ES1DAF

## ES1DAF, ES1JAF 

## Surface Mount Ultrafast Rectifier 

## **Features** 

- Fast Switching Speed – Maximum Trr 35 ns 

- Ultra Thin Profile − Maximum Height of 1.0 mm 

- Glass Passivated Junction 

- UL Flammability 94V−0 Classification 

- MSL 1 

- Green Mold Compound 

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www.onsemi.com<br>1 2<br>Cathode Anode<br>Ultrafast Rectifier<br>**----- End of picture text -----**<br>


- These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant 

## **Specifications** 

**ABSOLUTE MAXIMUM RATINGS** (TA = 25 ° C unless otherwise noted) 

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Value<br>Symbol Parameter ES1DAF ES1JAF Unit<br>VRRM Recurrent Peak Reverse Voltage 200 600 V<br>VRMS RMS Voltage 140 420 V<br>VR DC Blocking Voltage 200 600 V<br>IF(AV) Average Forward Current 1 A<br>IFSM Peak Forward Surge Current:  30 A<br>8.3 ms Single Half Sine−Wave<br>Superimposed on Rated Load<br>TJ Operating Junction Temperature −55 to +150 °C<br>Range<br>TSTG Storage Temperature Range −55 to +150 °C<br>7<br>Stresses exceeding those listed in the Maximum Ratings table may damage the<br>device. If any of these limits are exceeded, device functionality should not be<br>assumed, damage may occur and reliability may be affected.<br>**----- End of picture text -----**<br>


**DO−214AD (SMAF) CASE 403AD** 

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MARKING DIAGRAMS<br>$Y&Z&3<br>ES1DAF<br>Band Indicates Cathode<br>$Y = ON Semiconductor Logo<br>&Z = Assembly Plant Code<br>&3 = Data Code (Year & Week)<br>ES1DAF = Specific Device Code<br>$Y&Z&3<br>ES1JAF<br>Band Indicates Cathode<br>$Y = ON Semiconductor Logo<br>&Z = Assembly Plant Code<br>&3 = Data Code (Year & Week)<br>ES1JAF = Specific Device Code<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 2 of this data sheet. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2015 **May, 2018 − Rev. 2** 

**ES1JAF/D** 

**ES1DAF, ES1JAF** 

**THERMAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**THERMAL**|**CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||
|---|---|---|---|
|**Symbol**|**Characteristic**|**Value**|**Unit**|
|�JL|Typical Thermal Characteristics, Junction−to−Lead (Note 1)|24|°C/W|
|R�JA|Typical Thermal Resistance, Junction−to−Ambient (Note 2)|150|°C/W|



1. Mounted on an FR4 PCB, single−sided copper, with 48 cm[2] copper pad area. 

2. Mounted on an FR4 PCB, single−sided copper, mini pad. 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**Symbol**|**Parameter**|**Conditions**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|VF|Forward Voltage|IF= 1 A|ES1DAF|−|−|0.95|V|
||||ES1JAF|−|−|1.70||
|IR|Reverse Current|VR= VDC||−|−|1|�A|
|trr|Reverse Recovery Time|IF= 0.5 A, IR= 1 A, Irr= 0.25 A||−|−|34|ns|
|CJ|Junction Capacitance|VR= 4 V, f = 1 MHz||−|15|−|pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Part Number**|**Top Mark**|**Package**|**Shipping**†|
|ES1DAF|ES1DAF|DO−214AD (SMAF)<br>(Pb−Free/Halogen Free)|10000 / Tape & Reel|
|ES1JAF|ES1JAF|DO−214AD (SMAF)<br>(Pb−Free/Halogen Free)|10000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**2** 

**ES1DAF, ES1JAF** 

## **TYPICAL PERFORMANCE CHARACTERISTICS** 

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1.2<br>1<br>0.8<br>0.6<br>0.4<br>0.2<br>0<br>0 25 50 75 100 125 150<br>TC, Case Temperature ( � C)<br>, Forward Current (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 1. Forward Current Derating Curve** 

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100<br>10<br>1<br>0.1 1 10 100<br>VR, Reverse Bias Voltage (V)<br>, Junction Capacitance (pF)<br>J<br>C<br>**----- End of picture text -----**<br>


**Figure 2. Typical Junction Capacitance** 

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100 100<br>200 V 600 V<br>10 ° TA = 150 ° C<br>TA = 125 C 10<br>1<br>0.1 TA = 150 ° C TA = 75 ° C 1 TTAA = 125 = 75 ° C ° C<br>0.01 TA = 25 ° C 0.1 TA = 25 ° C<br>0.001 0.01<br>50 100 150 200 20 40 60 80 100<br>VR, Peak Reverse Voltage (V) Percent of Rated Peak Reverse Voltage (%)<br>A)<br>� A)<br>, Reverse Current ( �<br>IR , Reverse Current (IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Characteristics** 

**Figure 4. Typical Reverse Characteristics** 

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200 V<br>1<br>TA = 125 ° C<br>0.1 TA = 150 ° C<br>TA = 75 ° C<br>TA = 25 ° C<br>0.01<br>0 0.2 0.4 0.6 0.8 1<br>VF, Forward Voltage (V)<br>, Forward Current (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 5. Typical Forward Characteristics** 

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600 V<br>1<br>TA = 125 ° C<br>TA = 150 ° C<br>0.1 TA = 75 ° C<br>TA = 25 ° C<br>0.01<br>0 0.5 1 1.5 2<br>VF, Forward Voltage (V)<br>, Forward Current (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 6. Typical Forward Characteristics** 

**www.onsemi.com** 

**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMA−FL** CASE 403AD ISSUE O 

DATE 31 AUG 2016 

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1.90 2.70<br>1.60 2.30<br>4.00<br>3.60<br>0.25<br>1.10<br>0.10<br>0.90<br>5.00<br>4.40<br> 0.38<br> 1.60<br>0.95 0.95<br>0.50 0.50<br> 1.60<br>**----- End of picture text -----**<br>


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 2.04  2.04<br> 1.89<br> 1.24<br>**----- End of picture text -----**<br>


LAND PATTERN RECOMMENDATION 

NOTES: 

- A. THIS PACKAGE DOES NOT CONFORM TO ANY STANDARDS. 

- B. ALL DIMENSIONS ARE IN MILLIMETERS. 

- C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. 

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DOCUMENT NUMBER: 98AON13439G Electronic versions are uncontrolled except when<br>accessed directly from the Document Repository. Printed<br>STATUS: ON SEMICONDUCTOR STANDARD<br>versions are uncontrolled except when stamped<br>“CONTROLLED COPY” in red.<br>NEW STANDARD:<br>©   Semiconductor Components Industries, LLC, 2002 http://onsemi.com Case Outline Number:<br>October, 2002 − Rev. 0DESCRIPTION: SMA−FL 1 PAGE 1 OF 2XXX<br>**----- End of picture text -----**<br>


|**DOCUMENT NUMBER:**<br>**98AON13439G**<br>**PAGE 2 OF 2**<br>~~eT ©~~<br>~~——~~|**DOCUMENT NUMBER:**<br>**98AON13439G**<br>**PAGE 2 OF 2**<br>~~eT ©~~<br>~~——~~|
|---|---|
|**ISSUE**|**REVISION**<br>**DATE**|
|O|RELEASED FOR PRODUCTION FROM FAIRCHILD DO214AD TO ON<br>31 AUG 2016|
||SEMICONDUCTOR. REQ. BY B. NG.|



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Case Outline Number: 

© Semiconductor Components Industries, LLC, 2016 **August, 2016 − Rev. O** 

**403AD** 

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