# Power MOSFET, N Channel, 100 V, 29 A, 0.029 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2453848/)

**URL**: https://novapart.co/products/FDD3860/power-mosfet-n-channel-100-v-29-a-0029-ohm-to-252
**SKU**: FDD3860
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7480
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 69W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 69W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.029ohm |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 29A |
| Drain Source On State Resistance | 0.029ohm |
| Gate Source Threshold Voltage Max | 3.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2453848/)

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## **FDD3860** 

## **N-Channel PowerTrench[®] MOSFET 100V, 29A, 36m** Ω 

## **Features** 

Max rDS(on) = 36mΩ at VGS = 10V, ID = 5.9A 

High performance trench technology for extremely low rDS(on) 100% UIL tested 

RoHS Compliant 

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## **General Description** 

This N-Channel MOSFET is rugged gate version of Fairchild Semiconductor‘s advanced Power Trench **[®]** process. This part is tailored for low rDS(on) and low Qg figure of merit, with avalanche ruggedness for a wide range of switching applications. 

## **Applications** 

DC-AC Conversion Synchronous Rectifier 

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D<br>D<br>G<br>G<br>S<br>D-PAK<br>TO -252<br>(TO-252)<br>S<br>**----- End of picture text -----**<br>


**MOSFET Maximum Ratings** TC = 25°C unless otherwise noted 

|**Symbol**||**Parameter**||||**Ratings**|**Ratings**|||**Units**|
|---|---|---|---|---|---|---|---|---|---|---|
|VDS|Drain to Source Voltage||||||100|||V|
|VGS|Gate to Source Voltage||||||±20|||V|
||Drain Current   -Continuous(Silicon limited)TC = 25°C||||||29||||
|ID|-Continuous                                   T|-Continuous                                   TA= 25°C||= 25°C(Note 1a)|||6.2|||A|
||-Pulsed||||||60||||
|EAS|Single Pulse Avalanche Energy|||(Note 3)|||121|||mJ|
|PD|Power Dissipation                                                   T<br>Power Dissipation                                                      T|ation                                                   TC= 25°C<br>ation                                                      TA= 25°C||= 25°C(Note 1a)|||69<br>3.1|||W|
|TJ, TSTG|Operatingand Storage Junction Temperature Range|||||-55 to +150|-55 to +150|||°C|
|**Thermal Characteristics**|||||||||||
|RθJC|Thermal Resistance, Junction to Case||||||1.8|||°C/W|
|RθJA|Thermal Resistance, Junction to Ambient||Thermal Resistance, Junction to Ambient|Thermal Resistance, Junction to Ambient(Note 1a)|||40||||
|**Package Marking and Ordering Information**|||||||||||
|**Device Marking**<br>**Device**||**Package**||**Reel Size**||**Tape Width**|||**Quantity**||
|FDD3860<br>FDD3860||D-PAK (TO-252)||13’’||12mm|||2500 units||



**1** 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

www.fairchildsemi.com 

**Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Electrical Characteristics**TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted|**Electrical Characteristics**TJ = 25°C unless otherwise notedJ = 25°C unless otherwise noted= 25°C unless otherwise noted|
|---|---|
|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= 250µA, VGS= 0V<br>100<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= 250µA, referenced to 25°C<br>98<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= 80V, VGS = 0V<br>1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±20V, VDS = 0V<br>±100<br>nA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS, ID= 250µA<br>2.5<br>3.8<br>4.5<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= 250µA, referenced to 25°C<br>-11.4<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= 10V, ID= 5.9A<br>29<br>36<br>mΩ<br>VGS= 10V, ID= 5.9A, TJ = 125°C<br>51<br>64<br>gFS<br>Forward Transconductance<br>VDS= 10V, ID= 5.9A<br>20<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= 50V, VGS= 0V,<br>f = 1MHz<br>1310<br>1740<br>pF<br>Coss<br>Output Capacitance<br>100<br>130<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>45<br>70<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>1.6<br>Ω<br>**Switching Characteristics**<br>~~ee~~<br>~~——~~<br>~~=e~~<br>~~==~~<br>~~ee~~||
|td(on)<br>Turn-On DelayTime<br>VDD= 50V, ID= 5.9A,<br>VGS= 10V, RGEN= 6Ω<br>16<br>29<br>ns<br>tr<br>Rise Time<br>10<br>21<br>ns<br>td(off)<br>Turn-Off DelayTime<br>24<br>39<br>ns<br>tf<br>Fall Time<br>7<br>15<br>ns<br>Qg<br>Total Gate Charge at 10V<br>VDD= 50V, ID= 5.9A<br>22<br>31<br>nC<br>Qgs<br>Gate to Source Charge<br>7.1<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>6.3<br>nC<br>**Drain-Source Diode Characteristics**<br>~~==} —EEEE~~||
|VSD<br>Source to Drain Diode  Forward Voltage<br>VGS = 0V, IS = 2.0A(Note 2)<br>0.7<br>1.2<br>V<br>VGS = 0V, IS = 5.9A(Note 2)<br>0.8<br>1.3<br>trr<br>Reverse RecoveryTime<br>IF= 5.9A, di/dt = 100A/µs<br>34<br>55<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>40<br>64<br>nC<br>~~SEE~~||
|Notes**:**||
|**1:** RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.|is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.|
|RθJC is guaranteed by design while  RθJAis determined by the user’s board design.||



