# Power MOSFET, P Channel, 40 V, 32 A, 0.027 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1495263RL/)

**URL**: https://novapart.co/products/FDD4685/power-mosfet-p-channel-40-v-32-a-0027-ohm-to-252
**SKU**: FDD4685
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3480
**Stock**: 1000+
**Lead Time**: 134 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:32A; Drain Source Voltage Vds:-40V; On Resistance Rds(on):0.023ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1.6V; Power Dis

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 69W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 32A |
| Drain Source On State Resistance | 0.027ohm |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1495263RL/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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## **FDD4685 40V P-Channel PowerTrench[®] MOSFET** 

**– 40V, – 32A, 27m** Ω **Features** 

Max rDS(on) = 27mΩ at VGS = –10V, ID = –8.4A Max rDS(on) = 35mΩ at VGS = –4.5V, ID = –7A High performance trench technology for extremely low rDS(on) RoHS Compliant 

## **General Description** 

This P-Channel MOSFET has been produced using Fairchild Semiconductor’s proprietary PowerTrench **[®]** technology to deliver low rDS(on) and good switching characteristic offering superior performance in application. 

## **Application** 

Inverter 

Power Supplies 

**==> picture [309 x 107] intentionally omitted <==**

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S<br>D G<br>G<br>S<br>D-PAK<br>a TO -252<br>(TO-252) D<br>**----- End of picture text -----**<br>


## **MOSFET Maximum Ratings** 

TC = 25°C unless otherwise noted 

|**Symbol**<br>**Parameter**|||**Ratings**||**Units**|
|---|---|---|---|---|---|
|VDS<br>Drain to Source Voltage|||–40||V|
|VGS<br>Gate to Source Voltage|||±20||V|
|Drain Current   -Continuous(Package Limited)TC= 25°C|||–32|||
|ID<br>-Continuous(Silicon Limited)TC= 25°C<br>-Continuous TA= 25°C|= 25°C(Note 1)<br> (Note 1a)||–40<br>–8.4||A|
|-Pulsed|||–100|||
|EAS<br>Drain-Source Avalanche Energy|(Note 3)||121||mJ|
|PD<br>Power Dissipation                                                           TC= 25°C<br>Power Dissipation|Power Dissipation(Note 1a)||69<br>3||W|
|TJ, TSTG<br>Operatingand Storage Junction Temperature Range|||–55 to +150||°C|
|**Thermal Characteristics**||||||
|**Package Marking and Ordering Information**<br>RθJC<br>Thermal Resistance, Junction to Case<br>1.8<br>°C/W<br>RθJA<br>Thermal Resistance, Junction to Ambient(Note 1a)<br>40<br>**Device Marking**<br>**Device**<br>**Package**<br>**Reel Size**<br>**Tape Width**<br>**Quantity**<br>FDD4685<br>FDD4685<br>D-PAK(TO-252)<br>13’’<br>16mm<br>2500 units<br>~~————~~||||||



©2006 Fairchild Semiconductor Corporation **1** FDD4685 Rev. 1.3 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrica**|**l Characteristics**TJ= 25°C unless|otherwise noted|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Units**|
|**Off Characteristics**|||||||
|BVDSS|Drain to Source Breakdown Voltage|ID= –250µA, VGS= 0V|–40|||V|
|∆BVDSS<br>∆TJ|Breakdown Voltage Temperature<br>Coefficient|ID= –250µA, referenced to 25°C||–33||mV/°C|
|IDSS|Zero Gate Voltage Drain Current|VDS= –32V,   VGS= 0V|||–1|µA|
|IGSS|Gate to Source Leakage Current|VGS= ±20V, VGS= 0V|||±100|nA|
|**On Characteristics**<br> **(Note 2)**|||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS,  ID= –250µA|–1|–1.6|–3|V|
|∆VGS(th)<br>∆TJ|Gate to Source Threshold Voltage<br>Temperature Coefficient|ID= –250µA, referenced to 25°C||4.9||mV/°C|
|rDS(on)|Static Drain to Source On Resistance|VGS= –10V, ID= –8.4A||23|27|mΩ|
|||VGS= –4.5V, ID= –7A||30|35||
|||VGS= –10V, ID= –8.4A, TJ=125°C||33|42||
|gFS|Forward Transconductance|VDS= –5V,  ID= –8.4A||23||S|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= –20V, VGS= 0V,<br>f = 1MHz||1790|2380|pF|
|Coss|Output Capacitance|||260|345|pF|
|Crss|Reverse Transfer Capacitance|||140|205|pF|
|Rg|Gate Resistance|f = 1MHz||4||Ω|
|**Switching Characteristics**|||||||
|td(on)|Turn-On DelayTime|VDD= –20V, ID= –8.4A<br>VGS= –10V, RGEN= 6Ω||8|16|ns|
|tr|Rise Time|||15|27|ns|
|td(off)|Turn-Off DelayTime|||34|55|ns|
|tf|Fall Time|||14|26|ns|
|Qg(TOT)|Total Gate Charge|VDD=–20V, ID= –8.4A<br>VGS= –5V||19|27|nC|
|Qgs|Gate to Source Gate Charge|||5.6||nC|
|Qgd|Gate to Drain “Miller” Charge|||6.1||nC|
|**Drain-Source Diode Characteristics**|||||||
|VSD|Source to Drain Diode  Forward Voltage|VGS = 0V, IS = –8.4A(Note 2)||–0.85|–1.2|V|
|trr|Reverse RecoveryTime|IF= –8.4A, di/dt = 100A/µs||30|45|ns|
|Qrr|Reverse RecoveryCharge|||31|47|nC|



## **Notes:** 

- **1:** RθJA is the sum of the junction-to-case and case-to- ambient  thermal resistance where the case thermal reference is defined  as the solder mounting surface of the drain pins. RθJC is guaranteed by design  while RθJA is determined by the user’s board design. 

