# Power MOSFET, N Channel, 200 V, 16 A, 0.1 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2822532/)

**URL**: https://novapart.co/products/FDD18N20LZ/power-mosfet-n-channel-200-v-16-a-01-ohm-to-252
**SKU**: FDD18N20LZ
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7130
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:16A; Drain Source Voltage Vds:200V; On Resistance Rds(on):0.1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.5V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | UniFET |
| Qualification | - |
| Power Dissipation | 89W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 16A |
| Drain Source On State Resistance | 0.1ohm |
| Gate Source Threshold Voltage Max | 2.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2822532/)

## **Is Now Part of** 

## **To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

**==> picture [74 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
December 2013<br>**----- End of picture text -----**<br>


## **FDD18N20LZ** 

## **N-Channel UniFET[TM] MOSFET 200 V, 16 A, 125 m** Ω 

## **Features** 

- R DS(on) = 125 m Ω (Typ.) @ VGS = 10 V, ID = 8 A 

- Low Gate Charge (Typ. 30 nC) 

- Low CRSS (Typ. 25 pF) 

- 100% Avalanche Tested 

- Improved dv/dt Capability 

- ESD Improved Capability 

## **Description** 

UniFET[TM] MOSFET is Fairchild Semiconductor’s high voltage MOSFET family based on planar stripe and DMOS technology. This MOSFET is tailored to reduce on-state resistance, and to provide better switching performance and higher avalanche energy strength. This device family is suitable for switching power converter applications such as power factor correction (PFC), flat panel display (FPD) TV power, ATX and electronic lamp ballasts. 

- RoHS Compliant 

## **Applications** 

- LED TV 

- Consumer Appliances 

- Uninterruptible Power Supply 

**==> picture [479 x 363] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D<br>G G<br>S D-PAK<br>S<br>MOSFET Maximum Ratings TC = 25 [o] C unless otherwise noted.<br>a Symbol  GO Parameter FDD18N20LZ Unit<br>OO VDSS Drain to Source Voltage 200 V<br>a VGSS Gate to Source Voltage ±20 V<br>ID Drain Current a -- Continuous Continuous ((TTCC = 25 = 100 [o] C [o] C) ) 9.616 A<br>—— | =| Ae<br>a IDM  GG Drain Current -  Pulsed    S| (Note 1) 64 A<br>a EAS  GO Single Pulsed Avalanche Energy (Note 2) 320 mJ<br>CO IAR Avalanche Current     (Note 1) 16 8=§63G0hlrl A<br>ee EAR Repetitive Avalanche Energy (Note 1) =—lC 8.9 FC mJ<br>SE dv/dt Peak Diode Recovery dv/dt  (Note 3) 10 V/ns<br>PD Power Dissipation (- Derate above 25TC = 25 [o] C) [o] C 0.789 W/WoC<br>a a eeea<br>a TJ, TSTG  GO Operating and Storage Temperature Range -55 to +150 oC<br>TL Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds. 300 oC<br>Thermal Characteristics<br>Symbol Parameter FDD18N20LZ Unit<br>R θ JC Thermal Resistance, Junction to Case, Max.     1.4 oC/W<br>R θ JA Thermal Resistance, Junction to Ambient, Max.          83<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**1** 

## **Package Marking and Ordering Information** 

**==> picture [451 x 20] intentionally omitted <==**

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||||||||
|---|---|---|---|---|---|---|
|Part Number|Top Mark|Package|Packing Method|Reel Size|Tape Width|Quantity|
|FDD18N20LZ|FDD18N20LZ|DPAK|Tape and Reel|330 mm|16 mm|2500 units|

