# Power MOSFET, P Channel, 40 V, 32 A, 0.023 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2992320/)

**URL**: https://novapart.co/products/FDD4685-F085/power-mosfet-p-channel-40-v-32-a-0023-ohm-to-252
**SKU**: FDD4685-F085
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5660
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | PowerTrench |
| Qualification | AEC-Q101 |
| Power Dissipation | 83W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 83W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.023ohm |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 32A |
| Drain Source On State Resistance | 0.023ohm |
| Automotive Qualification Standard | AEC-Q101 |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2992320/)

## **- FDD4685 F085** 

## **P-Channel PowerTrench[® ] MOSFET -40 V, -32 A, 35 m** Ω 

## **Features** 

- Typical RDS(on) = 23 m at VGS = -10V, ID = -8.4 A 

- Typical RDS(on) = 30 m at VGS = -4.5V, ID = -7 A 

- Typical Qg(tot) = 19 nC at VGS = -5V, ID = -8.4 A 

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 UIS Capability D<br> RoHS Compliant &als Ro Hs Cc° G<br> Qualified to AEC Q101 ~4<br>)r S<br>Applications S D-PAKTO-252<br>  Inverter = (TO-252)<br>**----- End of picture text -----**<br>


- Power Supplies 

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FDD4685<br>-<br>F085 P-Channel PowerTrench®<br>MOSFET<br>**----- End of picture text -----**<br>


## **MOSFET Maximum Ratings** TJ = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Ratings**|**Units**|
|---|---|---|---|
|VDSS|Drain-to-Source Voltage|-40|V|
|VGS|Gate-to-Source Voltage|±20|V|
|ID|Drain Current - Continuous(TC < 90°C, VGS=10)<br>(Note 1)|-32|A|
||Pulsed Drain Current|See Figure 4||
|EAS|Single Pulse Avalanche Energy<br> (Note 2)|121|mJ|
|PD|Power Dissipation|83|W|
||Derate Above 25oC|0.56|W/oC|
|TJ, TSTG|Operatingand Storage Temperature|-55 to + 175|oC|
|RJC|Thermal Resistance, Junction to Case|1.8|oC/W|
|RJA|Maximum Thermal Resistance, Junction to Ambient<br> (Note 3)|40|oC/W|



## **Package Marking and Ordering Information** 

- **Device Marking Device Package Reel Size Tape Width Quantity** FDD4685 FDD4685-F085 D-PAK(TO-252) 13” 12mm 2500units 

- **Notes:** 1. Current is limited by bondwire configuration. 2. Starting TJ = 25°C, L = 3mH, IAS = 9A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche. 3. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder mounting surface of the drain pins.  RθJC is guaranteed by design, while RθJA is determined by the board design.  The maximum rating presented here is based on mounting on a 1 in[2 ] pad of 2oz copper. 

- 4. A suffix as “…F085P” has been temporarily introduced in order to manage a double source strategy as ON Semiconductor has officially announced in Aug 2014. 

Publication Order Number: FDD4685-F085/D 

©2016 Semiconductor Components Industries, LLC. September-2017,Rev.2 

|**Electrical Characteristics**TJ= 25°C unless otherwise noted.|**Electrical Characteristics**TJ= 25°C unless otherwise noted.|**Electrical Characteristics**TJ= 25°C unless otherwise noted.|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Units**|
|**Off Characteristics**|||||||
|BVDSS|Drain-to-Source Breakdown Voltage|ID= -250A, VGS= 0V|-40|-|-|V|
|BVDSS<br>TJ|Breakdown Voltage Temperature<br>Coefficient|ID = -250μA, referenced to 25oC|-|-33|-|mV/oC|
|IDSS|Drain-to-Source Leakage Current|VDS= -32V|-|-|-1|A|
|IGSS|Gate-to-Source Leakage Current|VGS= ±20V|-|-|±100|nA|
|**On Characteristics**|||||||
|VGS(th)|Gate to Source Threshold Voltage|VGS= VDS, ID= -250A|-1|-1.6|-3|V|
|VGS(th)<br>TJ|Gate to Source Threshold Voltage<br>Temperature Coefficient|ID = –250μA, referenced to 25°C|-|4.9|-|mV/oC|
|RDS(on)|Drain to Source On Resistance|ID= -8.4A, VGS= -10V|-|23|27|m|
|||ID= -7A, VGS= -4.5V|-|30|35||
|||ID= -8.4A, VGS= -10V, TJ= 150oC|<br>-|38|45||
|gFS|Forward Transconductance|ID= –8.4A, VDS= –5V|-|23|-|s|
|**Dynamic Characteristics**|||||||
|Ciss|Input Capacitance|VDS= -20V, VGS= 0V,<br>f = 1MHz|-|1790|2380|pF|
|Coss|Output Capacitance||-|260|345|pF|
|Crss|Reverse Transfer Capacitance||-|140|205|pF|
|Rg|Gate Resistance|f = 1MHz|-|4|-||
|Qg(ToT)|Total Gate Charge|VDD= -20V, VGS= -5V,<br>ID= -8.4A|-|19|27|nC|
|Qgs|Gate-to-Source Gate Charge||-|5.6|-|nC|
|Qgd|Gate-to-Drain “Miller“ Charge||-|6.1|-|nC|
|**Switching Characteristics**|||||||
|td(on)|Turn-On Delay|VDD= -20V, ID= -8.4A,<br>VGS= -10V, RGEN= 6|-|8|16|ns|
|tr|Rise Time||-|15|27|ns|
|td(off)|Turn-Off Delay||-|34|55|ns|
|tf|Fall Time||-|14|26|ns|
|**Drain-Source Diode Characteristics**|||||||
|VSD|Source-to-Drain Diode Voltage|ISD= -8.4A, VGS= 0V|-|-0.85|-1.2|V|
|trr|Reverse-Recovery Time|ISD= -8.4A, dISD/dt = 100A/s|-|30|45|ns|
|Qrr|Reverse-Recovery Charge||-|31|47|nC|



**www.onsemi.com 2** 

## **Typical Characteristics** 

**Figure 1.  Normalized Power Dissipation vs. Case Figure 2.  Maximum Continuous Drain Current vs. Temperature Case Temperature** 

**Figure 3.  Normalized Maximum Transient Thermal Impedance** 

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Figure 4.  Peak Current Capability<br>**----- End of picture text -----**<br>


**www.onsemi.com 3** 

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Typical Characteristics<br>**----- End of picture text -----**<br>


**Figure 5.  Forward Bias Safe Operating Area** 

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NOTE: Refer to ON SemiconductorApplication Notes AN7514<br>and AN7515<br>Figure 6.  Unclamped Inductive Switching<br>Capability<br>**----- End of picture text -----**<br>


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Figure 7.  Transfer Characteristics<br>**----- End of picture text -----**<br>


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Figure 8.  Saturation Characteristics<br>**----- End of picture text -----**<br>


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Figure 9.  Drain to Source On-Resistance  Figure 10.  Normalized Drain to Source On<br>Variation vs. Gate to Source Voltage  Resistance vs. Junction Temperature<br>**----- End of picture text -----**<br>


**www.onsemi.com 4** 

## **Typical Characteristics** 

**Figure 11.  Normalized Gate Threshold Voltage vs. Figure 12.  Normalized Drain to Source Junction Temperature Breakdown Voltage vs. Junction Temperature** 

**Figure 13.  Capacitance vs. Drain to Source Voltage** 

**Figure 14.  Gate charge vs. Gate to Source Voltage** 

**www.onsemi.com 5** 

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## **PUBLICATION ORDERING INFORMATION** 

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