- a. 40°C/W when mounted  on  a 1 in[2 ] pad of  2 oz  copper 

- b. 96°C/W when mounted on  a minimum pad. 

- **2:** Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%. 

- **3:** Starting TJ = 25°C, L = 3mH, IAS = 9A, VDD = 40V, VGS = 10V. 

www.fairchildsemi.com 

**2** 

FDD4685 Rev. 1.3 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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100 3.0<br>PULSE DURATION = 80 µ s PULSE DURATION = 80 µ s<br>DUTY CYCLE = 0.5%MAX VGS = -3V DUTY CYCLE = 0.5%MAX<br>80 VGS = -10V VGS = -6V 2.6<br>VGS = -4V<br>2.2<br>60 VGS = -4.5V VGS = -4.5V<br>1.8<br>40 VGS =  -4V VGS = -6V<br>1.4<br>20<br>1.0 VGS =  -10V<br>VGS = -3V<br>0 0.6<br>0 1 2 3 4 0 20 40 60 80 100<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT(A)<br>Figure 1.  On Region Characteristics Figure 2.  Normalized  On-Resistance<br>vs Drain Current and Gate Voltage<br>1.8<br> ID =-8.4A 70<br>1.6 VGS = -10V ID = -8.4A PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>60<br>1.4<br>50<br>1.2 TJ = 125 [o] C<br>1.0 40<br>0.8 30<br>TJ = 25 [o] C<br>0.6<br>-50 -25 0 25 50 75 100 125 150 20<br>2 3 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C)<br>-VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On  Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>100 40<br>PULSE DURATION = 80 µ s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>80<br>10<br>TJ = 150 [o] C<br>60<br>TJ = 25 [o] C<br>40 TJ = 25 [o] C 1<br>20 TJ = 150 [o] C TJ = -55 [o] C<br>TJ = -55 [o] C<br>0 0.1<br>1 2 3 4 5 6 0.4 0.6 0.8 1.0 1.2<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I<br>, REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDD4685 Rev. 1.3 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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10 104<br>VDD = -10V Ciss<br>8<br>VDD = -20V 103<br>6 Coss<br>VDD = -30V<br>4<br>102<br>Crss<br>2 f = 1MHz<br>VGS = 0V<br>0 101<br>0 10 20 30 40 0.1 1 10 50<br>Qg, GATE CHARGE(nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance  vs  Drain<br>to Source Voltage<br>10 50<br>9<br>8<br>7<br>6 40<br>5 VGS = -10V<br>4 TJ = 25 [o] C 30<br>3<br>20<br>TJ = 125 [o] C<br>2 Limited by Package VGS = -4.5V<br>10<br>R θ JC = 1.8oC/W<br>1 0<br>0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE(ms) TC, CASE TEMPERATURE (oC)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current  vs Case Temperature<br>200 300<br>100 250 FOR TEMPERATURES<br>ABOVE 25 [o] C DERATE PEAK<br>200 VGS = -10V CURRENT AS FOLLOWS:<br>100us<br>150 – T<br>10 150 I = I25  --------------------- 125 c -<br>1ms Tc = 25 [o] C<br>100<br>1 10ms<br>OPERATION IN THIS  SINGLE PULSE<br>AREA MAY BE  TJ = MAX RATED DC SINGLE PULSE<br>LIMITED BY rDS(on) TC = 25 [O] C<br>0.1 50<br>1 10 100 10-3 10-2 10-1 100 101<br>-VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (s)<br>Figure 11.  Forward Bias Safe                                      Figure 12.   Single  Pulse Maximum<br>Operating Area  Power  Dissipation<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>-V<br>, DRAIN CURRENT (A)<br>I - D<br>, AVALANCHE CURRENT(A)<br>AS<br>-I<br>, DRAIN CURRENT (A)<br>D<br>-I<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

FDD4685 Rev. 1.3 

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Typical Characteristics  TJ = 25°C unless otherwise noted<br>2<br>DUTY CYCLE-DESCENDING ORDER<br>1<br>D = 0.5<br>      0.2<br>      0.1<br>0.1       0.05<br>      0.02      0.01 PDM<br>t1<br>0.01 SINGLE PULSE t2<br>NOTES:<br>DUTY FACTOR: D = t1/t2<br>PEAK TJ = PDM x Z θJC  x R θJC  + TC<br>1E-3<br>10-5 10-4 10-3 10-2 10-1 100 101<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 13.  Transient Thermal Response Curve<br>IMPEDANCE, ZJC θ<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


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FDD4685 Rev. 1.3<br>**----- End of picture text -----**<br>


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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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