**----- End of picture text -----**<br>


**Electrical Characteristics** TC = 25[o] C unless otherwise noted. 

**==> picture [481 x 445] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Test Conditions|Min.|Typ.|Max.|Unit|
|Off Characteristics|
|BVDSS|Drain to Source Breakdown Voltage|ID = 250 µA, VGS = 0 V, TJ = 25|[o]|C|200|-|-|V|
| / BV∆DSS|Breakdown Voltage Temperature Coefficient|ID = 250 µA, Referenced to 25|[o]|C|-|0.2|-|V/|[o]|C|
|ITDSSJ|Zero Gate Voltage Drain Current|VVDSDS = 200 V, V = 160 V, TC GS = 125= 0 V|[o]|C|--|--|101|A|
|IGSS|Gate to Body Leakage Current|VGS = ±16 V, VDS = 0 V|-|-|±10|A|
|On Characteristics|
|——|VGS(th)|Gate Threshold Voltage|VGS = VDS, ID = 250 µ|Α|oe|1.0|-|2.5|V|
|RDS(on)|Static Drain to Source On Resistance|VVGSGS = 10 V, I = 5 V, IDD = 8 A  = 8A|--|0.100.11|0.1250.13||
|—a|gFS|Forward Transconductance|VDS = 20 V, ID = 2 A|-|11|-|S|
|Dynamic Characteristics|
|Ciss|Input Capacitance|-|1185|1575|pF|
|Coss|Output Capacitance|f = 1 MHzVDS = 25 V, VGS = 0 V|-|190|255|pF|
|Crss|Reverse Transfer Capacitance|-|25|40|pF|
|Qg(tot)|Total Gate Charge at 10V|-|30|40|nC|
|Qgs|Gate to Source Gate Charge|VDS = 200 V ID = 16 A|-|3.5|-|nC|
|Qgd|Gate to Drain “Miller” Charge|VGS = 10 V|(Note 4)|-|8.5|-|nC|
|Switching Characteristics|
|=|[eae]|td(on)|Turn-On Delay Time|-|15|40|ns|
|tr|Turn-On Rise Time|VDD = 100 V, ID = 16 A|-|20|50|ns|
|td(off)|Turn-Off Delay Time|VGS = 10 V, RG = 25 Ω|-|135|280|ns|
|anes|tf|Turn-Off Fall Time|(Note 4)|-|50|110|ns|
|Drain-Source Diode Characteristics|
|_|IS|Maximum Continuous Drain to Source Diode Forward Current|-|-|16|A|
|ISM|Maximum Pulsed Drain to Source Diode Forward Current|-|-|64|A|
|VSD|Drain to Source Diode Forward Voltage|VGS = 0 V, ISD = 4 A|-|-|1.4|V|
|trr|Reverse Recovery Time|VGS = 0 V, ISD = 4 A|-|105|-|ns|
|SSS|Qrr|Reverse Recovery Charge|dIF/dt = 100 A/µs|-|0.4|-|C|
|Notes:|
|1:|Repetitive rating: pulse-width limited by maximum junction temperature.|

**----- End of picture text -----**<br>


2: L = 2.5 mH, IAS = 16 A, VDD = 50 V, RG = 25 Ω , starting TJ = 25°C. 

3: ISD ≤ 16 A, di/dt ≤ 200 A/ μ s, VDD ≤ BVDSS, starting TJ = 25°C. 

- 4: Essentially independent of operating temperature typical characteristics. 

