ERB-RG4R00V

**Micro Chip Fuse** 

## **Micro Chip Fuse** 

## Type: **ERBRD ERBRE ERBRG** 

## **Features** 

- Small size 

- Fast-acting and withstanding in-rush current characteristics 

- RoHS compliant 

## **Approved Safety Standards** 

UL248-14 : File No.E194052 

**==> picture [515 x 481] intentionally omitted <==**

**----- Start of picture text -----**<br>
 c-UL C22.2 No.248-14 : File No.E194052<br>Explanation of Part Numbers<br>1 2 3 4 5 6 7 8 9 10<br>E R B R D 1 R 0 0 X<br>Product Code Structure Product shape Rated Current (A) Code Packaging Part No.<br>Micro Chip Fuse R Rectangular type D (1.0 mm0402 inch size×0.5 mm) 0R250R31 0.315 A0.25 A 1R401R50 1.4 A1.5 A X Pressed Carrier Taping2 mm pitch, 10,000 pcs. [ERBRD]<br>E (1.6 mm0603 inch size×0.8 mm) 0R370R50 0.375 A0.50 A 2R002R50 2.0 A2.5 A V Punched Carrier Taping4 mm pitch, 5,000 pcs. ERBREERBRG<br>1206 inch size 0R63 0.63 A 3R00 3.0 A<br>G<br>(3.2 mm×1.6 mm) 0R75 0.75 A 3R15 3.15 A<br>1R00 1.0 A 4R00 4.0 A<br>Sea 1R25 1.25 A 5R00 5.0 A<br>Construction Dimensions in mm (not to scale)<br>L<br>a<br>W<br>Protective Coating Electrode (Base)<br>t<br>A<br>b<br>Fusing Element Electrode(Outer) Part No. Dimensions  (mm) (Weight)Mass<br>Almina Substrate (inch size) L W a b t (g/1000 pcs.)<br>ERBRD(0402) 1.00±0.10 0.50+0.10–0.05 0.15±0.10 0.25±0.10 0.39 ±0.10 0.7<br>ERBRE(0603) 1.60±0.15 0.80+0.15–0.05 0.24±0.15 0.30±0.15 0.54 ±0.10 2.2<br>ERBRG 3.20±0.20 1.60±0.15 0.30±0.20 0.55±0.20 0.65±0.10 10<br>= (1206)<br>**----- End of picture text -----**<br>


Design and specifications are each subject to change without notice.  Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

05 Sep. 2016 

**Micro Chip Fuse** 

## **Ratings** 

- 0402 inch /1005 mm size : Type ERBRD 

|Part No.||ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|ERBRD□R□□X|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||0R25|0R31|0R37|0R50|0R63|0R75|1R00|1R25|1R50|2R00|2R50|3R00|4R00|5R00|
|Rated Current (A)|0.25|0.315|0.375|0.5|0.63|0.75|1.0|1.25|1.5|2.0|2.5|3.0|4.0|5.0|
|Marking Code|V|X|Y|F|6|G|H|J|K|N|O|P|S|T|
|Internal R (mΩ) at 25 °C max.|700|520|440|310|220|190|125|82|70|53|42|37|24|19.5|
|Fusing Current/Fusing Time<br>(at 25 °C)||Rated Current×100 % / 4 hours min.|||||||||||||
|||Rated Current×200 % / 5 seconds max.|||||||||||||
|||Rated Current×300 % / 0.2 seconds max.|||||||||||||
|Rated Voltage<br>(Open Circuit Voltage)||32 VDC|||||||||||||
|Interrupting Rating<br>(at Rated Voltage)||35 A|||||||||||||
|Category Temp. Range||−40 °C to +125 °C|||||||||||||



## ● 0603 inch / 1608 mm size : Type ERBRE 

|Part No.|||ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|ERBRE□R□□V|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||0R50|0R75|1R00|1R25|1R40|1R50|2R00|2R50|3R00|3R15|4R00|5R00|
|Rated Current(A)|0.5|0.75|1.0|1.25|1.4|1.5|2.0|2.5|3.0|3.15|4.0|5.0|
|MarkingCode|F|G|H|J|14|K|N|O|P|31|S|T|
|Internal R (mΩ) at 25 °C max.|330|190|125|94|85|72|51|40|33|32|22|19|
|Fusing Current/Fusing Time<br>(at 25 °C)|||Rated Current×100 % / 4 hours min.||||||||||
||||Rated Current×200 % / 5 seconds max.||||||||||
||||Rated Current×300 % / 0.2 seconds max.||||||||||
|Rated Voltage<br>(Open Circuit Voltage)|||32 VDC||||||||||
|Interrupting Rating<br>(at Rated Voltage)|||50 A||||||||||
|Category Temp. Range|||−40 °C to +125 °C||||||||||



