# Power MOSFET, N Channel, 60 V, 18 A, 0.055 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1653649/)

**URL**: https://novapart.co/products/FDD5612/power-mosfet-n-channel-60-v-18-a-0055-ohm-to-252
**SKU**: FDD5612
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4030
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:18A; Drain Source Voltage Vds:60V; On Resistance Rds(on):0.036ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.4V; Power Dissipatio

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 42W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 18A |
| Drain Source On State Resistance | 0.055ohm |
| Gate Source Threshold Voltage Max | 2.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1653649/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FDD5612** 

## **60V N-Channel PowerTrench[] MOSFET** 

## **General Description** 

This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. 

These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable RDS(ON) specifications. The result is a MOSFET that is easy and safer to drive (even at very high frequencies), and DC/DC power supply designs with higher overall efficiency. 

## **Features** 

- 18 A, 60 V. RDS(ON) = 55 mΩ @ VGS = 10 V RDS(ON) = 64 mΩ @ VGS = 6 V 

- Optimized for use in high frequency DC/DC converters. 

- Low gade charge. 

- Very fast switching. 

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D<br>G<br>S<br>TO-252<br>**----- End of picture text -----**<br>


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D<br>G<br>S<br>**----- End of picture text -----**<br>


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Absolute Maximum Ratings TA=25 [o] C unless otherwise noted<br>Symbol  Parameter  Ratings Units<br>VDSS Drain-Source Voltage   60  V<br>VGSS Gate-Source Voltage  ±20  V<br>ID Drain Current – Continuous  (Note 1) 18  A<br>(Note 1a) 5.4<br>Drain Current – Pulsed  100<br>PD Maximum Power Dissipation  (Note 1) 42  W<br>(Note 1a) 3.8<br>(Note 1b) 1.6<br>TJ, TSTG Operating and Storage Junction Temperature Range  –55 to +175  °C<br>Thermal Characteristics<br>RθJC Thermal Resistance, Junction-to-Case  (Note 1)  3.5  °C/W<br>RθJA Thermal Resistance, Junction-to-Ambient   (Note 1a)  40  °C/W<br>(Note 1b)  96<br>a<br>Package Marking and Ordering Information<br>Device Marking  Device  Reel Size  Tape width  Quantity<br>FDD5612  FDD5612  13’’  16mm   2500 units<br>——————<br>**----- End of picture text -----**<br>


2001 Fairchild Semiconductor Corporation 

FDD5612 REV. 1.3 

|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|**Electrical Characteristics**<br>TA= 25°C unless otherwise noted|||||||
|---|---|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**||**Min**||**Typ**|**Max**|**Units**||
|**Drain-Source Avalanche Ratings (Note 1)**||||||||||
|WDSS|Single Pulse Drain-Source<br>Avalanche Energy||VDD= 30 V,<br>ID= 5.4 A||||90||mJ|
|IAR|Maximum Drain-Source Avalanche<br>Current||||||5.4||A|
|**OffCharacteristics**||||||||||
|BVDSS|Drain–Source Breakdown Voltage|VGS= 0 V,<br>ID= 250µA||60||||V||
|∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= 250µA, Referenced to 25°C||||62||mV/°C||
|IDSS|Zero Gate Voltage Drain Current|VDS= 48 V,<br>VGS= 0 V|||||1|µA||
|IGSSF|Gate–Body Leakage, Forward|VGS= 20 V,<br>VDS= 0 V|||||100|nA||
|IGSSR|Gate–Body Leakage, Reverse|VGS= –20 V<br>VDS= 0 V|||||–100|nA||
|**On Characteristics**<br>**(Note 2)**||||||||||
|VGS(th)|Gate Threshold Voltage|VDS= VGS,<br>ID= 250µA||1||2.4|3|V||
|∆VGS(th)<br> <br>∆TJ|Gate Threshold Voltage<br>Temperature Coefficient|ID= 250µA, Referenced to 25°C||||–6||mV/°C||
|RDS(on)|Static Drain–Source<br>On–Resistance|VGS= 10 V,<br>ID= 5.4 A<br>VGS= 6 V,<br>ID= 5 A<br>VGS= 10 V,ID= 5.4 A,TJ= 125°C||||36<br>42<br>64|55<br>64<br>103|mΩ||
|ID(on)|On–State Drain Current|VGS= 10 V,<br>VDS= 5 V||20||||A||
|gFS|Forward Transconductance|VDS= 5 V,<br>ID= 5.4 A||||15||S||
|**Dynamic Characteristics**||||||||||
|Ciss|Input Capacitance|VDS= 30 V,<br>VGS= 0 V,<br>f = 1.0 MHz||||660||pF||
|Coss|Output Capacitance|||||79||pF||
|Crss|Reverse Transfer Capacitance|||||36||pF||
|**Switching Characteristics (Note 2)**||||||||||
|td(on)|Turn–On Delay Time|VDD= 30 V,<br>ID= 1 A,<br>VGS= 10  V,<br>RGEN= 6Ω||||8|16|ns||
|tr|Turn–On Rise Time|||||4|8|ns||
|td(off)|Turn–Off Delay Time|||||24|38|ns||
|tf|Turn–Off Fall Time|||||4|8|ns||
|Qg|Total Gate Charge|VDS= 30 V,<br>ID= 5.4 A,<br>VGS= 10 V||||7.5|11|nC||
|Qgs|Gate–Source Charge|||||2.5||nC||
|Qgd|Gate–Drain Charge|||||3||nC||
|**Drain–Source Diode Characteristics and Maximum Ratings**||||||||||
|IS|Maximum Continuous Drain–Source Diode Forward Current||||||2.7|A||
|VSD|Drain–Source Diode Forward<br>Voltage|VGS= 0 V,<br>IS= 2.7 A<br>(Note 2)||||0.8|1.2|V||



**Notes:** 

**1.** RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the drain tab. 

- RθJA  is the guaranteed design while RθJA  is determined by the user’s design. RθJA  has been used to determine some of the maximum ratings. 