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a)  40°C/W when mounted  on  a  b) 96°C/W  when  mounted<br>1 in [2 ] pad of  2 oz  copper            on  a minimum pad.<br>**----- End of picture text -----**<br>


- **2:** Pulse Test: Pulse Width < 30 0 µs, Duty cycle < 2.0%. 

- **3:** Starting TJ = 25°C , L = 3mH , IAS = 9A , VDD = 100V , VGS = 10V. 

www.fairchildsemi.com 

**2** 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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60 3.0<br>VGS = 10V PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>50<br>2.5<br>VGS = 8V VGS = 6V<br>40 VGS =  7V VGS = 7V<br>2.0<br>30 VGS = 8V<br>1.5<br>20<br>1.0 VGS = 10V<br>10 VGS = 6V<br>0 0.5<br>0 1 2 3 4 5 0 10 20 30 40 50 60<br>VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>2.2 100<br>2.0 ID = 5.9A ID = 5.9A PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>VGS = 10V 80<br>1.8<br>1.6<br>1.4 60 TJ = 125 [o] C<br>1.2<br>40<br>1.0<br>0.8 20 TJ = 25 [o] C<br>0.6<br>0.4 0<br>-75 -50 -25 0 25 50 75 100 125 150 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>60 100<br>PULSE DURATION = 80 µ s VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>50<br>10<br>VDS = 10V<br>40 TJ = 150 [o] C<br>1<br>30<br>TJ = 150 [o] C 0.1 TJ = 25 [o] C<br>20<br>TJ = 25 [o] C 0.01 TJ = -55 [o] C<br>10<br>TJ = -55 [o] C<br>0 1E-3<br>2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>, DRAIN CURRENT (A)<br>ID<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>DRAIN TO<br>,<br>NORMALIZED rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>ID , REVERSE DRAIN CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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10 3000<br>ID = 5.9A VDD = 25V<br>8 1000 Ciss<br>VDD = 75V<br>VDD = 50V<br>6 Coss<br>4 100<br>Crss<br>2 f = 1MHz<br>VGS = 0V<br>0 10<br>0 5 10 15 20 25 0.1 1 10 100<br>Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>10 35<br>8<br>6 28<br>VGS = 10V<br>4 21<br>TJ = 125 [o] C TJ = 25 [o] C<br>14<br>2 R θ JC = 1.8 [o] C/W<br>7<br>1 0<br>0.01 0.1 1 10 100 25 50 75 100 125 150<br>tAV, TIME IN AVALANCHE (ms) TC, CASE TEMPERATURE ( [o] C)<br>Figure 9. Unclamped Inductive                                  Figure 10.  Maximum Continuous Drain<br>Switching Capability Current  vs Case Temperature<br>100 105<br>VGS = 10V<br>104<br>10<br>SINGLE PULSE<br>100us<br>103 R θ JC = 1.8 [o] C/W<br>1 SINGLE PULSE 1ms<br>THIS AREA IS TJ = MAX RATED 102<br>LIMITED BY rds(on) 10ms<br>R θ JC = 1.8 [o] C/W DC<br>TC = 25 [o] C<br>0.10.1 1 10 100 300 1010-6 10-5 10-4 10-3 10-2 10-1 1<br>VDS, DRAIN to SOURCE VOLTAGE (V) t, PULSE WIDTH (sec)<br>Figure 11.  Forward Bias Safe                                      Figure 12.   Single  Pulse Maximum Power Dissipation<br>Operating Area<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>V<br>DRAIN CURRENT (A)<br>,<br>ID<br>, AVALANCHE CURRENT(A)<br>IAS<br>, DRAIN CURRENT (A)<br>ID<br>, PEAK TRANSIENT POWER (W)P)(PK<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**4** 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

