )<br>If R ��  0<br>100 tAV = (L/R)ln[(IAS * R)/(1.3 * RATED BVDSS - VDD) +1]<br>10<br>100us<br>OPERATION IN THIS<br>AREA MAY BE<br>LIMITED BY rDS(on) STARTING TJ = 25 [o] C<br>10<br>1 SINGLE PULSE 1ms<br>TTCJ = MAX RATED= 25 [o] C 10ms STARTING TJ = 150 [o] C<br>DC<br>0.1 1<br>1 10 100 200 0.001 0.01 0.1 1 10 100<br>VDS, DRAIN TO SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (ms)<br>Figure 5.  Forward Bias Safe Operating Area NOTE: Refer to  ON Semiconductor  Application Notes AN7514 and<br>AN7515<br>Figure 6.  Unclamped Inductive Switching<br>Capability<br>60 60<br>PULSE DURATION = 80 � s VGS = 10V VGS = 4.5V<br>DUTY CYCLE = 0.5% MAX<br>VDD = 6V<br>VGS = 5V<br>VGS = 4V<br>40 40<br>TJ = 25 [o] C VGS = 3.5V<br>20 20<br>VGS = 3V<br> TJ = 175 [o] C T J = -55 [o] C DUTY CYCLE = 0.5% MAXPULSE DURATION = 80 � s  TC = 25 [o] C<br>0 0<br>0 1.0 2.0 3.0 4.0 5.0 0 0.5 1.0 1.5 2.0 2.5<br>VGS, GATE TO SOURCE VOLTAGE (V) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Transfer Characteristics Figure 8.  Saturation Characteristics<br>30<br>2.8<br>PULSE DURATION = 80 � s<br>DUTY CYCLE = 0.5% MAX PULSE DURATION = 80 � s<br>DUTY CYCLE = 0.5% MAX<br>2.4<br>26<br>ID = 35A 2.0<br>22 1.6<br>1.2<br>18<br>ID = 1A 0.8  I D  = 32A<br>VGS = 10V<br>14 0.4<br>2 4 6 8 10 -80 -40 0 40 80 120 160 200<br>VGS, GATE TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE( [o] C)<br>Figure 9.  Drain to Source On Resistance vs Gate  Figure 10.  Normalized Drain to Source On<br>Voltage and Drain Current Resistance vs Junction Temperature<br>DRAIN CURRENT (A)<br>,<br> ID , AVALANCHE CURRENT (A)IAS<br>, DRAIN CURRENT (A) , DRAIN CURRENT (A)<br>ID ID<br>) �<br>, DRAIN TO SOURCE<br>ON RESISTANCE (m NORMALIZED<br>DS(ON)<br>R<br> DRAIN TO SOURCE ON-RESISTANCE<br>**----- End of picture text -----**<br>


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**Typical Characteristics** TJ = 25°C unless otherwise noted 

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1.4 1.2<br>VGS = VDS, ID = 250 � A  ID = 250 � A<br>1.1<br>1.1<br>0.8<br>1.0<br>0.5<br>0.2 0.9<br>-80 -40 0 40 80 120 160 200 -80 -40 0 40 80 120 160 200<br>TJ, JUNCTION TEMPERATURE ( [o] C) TJ, JUNCTION TEMPERATURE ( [o] C)<br>Figure 11.  Normalized Gate Threshold Voltage vs  Figure 12.  Normalized Drain to Source<br>Junction Temperature Breakdown Voltage vs Junction Temperature<br>10000 10<br>VDD = 30V<br>Ciss 8<br>1000<br>6<br>Coss<br>Crss 4<br>100<br>WAVEFORMS IN<br>2 DESCENDING ORDER:<br>ID = 35A<br>VGS = 0V, f = 1MHz ID = 1A<br>10 0<br>0.1 1 10 60 0 5 10 15 20 25<br>VDS, DRAIN TO SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC)<br>NORMALIZED GATE<br>THRESHOLD VOLTAGE BREAKDOWN VOLTAGE<br>NORMALIZED DRAIN TO SOURCE<br>C, CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


**Figure 11.  Normalized Gate Threshold Voltage vs Junction Temperature** 

**Figure 13.  Capacitance vs Drain to Source Figure 14.  Gate Charge Waveforms for Constant Voltage Gate Current** 

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