# Power MOSFET, P Channel, 30 V, 4.9 A, 0.042 ohm, SuperSOT, Surface Mount

![Product image](https://novapart.co/image/farnell:2101404/)

**URL**: https://novapart.co/products/FDC610PZ/power-mosfet-p-channel-30-v-49-a-0042-ohm-supersot
**SKU**: FDC610PZ
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1500
**Stock**: 1000+
**Lead Time**: 99 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-4.9A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.036ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-2

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 800mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SuperSOT |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 4.9A |
| Drain Source On State Resistance | 0.042ohm |
| Gate Source Threshold Voltage Max | 2.2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2101404/)

## **Is Now Part of** 

**To learn more about ON Semiconductor, please visit our website at www.onsemi.com** 

ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **FDC610PZ** 

## **P-Channel PowerTrench[®] MOSFET** 

## **–30V, –4.9A, 42m** Ω **Features** 

Max rDS(on) = 42mΩ at VGS = –10V, ID = –4.9A 

Max rDS(on) = 75mΩ at VGS = –4.5V, ID = –3.7A 

Low gate charge (17nC typical). 

High performance trench technology for extremely low rDS(on). SuperSOT[TM] –6 package: small footprint (72% smaller than standard SO–8) low profile (1mm thick). 

RoHS Compliant 

**==> picture [68 x 33] intentionally omitted <==**

**----- Start of picture text -----**<br>
August 2007<br>tm<br>**----- End of picture text -----**<br>


## **General Description** 

This P-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench **[®]** process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. These devices are well suited for battery power applications: load switching and power management, battery charging circuits, and DC/DC conversion. 

## **Application** 

DC - DC Conversion 

**==> picture [105 x 119] intentionally omitted <==**

**----- Start of picture text -----**<br>
S<br>D<br>D<br>G<br>D<br>D<br>Pin 1<br>SuperSOT [TM]  -6<br>**----- End of picture text -----**<br>


**==> picture [124 x 76] intentionally omitted <==**

**----- Start of picture text -----**<br>
D 1 6 D<br>D 2 5 D<br>G 33 4 S<br>**----- End of picture text -----**<br>


## **MOSFET Maximum Ratings** TA= 25°C unless otherwise noted 

|**MOSFET Maximum Ratings**|**MOSFET Maximum Ratings  **TA= 25°C unless otherwise notedA= 25°C unless otherwise noted= 25°C unless otherwise noted|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Ratings**|**Units**|
|VDS|Drain to Source Voltage|–30|V|
|VGS|Gate to Source Voltage|±25|V|
|ID|Drain Current    -Continuous(Note 1a)|–4.9|A|
||-Pulsed|–20||
|PD|Power Dissipation(Note 1a)|1.6|W|
||Power Dissipation(Note 1b)|0.8||
|TJ, TSTG|Operatingand Storage Junction Temperature Range|–55 to +150|°C|



## **Thermal Characteristics** 

## **Package Marking and Ordering Information** 

|**Device Marking**|**Device**|**Package**|**Reel Size**|**Tape Width**|**Quantity**|
|---|---|---|---|---|---|
|.610Z|FDC610PZ|SSOT6|7’’|8mm|3000units|