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2<br>1<br>DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2 FOR TEMPERATURES<br>      0.1 ABOVE 25 [o] C DERATE PEAK<br>0.1       0.05 CURRENT AS FOLLOWS:PDM<br>      0.02 150 – T<br>      0.01 I  = I 2 5  ------------------------ 125 t1 C<br>0.01 NOTES: T t2 C  = 25 [o] C<br>SINGLE PULSE DUTY FACTOR: D = t1/t2<br>R θ JC = 1.8 [o] C/W PEAK TJ = PDM x Z θJC  x R θJC  + TC<br>0.001<br>10-6 10-5 10-4 10-3 10-2 10-1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 13.  Transient Thermal Response Curve<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>0.1       0.1<br>      0.05 PDM<br>      0.02<br>      0.01<br>t1<br>0.01 SINGLE PULSE t2<br>NOTES:<br>R θ JA = 40 [o] C/W DUTY FACTOR: D = t1/t2<br>(Note 1a) PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>0.001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 14.  Transient Thermal Response Curve<br>2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>0.1<br>      0.2<br>      0.1<br>      0.05 PDM<br>0.01       0.02<br>      0.01<br>t1<br>SINGLE PULSE t2<br>0.001 NOTES:<br>R θ JA = 96 [o] C/W DUTY FACTOR: D = t1/t2<br>(Note 1b) PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>0.0001<br>10-4 10-3 10-2 10-1 1 10 100 1000<br>t, RECTANGULAR PULSE DURATION (sec)<br>Figure 15.  Transient Thermal Response Curve<br>IMPEDANCE, ZJC θ<br>NORMALIZED THERMAL<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>Z JA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**5** 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

Build it Now™ FRFET[®] Programmable Active Droop™ CorePLUS™CorePOWER™ Global Power ResourceGreen FPS™[SM] QFETQS™[®] PWethe wer tm _CROSSVOLT_ ™ Green FPS™ e-Series™ Quiet Series™ TinyBoost™ CTL™ GTO™ RapidConfigure™ TinyBuck™ Current Transfer Logic™ IntelliMAX™ TinyLogicTINYOPTO™[®] EcoSPARK[®] ISOPLANAR™ ™ EfficentMax™ MegaBuck™ Saving our world, 1mW /W /kW at a time™ TinyPower™ EZSWITCH™ * MICROCOUPLER™ SmartMax™ TinyPWM™ ™ MicroFET™ SMART START™ TinyWire™ MicroPak™ SPM[®] µSerDes™ ® MillerDrive™ STEALTH™ tm MotionMax™ SuperFET™ Fairchild[®] Motion-SPM™ SuperSOT™-3 UHC[®] Fairchild Semiconductor[®] OPTOLOGIC[®] SuperSOT™-6 Ultra FRFET™ FACT Quiet Series™ OPTOPLANAR[®] SuperSOT™-8 UniFET™ FACT[®] ® SupreMOS™ VCX™ FASTFastvCore™[®] tm SyncFET™ ® VisualMax™XS™ * PDP SPM™ FPS™FlashWriter[® ] Power-SPM™ [ GENERALSYSTEM F-PFS™ PowerTrench[®] The Power Franchise[®] PowerXS™ 

* EZSWITCH™ and FlashWriter[®] are trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used herein: 

1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to cause and (c) whose failure to perform when properly used in accordance with the failure of the life support device or system, or to affect its safety or instructions for use provided in the labeling, can be reasonably effectiveness. expected to result in a significant injury of the user. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Farichild’s Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Farichild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications<br>may change in any manner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later<br>date. Fairchild Semiconductor reserves the right to make changes at any time without<br>notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild<br>Semiconductor. The datasheet is for reference information only.|



www.fairchildsemi.com 

Rev. I37 

©2008 Fairchild Semiconductor Corporation FDD3860 Rev.C1 

**6** 



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