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a) RθJA= 40[o] C/W when mounted on a 1in[2] pad of 2oz copper. 

b) RθJA= 96[o] C/W when mounted on a 0.076 in[2] pad of 2oz copper. 

Scale 1 : 1 on letter size paper 

**2.** Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% 

FDD5612 Rev. 1.3 

## **Typical Characteristics** 

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30<br>VGS = 10V 6.0V 5.0V 2.2<br>25 2<br>VGS = 4.0V<br>20 4.5V 1.8<br>1.6<br>15 4.5V<br>1.4 5.0V<br>10 4.0V 6.0V<br>1.2 10V<br>5 1<br>0 0.8<br>0 1 2 3 4 5 0 6 12 18 24 30<br>VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1. On-Region Characteristics.  Figure 2. On-Resistance Variation with<br>Drain Current and Gate Voltage.<br>0.12<br>2.6<br>ID = 5.4A ID = 2.7A<br>2.2 V GS  = 10V 0.1<br>1.8 TA = 125 [o] C<br>0.08<br>1.4<br>0.06<br>1 TA = 25 [o] C<br>0.6 0.04<br>0.2 0.02<br>-50 -25 0 25 50 75 100 125 150 175 2 4 6 8 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3. On-Resistance Variation with  Figure 4. On-Resistance Variation with<br>Temperature.  Gate-to-Source Voltage.<br>100<br>30 VDS = 5V TA =-55 [o] C 25 [o] C 10 VGS = 0V<br>25<br>TA = 125 [o] C<br>  125 [o] C 1<br>20<br>25 [o] C<br>0.1<br>15<br>-55 [o] C<br>0.01<br>10<br>0.001<br>5<br>0.0001<br>0<br>0 0.2 0.4 0.6 0.8 1 1.2<br>2 3 4 5 6<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>, NORMALIZED<br>, DRAIN CURRENT (A)ID RDS(ON)<br>DRAIN-SOURCE ON-RESISTANCE<br>, NORMALIZED<br>DS(ON) , ON-RESISTANCE (OHM)<br>R DS(ON)<br>R<br> DRAIN-SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)ID<br>, REVERSE DRAIN CURRENT (A)IS<br>**----- End of picture text -----**<br>


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Figure 5. Transfer Characteristics.<br>**----- End of picture text -----**<br>


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Figure 6. Body Diode Forward Voltage Variation<br>with Source Current and Temperature.<br>**----- End of picture text -----**<br>


FDD5612 Rev. 1.3 

## **Typical Characteristics** 

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10<br>1000<br>8 ID = 5.4A VDS = 20V 30V 800 Vf = 1MHzGS = 0 V<br>40V CISS<br>6 600<br>4 400<br>2 200 C OSS<br>CRSS<br>0 0<br>0 2 4 6 8 10 12 14 0 10 20 30 40 50 60<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7. Gate Charge Characteristics.  Figure 8. Capacitance Characteristics.<br>1000 80<br>SINGLE PULSE<br>100 100µs RθTJAA = 96°C/W = 25°C<br>RDS(ON) LIMIT 1m 60<br>10 10ms<br>100ms<br>40<br>1s<br>1 10s<br>VGS = 4.5V DC<br>SINGLE PULSE 20<br>0.1 RθJA = 96 [o] C/W<br>TA = 25 [o] C<br>0.01 0<br>0.1 1 10 100 0.01 0.1 1 10 100 1000<br>VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)<br>Figure 9. Maximum Safe Operating Area.  Figure 10. Single Pulse Maximum<br>Power Dissipation.<br>1<br>D = 0.5<br>0.2 RθJA(t) = r(t) + RθJA<br>0.1 0.1 RθJA = 96 °C/W<br>0.05<br>0.02<br>0.01 0.01 P(pk)<br>t1<br>t 2<br>0.001 SINGLE PULSE TJ - TA = P * RθJA(t)<br>Duty Cycle, D = t1 / t2<br>0.0001<br>0.0001 0.001 0.01 0.1 1 10 100 1000<br>Figure 11. Transient Thermal Response Curve.<br>Thermal characterization performed using the conditions described in Note 1b.<br>Transient thermal response will change depending on the circuit board design.<br>CAPACITANCE (pF)<br>, GATE-SOURCE VOLTAGE (V)<br>GS<br>V<br>, DRAIN CURRENT (A)ID<br>P(pk), PEAK TRANSIENT POWER (W)<br>r(t), NORMALIZED EFFECTIVE<br>TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


FDD5612 Rev. 1.3 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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