## ● 1206 inch / 3216 mm size : Type ERBRG 

|Part No.||ERBRG□R□□V|ERBRG□R□□V|ERBRG□R□□V|ERBRG□R□□V|ERBRG□R□□V|ERBRG□R□□V|||
|---|---|---|---|---|---|---|---|---|---|
||0R50|0R75|1R00|1R25|1R50|2R00|2R50|3R00|4R00|
|Rated Current (A)|0.5|0.75|1.0|1.25|1.5|2.0|2.5|3.0|4.0|
|Marking Code|F|G|H|J|K|N|O|P|S|
|Internal R (mΩ) at 25 °C max.|560|340|210|175|115|85|65|45|35|
|Fusing Current/Fusing Time<br>(at 25 °C)||Rated Current×100 % / 4 hours min.||||||||
|||Rated Current×200 % / 5 seconds max.||||||||
|||Rated Current×300 % / 0.2 seconds max.||||||||
|Rated Voltage<br>(Open Circuit Voltage)||63 VDC||||||32 VDC||
|Interrupting Rating<br>(at Rated Voltage)||50 A||||||||
|Category Temp. Range||−40 °C to +125 °C||||||||



- ✽ The thin type is available about 1005 (0402 inch) size. Please contact us for details. 

✽ Please contact us when another rated current is needed. 

Design and specifications are each subject to change without notice.  Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

05 Sep. 2016 

**Micro Chip Fuse** 

## **Fusing Characteristics (25 °C typical)** 

**==> picture [491 x 352] intentionally omitted <==**

**----- Start of picture text -----**<br>
● 0402 inch / 1005 mm size ● 0603 inch / 1608 mm size<br>    (Type ERBRD)     (Type ERBRE)<br>10 10<br>1 1<br>0.1 0.1<br>0.01 0.01<br>0.001 0.001<br>✽ Reference Only<br>✽ Reference Only<br>0.0001 0.0001<br>0.1 1 Fusing Current (A)10 100 0.1 1 Fusing Current (A)10 100<br>● 1206 inch /3216 mm size<br>    (Type ERBRG)<br>10<br>1<br>0.1<br>0.01<br>0.001<br>✽ Reference Only<br>0.0001<br>0.1 1 10 100<br>Fusing Current (A)<br>0.25 A 0.315 A 0.375 A 0.5 A 0.63 A 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A 5.0 A 0.5 A 0.75 A 1.0 A 1.25 A 1.4 A 1.5 A 2.0 A 2.5 A 3.0 A 3.15 A 4.0 A 5.0 A<br>Fusing Time (s) Fusing Time (s)<br>0.5 A 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A<br>Fusing Time (s)<br>**----- End of picture text -----**<br>


## **Packaging Methods** 

## ● Standard Quantity 

**==> picture [491 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
Part No. inch size Kind of Taping Pitch (P1) Quantity<br>ERBRD 0402 Pressed Carrier Taping 2 mm  10,000 pcs./ reel<br>ERBRE 0603<br>Punched Carrier Taping 4 mm  5,000 pcs./ reel<br>ERBRG 1206<br>● Carrier Taping (Unit : mm) ● Taping Reel (Unit : mm)<br>Pressed Punched P1 P2 P0<br>Carrier Carrier fD0<br>fC<br>T T A P1 (2 mm pitch) W1<br>fA W2<br>Part No. A B W F E Part No. 0A 0N 0C W1 W2<br>ERBRD 0.68±0.10 1.20±0.10 ERBRD<br>0 +1.0 ±0.2 +1.0 ±1.0<br>ERBRE 1.10±0.10 1.90±0.10 8.00±0.20 3.50±0.05 1.75±0.10 ERBRE 180.0–1.5 60   0 13.0 9.0   0 11.4<br>ERBRG<br>ERBRG 2.00±0.15 3.60±0.20<br>Part No. P1 P2 P0 0D0 T<br>ERBRD 2.00±0.10 0.67±0.07<br>±0.05 ±0.10 +0.10 ±0.07<br>ERBREERBRG 4.00±0.10 2.00 4.00 1.50 0 0.780.84±0.07<br>E<br>F W Nf<br>B<br>**----- End of picture text -----**<br>


Design and specifications are each subject to change without notice.  Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