**1** 

©2007 Fairchild Semiconductor Corporation FDC610PZ Rev.B 

www.fairchildsemi.com 

## **Electrical Characteristics** TJ = 25°C unless otherwise noted 

|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= –250µA, VGS= 0V<br>–30<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= –250µA, referenced to 25°C<br>–22<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= –24V, VGS= 0V<br>–1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±25V, VDS= 0V<br>±10<br>µA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= –250µA<br>–1<br>–2.2<br>–3<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= –250µA, referenced to 25°C<br>6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= –10V,  ID= –4.9A<br>36<br>42<br>mΩ<br>VGS= –4.5V, ID= –3.7A<br>58<br>75<br>VGS= –10V,  ID= –4.9A, TJ= 125°C<br>50<br>60<br>gFS<br>Forward Transconductance<br>VDD= –10V,  ID= –4.9A<br>15<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= –15V, VGS= 0V,<br>f = 1MHz<br>755<br>1005<br>pF<br>Coss<br>Output Capacitance<br>145<br>195<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>125<br>190<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>13<br>Ω<br>~~Te~~<br>~~—————~~|**Symbol**<br>**Parameter**<br>**Test Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Units**<br>**Off Characteristics**<br>BVDSS<br>Drain to Source Breakdown Voltage<br>ID= –250µA, VGS= 0V<br>–30<br>V<br>∆BVDSS<br>∆TJ<br>Breakdown Voltage Temperature<br>Coefficient<br>ID= –250µA, referenced to 25°C<br>–22<br>mV/°C<br>IDSS<br>Zero Gate Voltage Drain Current<br>VDS= –24V, VGS= 0V<br>–1<br>µA<br>IGSS<br>Gate to Source Leakage Current<br>VGS= ±25V, VDS= 0V<br>±10<br>µA<br>**On Characteristics**<br>VGS(th)<br>Gate to Source Threshold Voltage<br>VGS= VDS,  ID= –250µA<br>–1<br>–2.2<br>–3<br>V<br>∆VGS(th)<br>∆TJ<br>Gate to Source Threshold Voltage<br>Temperature Coefficient<br>ID= –250µA, referenced to 25°C<br>6<br>mV/°C<br>rDS(on)<br>Static Drain to Source On Resistance<br>VGS= –10V,  ID= –4.9A<br>36<br>42<br>mΩ<br>VGS= –4.5V, ID= –3.7A<br>58<br>75<br>VGS= –10V,  ID= –4.9A, TJ= 125°C<br>50<br>60<br>gFS<br>Forward Transconductance<br>VDD= –10V,  ID= –4.9A<br>15<br>S<br>**Dynamic Characteristics**<br>Ciss<br>Input Capacitance<br>VDS= –15V, VGS= 0V,<br>f = 1MHz<br>755<br>1005<br>pF<br>Coss<br>Output Capacitance<br>145<br>195<br>pF<br>Crss<br>Reverse Transfer Capacitance<br>125<br>190<br>pF<br>Rg<br>Gate Resistance<br>f = 1MHz<br>13<br>Ω<br>~~Te~~<br>~~—————~~|
|---|---|
|**Switching Characteristics**||
|td(on)<br>Turn-On DelayTime<br>VDD= –15V, ID= –4.9A<br>VGS= –10V, RGEN= 6Ω<br>7<br>14<br>ns<br>tr<br>Rise Time<br>4<br>10<br>ns<br>td(off)<br>Turn-Off DelayTime<br>33<br>53<br>ns||
|tf<br>Fall Time<br>23<br>37<br>ns||
|Qg<br>Total Gate Charge<br>VGS= 0V to –10V<br>VDD= –15V,<br>ID= –4.9A<br>17<br>24<br>nC<br>Qg<br>Total Gate Charge<br>VGS= 0V to –4.5V<br>9<br>13<br>nC<br>Qgs<br>Gate to Source Gate Charge<br>2.9<br>nC<br>Qgd<br>Gate to Drain “Miller” Charge<br>4.3<br>nC<br>~~—————~~||
|**Drain-Source Diode Characteristics**||
|IS<br>Maximum Continuous Drain-Source Diode Forward Current<br>–1.3<br>A<br>VSD<br>Source to Drain Diode  Forward Voltage VGS = 0V, IS = –1.3A(Note 2)<br>–0.8<br>–1.2<br>V<br>trr<br>Reverse RecoveryTime<br>IF= –4.9A, di/dt = 100A/µs<br>19<br>35<br>ns<br>Qrr<br>Reverse RecoveryCharge<br>9<br>18<br>nC<br>~~————~~||
|**Notes:**||
|1. RθJAis determined with the device mounted on a 1in2pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJCis guaranteed by design while RθCAis determined by|is determined by|
|the user's board design.||
|a. 78°C/W when mounted  on  a<br>1 in2pad of  2 oz  copper.<br>b. 156°C/W when mounted on  a<br>minimum pad of 2 oz copper.||