www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**2** 

## **Typical Performance Characteristics** 

**==> picture [441 x 601] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics<br>100 100<br>VGS =   10V<br>  7V<br>  5V<br>  4.5V<br>  4V<br>10 10<br>  3.5V<br>  3V<br>150 [o] C<br>25 [o] C<br>1 1<br>aed *Notes: ne A * Notes :<br>1. 250  s Pulse Test -55 [o] C 1. V DS = 20V<br>2. TC = 25 [o] C 2. 250  s Pulse Test<br>0.1 LZ) 0.1 OEE<br>0.01 0.1 1 10 0 2 4 6 8<br>VDS, Drain-Source Voltage[V] VGS, Gate-Source Voltage[V]<br>Figure 3. On-Resistance Variation vs.  Figure 4. Body Diode Forward Voltage<br> Drain Current and Gate Voltage         Variation vs. Source Current<br>  and Temperature<br>0.36 100<br>0.30<br>0.24<br> 150 [o] C<br>VGS = 10V<br>er oe AT)<br>10<br>0.18<br>25 [o] C<br>VGS = 20V<br>0.12<br>Notes:<br>1. VGS = 0V<br>0.06 ae * Note : TJ = 25 [o] C 1 LEE 2. 250  s Pulse Test<br>0 10 20 30 40 50 60 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>ina [|<br>ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]<br>Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics<br>5000 10<br>8 V DS = 50V<br>1000 —tet)lCU Ciss V V DS DS  = 100V  = 160V TY<br>6<br>C oss<br>* Note: 4<br>100 1. VGS = 0V<br>2. f = 1MHz<br>C iss = C gs  + C gd (C ds = shorted) Crss 2<br>Coss = Cds + Cgd<br>Crss = Cgd * Note : ID = 16A<br>10 IN 0 Ape<br>0.1 1 10 30 0 7 14 21 28 35<br>VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]<br>, Drain Current[A] , Drain Current[A]<br>ID ID<br>],<br><br>[<br>DS)(on<br>R<br>, Reverse Drain Current [A]<br>Drain-Source On-Resistance IS<br>, Gate-Source Voltage [V]<br>Capacitances [pF]<br>GS<br>V<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**3** 

## **Typical Performance Characteristics** (Continued) 

**==> picture [446 x 604] intentionally omitted <==**

**----- Start of picture text -----**<br>
 Figure 7. Breakdown Voltage Variation   Figure 8. On-Resistance Variation<br> vs. Temperature   vs. Temperature<br>1.15 2.4<br>1.10 2.0 PP Ls<br>1.05<br>1.6<br>1.00<br>1.2<br>0.95<br>* Notes : 0.8 *Notes:<br>0.90  1. VGS = 0V 1. VGS = 10V<br> 2. I D  = 250uA 2. ID = 8A<br>0.85 0.4 peacen<br>-80 -40 0 40 80 120 160 -80 Hey -40 lees 0 40 80 120 160<br>ae TJ, Junction Temperature [ [o] C] PPA TJ, Junction Temperature [ [o] C]<br> Figure 9. Maximum Safe Operating Area   Figure 10. Maximum Drain Current<br>    vs. Case Temperature<br>100<br>16<br>30  s<br>100  s 12<br>10<br>1ms<br>8<br>10 ms<br>1<br>*Notes:<br>1. TC = 25 [o] C DC 4<br>2. T J = 150 [o] C<br>3. Single Pulse<br>AOS] E CP<br>0.10.1 1 10 100 1000 025 ilieecaes 50 75 100 125 150<br>Collector-Emitter Voltage, VCE [V] TC, Case Temperature [ [o] C]<br>   Figure 11. Transient Thermal Response Curve<br>2<br>1<br>0.5<br>0.2<br>0.1 P DM<br>0.1 0.05 t1<br>t2<br>0.02 * Notes :<br>0.01 1. Z  JC (t) = 1.4 [o] C/W Max.<br>Single pulse 2. Duty Factor, D=t1/t2<br>3. TJM - TC = PDM * Z  JC(t)<br>baat?<br>0.01<br>10-5 10-4 10-3 10-2 10-1 1<br>t1, Rectangular Pulse Duration [sec]<br>, [Normalized] , [Normalized]<br>DSS DS(on)<br>BV R<br>Drain-Source On-Resistance<br>Drain-Source Breakdown Voltage<br> [A]c , Drain Current [A]<br>Collector Current, I ID<br>C/W]<br>o<br>(t), Thermal Response [<br>ZJC θ<br>**----- End of picture text -----**<br>


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©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**4** 

