EYGN0912QB3S
Thermal Insulator, PGS Composit Type, 0.026 W/m.K, 1 mm
- Manufacturer: PANASONIC
- Product type: Thermal Insulators
- Insulator Body Material:-; Thermal Conductivity:0.026W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Diel; Available until stocks are exhausted
- Thickness: 1mm
- Product Range: EYGN
- Thermal Impedance: -
- Volume Resistivity: -
- Dielectric Strength: -
- Thermal Conductivity: 0.026W/m.K
- Breakdown Voltage Vbr: -
- Insulator Body Material: -
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 11.72 € |
| Current stock | 10+ |
| Lead time | 30 days |
**“NASBIS” Insulating Sheet** ## **“NASBIS” Insulating Sheet** ## Type: **EYGY/EYGN** “NASIBIS” is a heat insulating sheet, which is composed of silica aerogel and fiber sheet, created through impregnation process. Pore size of silica aerogel is 10 to 60nm, which means it has smaller space than the mean path of the air, 68nm. Air molecules do not collide against each other inside the pores, and thus the component shows excellecnt heat insulation performace. Furthermore, combining NASBIS and PGS Graphite Sheet enables controlling the direction of heat. Composit type provides greater heat insulating performance. ## **Features** - Low thermal conductivity : 0.020 W/m · K typ. - Created thin-fi lm sheet ; Thickness : 100 μm to 1000 μm - Various proposals are available when combined with PGS Graphite sheet - RoHS compliant ## **Recommended applications** - Smartphone, Wearable equipment, Digital Still Camera, Notebook PCs, Tablet PCs ## **Explanation of Part Numbers** ## ● NASBIS Pouch Type (EYGY✽✽✽✽✽✽✽✽) **==> picture [481 x 387] intentionally omitted <==** **----- Start of picture text -----**<br> 1 2 3 4 5 6 7 8 9 10 11 12<br>E Y G Y 0 9 1 2 Q N 6 S<br>FiO UU UU UU U0<br>Product Code Dimension Type Thickness of PGS Thickness of NASBIS PET or Adhesive<br>NASBIS 0912 90 mm × 115 mm Q Normal type N PGS free type 3 1000 μm X PET(10 μm)×2<br>4 500 μm W PET(30 μm)×2<br>PET tape<br>6 100 μm V PET( 5 μm)+Adhesive( 6 μm)<br>NASBIS<br>U PET( 5 μm)+Adhesive(10 μm)<br>Adhesive tape or PET tape T PET( 5 μm)+Adhesive(30 μm)<br>= Separator S PET(10 μm)+Adhesive(10 μm)<br>✽ Please consult the other configurations separately.<br>● NASBIS and PGS Composit Type (EYGN✽✽✽✽✽✽✽✽)<br>1 2 3 4 5 6 7 8 9 10 11 12<br>E Y G N 0 9 1 2 Q E 6 S<br>Fb UU UU O U O U OU oo<br>Product Code Dimension Type Thickness of PGS Thickness of NASBIS PET or Adhesive<br>NASBIS 0912 90 mm × 115 mm Q Normal type B 70 μm 3 1000 μm X PET(10 μm)×2<br>G Reversal type C 50 μm 4 500 μm W PET(30 μm)×2<br>G 40 μm 6 100 μm V PET( 5 μm)+Adhesive( 6 μm)<br>PET tape PET tape<br>D 25 μm U PET( 5 μm)+Adhesive(10 μm)<br>NASBIS PGS<br>E 17 μm T PET( 5 μm)+Adhesive(30 μm)<br>Adhesive tape Adhesive tape<br>6 μm 6 μm F 10 μm S PET(10 μm)+Adhesive(10 μm)<br>PGS NASBIS<br>Adhesive tape Adhesive tape ✽ Please consult the other configurations separately.<br>or PET tape or PET tape<br>2 2 =<br>Separator Separator<br>Normal type Reversal type<br>Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.<br>Should a safety concern arise regarding this product, please be sure to contact us immediately. 00<br>**----- End of picture text -----**<br> 00 May. 2016 **“NASBIS” Insulating Sheet** ## Lo **Characteristics of NASBIS** |**Characteristics of NASBIS**<br>Lo|||| |---|---|---|---| |Thickness|100 μm|500 μm|1000 μm| |Thermal conductivity (W/(m·K))|0.018 to 0.026|0.018 to 0.026|0.018 to 0.026| |Operating temperature limit (°C)|−20 to 100|−20 to 100|−20 to 100| |Size / Laminate pouch (mm)|90×115|90×115|90×115| |Heatproof temperature(°C)|100|100|100| ## ~~ee~~ **Appearance of silica aerogel and its nanostructure** **==> picture [142 x 61] intentionally omitted <==** **----- Start of picture text -----**<br> Pore diameter<br>10 to 60 nm<br>wv C Diameter of silica<br>about 10 