2. Pulse Test: Pulse Width < 30 0 µs, Duty cycle < 2.0%. 

www.fairchildsemi.com 

**2** 

FDC610PZ Rev . B 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [469 x 576] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 5.0<br>PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s 4.5 VGS = -3.5V PULSE DURATION = 80DUTY CYCLE = 0.5%MAX µ s<br>15 VGS =  -10V 4.0<br>VGS = -5V 3.5 VGS = -4V<br>VGS =  -4.5V 3.0<br>10 VGS =  -4.5V<br>2.5<br>VGS = -4V<br>2.0<br>5 1.5 VGS = -5V<br>VGS = -3.5V<br>1.0<br>VGS =  -10V<br>0 0.5<br>0 1 2 3 4 0 5 10 15 20<br>-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT(A)<br>Figure 1.  On-Region Characteristics Figure 2.  Normalized On-Resistance<br>vs Drain Current and Gate Voltage<br>1.6 200<br> ID = -4.9A PULSE DURATION = 80 µ s<br>VGS = -10V ID = -4.9A DUTY CYCLE = 0.5%MAX<br>1.4<br>150<br>1.2<br>100<br>1.0 TJ = 125 [o] C<br>50<br>0.8<br>TJ = 25 [o] C<br>0.6 0<br>-75 -50 -25 0 25 50 75 100 125 150 3 4 5 6 7 8 9 10<br>TJ, JUNCTION TEMPERATURE ( [o] C) -VGS, GATE TO SOURCE VOLTAGE (V)<br>Figure 3.  Normalized  On- Resistance                                         Figure 4.   On-Resistance vs  Gate to<br>vs Junction Temperature Source Voltage<br>20 20<br>PULSE DURATION = 80 µ s 10 VGS = 0V<br>DUTY CYCLE = 0.5%MAX<br>15 VDD = -5V<br>1<br>10 TJ = 150 [o] C<br>0.1<br>TJ = 150 [o] C TJ = 25 [o] C<br>5<br>TJ = 25 [o] C 0.01<br>TJ = -55 [o] C TJ = -55 [o] C<br>0 1E-3<br>1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)<br>Figure 5.  Transfer Characteristics Figure 6.    Source to Drain  Diode<br>Forward Voltage vs Source Current<br>NORMALIZED<br>DRAIN CURRENT (A)<br>,<br>D<br>-I<br>DRAIN TO SOURCE ON-RESISTANCE<br>)<br>Ω<br>m<br>(<br>, DRAIN TO<br>NORMALIZED<br>rDS(on)<br>SOURCE ON-RESISTANCE<br> DRAIN TO SOURCE ON-RESISTANCE<br>, DRAIN CURRENT (A)<br>D<br>-I , REVERSE DRAIN CURRENT (A)<br>S<br>-I<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**3** 

FDC610PZ Rev . B 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [468 x 563] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 2000<br>ID = -4.9A<br>8 1000 Ciss<br>VDD = -10V<br>VDD = -15V<br>6<br>VDD = -20V Coss<br>4<br>Crss<br>2 100<br>f = 1MHz<br>VGS = 0V<br>0 50<br>0 4 8 12 16 20 0.1 1 10 30<br>Qg, GATE CHARGE(nC) -VDS, DRAIN TO SOURCE VOLTAGE (V)<br>Figure 7.  Gate Charge Characteristics Figure 8.  Capacitance vs Drain<br>to Source Voltage<br>105 30<br>104 VDS = 0V 10 100us<br>103<br>102 1ms<br>1<br>101 TJ = 150 [o] C 10ms<br>SINGLE PULSE<br>100 TJ = MAX RATED 100ms<br>10-1 TJ = 25 [o] C 0.1 TRA θ JA= 25= 156 [o] C [o] C/W 1s<br>-2 THIS AREA IS  10s<br>10<br>LIMITED BY r DC<br>DS(on)<br>10-3 0.01<br>0 5 10 15 20 25 30 35 0.1 1 10 100<br>-VGS, GATE TO SOURCE VOLTAGE (V) -VDS, DRAIN to SOURCE VOLTAGE (V)<br>Figure 9.  Gate Leakage Current vs Gate to                  Figure 10.  Forward Bias Safe<br>Source Voltage Operating Area<br>1000<br>VGS = -10V SINGLE PULSE<br>R θ JA = 156 [o] C/W<br>TA = 25 [o] C<br>100<br>10<br>1<br>0.5<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, PULSE WIDTH (s)<br>CAPACITANCE (pF)<br>, GATE TO SOURCE VOLTAGE(V)<br>GS<br>-V<br>, DRAIN CURRENT (A)<br>D<br> -I<br>GATE LEAKAGE CURRENT(uA)<br>,<br>g<br>-I<br>, PEAK TRANSIENT POWER (W)<br>(PK)<br>P<br>**----- End of picture text -----**<br>