**==> picture [392 x 401] intentionally omitted <==**

**----- Start of picture text -----**<br>
IG = const.<br>F<br>Charge<br> Figure 12. Gate Charge Test Circuit & Waveform<br>VDS RL VDS 90%<br>VGS VDD<br>RG<br>10%<br>V 10V GS DUT VGS<br>td(on) tr td(off) tf<br>=n wa tt onon 4S t off<br> Figure 13. Resistive Switching Test Circuit & Waveforms<br>Vos oy5 EASa“a Las?LIAS<br>lo oy} BVpss<br>of las<br>>in (ad) =F Von Ip (t)<br>VGS TL DUT Vop<br>**----- End of picture text -----**<br>


**Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms** 

www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**5** 

**==> picture [335 x 547] intentionally omitted <==**

**----- Start of picture text -----**<br>
DUT +<br>VDS<br>_<br>I SD<br>L<br>Driver<br>RG<br>Same Type<br>as DUT VDD<br>VGS • dv/dt controlled by  RG<br>• ISD controlled by pulse period<br>Gate Pulse Width<br>VGS D = --------------------------<br>Gate Pulse Period 10V<br>( Driver )<br>ff}<br>IFM , Body Diode Forward Current<br>I SD<br>( DUT ) di/dt<br>IRM<br>4 Ne<br>Body Diode Reverse Current<br>VDS<br>( DUT ) Body Diode Recovery dv/dt<br>VSD VDD<br>eerie<br>Body Diode<br>ForForwward Vard Vololttagage Dre Dropop<br>Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**6** 

## **Mechanical Dimensions** 

## **Figure 16. TO252 (D-PAK), Molded, 3-Lead, Option AA&AB** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003_ 

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©2011 Fairchild Semiconductor Corporation FDD18N20LZ Rev. C1 

**7** 

## **TRADEMARKS** 

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|AccuPower™<br>AX-CAP®*<br>BitSiC™<br>Build it Now™<br>CorePLUS™<br>CorePOWER™<br>_CROSSVOLT_™<br>CTL™<br>Current Transfer Logic™<br>DEUXPEED®<br>Dual Cool™<br>EcoSPARK®<br>EfficentMax™<br>ESBC™<br>Fairchild®<br>Fairchild Semiconductor®<br>FACT Quiet Series™<br>FACT®<br>FAST®<br>FastvCore™<br>FETBench™<br>FPS™<br>®|F-PFS™<br>FRFET®<br>Global Power ResourceSM<br>GreenBridge™<br>Green FPS™<br>Green FPS™ e-Series™<br>G_max_™<br>GTO™<br>IntelliMAX™<br>ISOPLANAR™<br>Marking Small Speakers Sound Louder<br>and Better™<br>MegaBuck™<br>MICROCOUPLER™<br>MicroFET™<br>MicroPak™<br>MicroPak2™<br>MillerDrive™<br>MotionMax™<br>mWSaver®<br>OptoHiT™<br>OPTOLOGIC®<br>OPTOPLANAR®|PowerTrench®<br>PowerXS™<br>Programmable Active Droop™<br>QFET®<br>QS™<br>Quiet Series™<br>RapidConfigure™<br>Saving our world, 1mW/W/kW at a time™<br>SignalWise™<br>SmartMax™<br>SMART START™<br>Solutions for Your Success™<br>SPM®<br>STEALTH™<br>SuperFET®<br>SuperSOT™-3<br>SuperSOT™-6<br>SuperSOT™-8<br>SupreMOS®<br>SyncFET™<br>™<br>tm®|Sync-Lock™<br>®*<br>TinyBoost®<br>TinyBuck®<br>TinyCalc™<br>TinyLogic®<br>TINYOPTO™<br>TinyPower™<br>TinyPWM™<br>TinyWire™<br>TranSiC™<br>TriFault Detect™<br>TRUECURRENT®*<br>μSerDes™<br>UHC®<br>Ultra FRFET™<br>UniFET™<br>VCX™<br>VisualMax™<br>VoltagePlus™<br>XS™<br>E SYSTEM<br>GENERAL<br>WZ...|
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|**Datasheet Identification**|**Product Status**|**Definition**|
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Rev. I66 

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**8** 

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