05 Sep. 2016 

**Micro Chip Fuse** 

## **Recommended Soldering Conditions** 

|||A<br>B|C||Dimensions (mm)<br>A<br>B<br>C<br>0.5 to 0.6<br>1.4 to 1.6<br>0.4 to 0.6<br>0.7 to 0.9<br>2.0 to 2.2<br>0.8 to 1.0<br>2.0 to 2.4<br>4.4 to 5.0<br>1.2 to 1.8|Dimensions (mm)<br>A<br>B<br>C<br>0.5 to 0.6<br>1.4 to 1.6<br>0.4 to 0.6<br>0.7 to 0.9<br>2.0 to 2.2<br>0.8 to 1.0<br>2.0 to 2.4<br>4.4 to 5.0<br>1.2 to 1.8|
|---|---|---|---|---|---|---|
|||||Part No.<br>(inch size)|||
||||||||
||||||A|B|
|||||ERBRD(0402)|0.5 to 0.6|1.4 to 1.6|
|||||ERBRE(0603)|0.7 to 0.9|2.0 to 2.2|
|||||ERBRG(1206)|2.0 to 2.4|4.4 to 5.0|
||||||||
||||||||



## **Recommended Soldering Conditions** 

## Recommendations and precautions are described below. 

- Recommended soldering conditions for reflow 

- · Reflow soldering shall be performed a maximum of two times. 

|●Recommended soldering conditions for reflow<br>· Reflow soldering shall be performed a maximum of<br>two times.||||
|---|---|---|---|
|Preheating<br>Peak<br>Heating<br>Temperature<br>Time<br>· Please contact us for additional information when<br>used in conditions other than those specified.<br>· Please measure the temperature of the terminals<br>and study every kind of solder and printed circuit<br>board for solderability be fore ac tu al use.|For soldering (Example : Sn/Pb)|||
|||Temperature|Time|
||Preheating|140 °C to 160 °C|60 s to 120 s|
||Main heating|Above 200 °C|30 s to 40 s|
||Peak|235 ± 5 °C|max. 10 s|
||For lead-free soldering (Example :||Sn/Ag/Cu)|
|||Temperature|Time|
||Preheating|150 °C to 180 °C|60 s to 120 s|
||Main heating|Above 230 °C|30 s to 40 s|
||Peak|max. 260 °C|max. 10 s|
|||||



- Recommended soldering conditions for fl ow 

||For soldering|For soldering|For lead-free soldering|For lead-free soldering|
|---|---|---|---|---|
||Temperature|Time|Temperature|Time|
|Preheating|140 °C to 180 °C|60 s to 120 s|150 °C to 180 °C|60 s to 120 s|
|Soldering|245 ± 5 °C|20 s to 30 s|max. 260 °C|max. 10 s|



<Repair with hand soldering> 

- Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. 

- Never touch this product with the tip of a soldering iron. 

## Safety Precautions 

The following are precautions for individual products. Please also refer to the common precautions for fuses in this catalog. 

1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 

2. Do not continuously pass a current exceeding the rated current through the fuses. 

3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. Calculate the I[2] t value of the pulse and check the tolerance to the number of pulses according to the I[2] t-t characteristic curve before deciding to use the fuses. Before checking the tolerance, consult our sales staff in advance. 

4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. In addition, ensure that the abnormal cur rent of your product does not exceed the maximum interrupting current of the fuses. 

5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary side. 

6. Ensure that the voltage applied to the fuses are within their rated voltage. 

7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses on your products and carefully check and evaluate their category temperature range. 

Design and specifications are each subject to change without notice.  Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

05 Sep. 2016 

**==> picture [491 x 37] intentionally omitted <==**

## Safety Precautions (Common precautions for Fuses) 

- When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. 

- Do not use the products beyond the specifications described in this catalog. 

- This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate its operations when installed in your products. 

- Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other significant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. 

- ✽ Systems equipped with a protection circuit and a protection device 

- ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault 

## (1) Precautions for use 

- These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) 

- These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 

2. In direct sunlight, outdoors, or in severe dust condition 

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 

4. Electric Static Discharge (ESD) Environment 

   - These components are sensitive to static electricity and can be damaged under static shock (ESD). 

   - Please take measures to avoid any of these environments. 

   - Smaller components are more sensitive to ESD environment. 

5. Electromagnetic Environment 

   - Avoid any environment where strong electromagnetic waves exist. 

6. In an environment where these products cause dew condensation 

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials 

- These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components (except Thermal Cutoffs). 

- Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). 

- Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. 

- Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. 

## (2) Precautions for storage 

The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. 

The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. 

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 

2. In direct sunlight 

<Package markings> 

Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 

00 May. 2015