**Figure 11.  Single Pulse Maximum Power Dissipation** 

www.fairchildsemi.com 

**4** 

FDC610PZ Rev . B 

## **Typical Characteristics** TJ = 25°C unless otherwise noted 

**==> picture [467 x 202] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1 DUTY CYCLE-DESCENDING ORDER<br>D = 0.5<br>      0.2<br>      0.1<br>0.1       0.05 PDM<br>      0.02<br>      0.01<br>t1<br>t2<br>0.01 NOTES:<br>DUTY FACTOR: D = t1/t2<br>SINGLE PULSE PEAK TJ = PDM x Z θJA  x R θJA  + TA<br>R θ JA = 156 [o] C/W<br>1E-3<br>10-4 10-3 10-2 10-1 100 101 102 103<br>t, RECTANGULAR PULSE DURATION (s)<br>Figure 12.  Transient Thermal Response Curve<br>ZJA θ<br>IMPEDANCE,<br>NORMALIZED THERMAL<br>**----- End of picture text -----**<br>


www.fairchildsemi.com 

**5** 

FDC610PZ Rev . B 

## **TRADEMARKS** 

The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 

ACEx[®] Green FPS™ Power247[® ] SuperSOT™-8 Build it Now™ Green FPS™ e-Series™ POWEREDGE[® ] SyncFET™ CorePLUS™ GTO™ Power-SPM™ The Power Franchise[® ] _CROSSVOLT_ CTL™ ™ _i-Lo_ IntelliMAX™ ™ PowerTrenchProgrammable Active Droop[® ] ™ PaneD wer Current Transfer Logic™ ISOPLANAR™ QFET[®] TinyBoost™ EcoSPARK®[®] MegaBuck™ MICROCOUPLER™ QSQT Optoelectronics™ ™ TinyLogicTinyBuck™[®] Fairchild[®] MicroFET™ Quiet Series™ TINYOPTO™ Fairchild Semiconductor[®] MicroPak™ RapidConfigure™ TinyPower™ FACT Quiet Series™ MillerDrive™ SMART START™ TinyPWM™ FACT[®] Motion-SPM™ SPM[®] TinyWire™ FAST[®] OPTOLOGIC[®] STEALTH™ μSerDes™ FastvCore™ OPTOPLANAR[® ] SuperFET™ UHC[®] FPS™ ® SuperSOT™-3 UniFET™ FRFET[® ] PDP-SPM™ SuperSOT™-6 VCX™ Global Power ResourceSM Power220[®] 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

## As used herein: 

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

## **PRODUCT STATUS DEFINITIONS** 

## **Definition of Terms** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative or In Design|This datasheet contains the design specifications for product<br>development. Specifications may change in any manner without notice.|
|Preliminary|First Production|This datasheet contains preliminary data; supplementary data will be<br>published at a later date. Fairchild Semiconductor reserves the right to<br>make changes at any time without notice to improve design.|
|No Identification Needed|Full Production|This datasheet contains final specifications. Fairchild Semiconductor<br>reserves the right to make changes at any time without notice to improve<br>design.|
|Obsolete|Not In Production|This datasheet contains specifications on a product that has been<br>discontinued by Fairchild Semiconductor. The datasheet is printed for<br>reference information only.|



© 2007 Fairchild Semiconductor Corporation 

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ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**1** 



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