nm<br>**----- End of picture text -----**<br> Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016 **“NASBIS” Insulating Sheet** ## **Composition example** ## ● NASBIS Pouch Type **==> picture [491 x 188] intentionally omitted <==** **----- Start of picture text -----**<br> Type Y - X type Y - W type Y - T type Y - S type<br>PET 10 μm PET 30 μm PET 5 μm PET 10 μm<br>Structure NASBIS NASBIS NASBIS NASBIS<br>PET 10 μm PET 30 μm Adhesive 30 μm Adhesive 10 μm<br>Heatproof temperature 100 °C 100 °C 100 °C 100 °C<br>Standard Part No. EYGY0912QN6X EYGY0912QN6W EYGY0912QN6T EYGY0912QN6S<br>100 μm<br>Thickness 120 μm 160 μm 135 μm 120 μm<br>Standard Part No. EYGY0912QN4X EYGY0912QN4W EYGY0912QN4T EYGY0912QN4S<br>500 μm<br>Thickness 520 μm 560 μm 535 μm 520 μm<br>Standard Part No. EYGY0912QN3X EYGY0912QN3W EYGY0912QN3T EYGY0912QN3S<br>1000 μm<br>Thickness 1020 μm 1060 μm 1035 μm 1020 μm<br>**----- End of picture text -----**<br> ## ● NASBIS and PGS Composit Type Normal type **==> picture [491 x 145] intentionally omitted <==** **----- Start of picture text -----**<br> Type N - X type N - W type N - T type N - S type<br>PET 10 μm PET 30 μm PET 5 μm PET 10 μm<br>NASBIS NASBIS NASBIS NASBIS<br>Structure Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm<br>PGS PGS PGS PGS<br>PET 10 μm PET 30 μm Adhesive 30 μm Adhesive 10 μm<br>Heatproof temperature 100 °C 100 °C 100 °C 100 °C<br>100 μm Standard Part No. EYGN0912Q□6X EYGN0912Q□6W EYGN0912Q□6T EYGN0912Q□6S<br>500 μm Standard Part No. EYGN0912Q□4X EYGN0912Q□4W EYGN0912Q□4T EYGN0912Q□4S<br>1000 μm Standard Part No. EYGN0912Q□3X EYGN0912Q□3W EYGN0912Q□3T EYGN0912Q□3S<br>**----- End of picture text -----**<br> ## ● NASBIS and PGS Composit Type Reversal type **==> picture [491 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> Type N - X type N - W type N - T type N - S type<br>PET 10 μm PET 30 μm PET 5 μm PET 10 μm<br>PGS PGS PGS PGS<br>Structure Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm Adhesive 6 μm<br>NASBIS NASBIS NASBIS NASBIS<br>PET 10 μm PET 30 μm Adhesive 30 μm Adhesive 10 μm<br>Heatproof temperature 100 °C 100 °C 100 °C 100 °C<br>100 μm Standard Part No. EYGN0912G□6X EYGN0912G□6W EYGN0912G□6T EYGN0912G□6S<br>500 μm Standard Part No. EYGN0912G□4X EYGN0912G□4W EYGN0912G□4T EYGN0912G□4S<br>1000 μm Standard Part No. EYGN0912G□3X EYGN0912G□3W EYGN0912G□3T EYGN0912G□3S<br>**----- End of picture text -----**<br> ■ **Minimum order 10 pcs.** Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016
Updated at April 28, 2026
Panasonic Industry is a global leader in the design and manufacture of high-quality electronic components. Renowned for a commitment to continuous innovation, the company provides the essential building blocks that empower modern engineering. From industrial automation to consumer electronics, Panasonic's components are trusted worldwide for their outstanding reliability, efficiency, and long-term performance. The extensive portfolio is anchored by a massive selection of passive components, featuring an industry-leading range of aluminium electrolytic, film, and polymer capacitors. Alongside these advanced capacitance solutions, engineers rely on Panasonic's robust power inductors and a highly versatile array of electromechanical devices, including solid-state, power, and signal relays engineered to excel in demanding environments. Beyond core passives and switching solutions, the offering encompasses critical circuit protection devices such as TVS varistors and NTC thermistors, as well as sophisticated thermal management materials. Panasonic also delivers precision light and motion sensors, highly reliable batteries, and advanced Bluetooth and WLAN connectivity modules, providing a comprehensive ecosystem of components to support next-generation technological design.
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