# Special Function IC, EMI Filters with Integrated ESD Protection, 208 MHz clock, Flip Chip-15

![Product image](https://novapart.co/image/farnell:2462670/)

**URL**: https://novapart.co/products/EMIF06-USD04F3/special-function-ic-emi-filters-with-integrated
**SKU**: EMIF06-USD04F3
**Manufacturer**: STMICROELECTRONICS
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.0790
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 15Pins |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| Filter Case Style | Flip-Chip |
| No. Of Data Lines | 6 Data Lines |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2462670/)

## **EMIF06-USD04F3** 

## 6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection 

− **Datasheet production data** 

## **Description** 

The EMIF06-USD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies. 

**==> picture [49 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Flip Chip<br>(15 bumps)<br>**----- End of picture text -----**<br>


## **Features** 

- EMI low-pass filter 

- ESD protection ±8 kV (IEC 61000-4-2) 

## **Figure 1. Pin configuration (bump side)** 

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4 3 2 1<br>A<br>OOOO<br>B<br>OOOO<br>C<br>OO _O<br>D<br>**----- End of picture text -----**<br>


- Integrated pull up resistors to prevent bus floating when no card is connected 

- 208 MHz clock frequency compatible with SDR104 mode (SD3.0) 

- Lead-free package 

## **Benefits** 

- Low power consumption 

- Easy layout thanks to smart pin-out configuration 

- Very low PCB space consumption 

- High reliability offered by monolithic integration 

- Reduction of parasitic elements thanks to CSP integration 

## **Complies with the following standards:** 

- IEC 61000-4-2 level 4: 

   - ±15 kV (air discharge) 

   - ±8 kV (contact discharge) 

**TM** : IPAD is a trademark of STMicroelectronics 

January 2015 

DocID023184 Rev 4 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**EMIF06-USD04F3** 

## **1 Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VPP|ESD discharge IEC 61000-4-2, level 4<br>(on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3<br>Air discharge, external pins<br>Contact discharge, external pins<br>ESD discharge IEC 61000-4-2, level 1<br>(on pins dat0, dat1, clk, cmd,dat3, dat2)<br>Air discharge, internal pins<br>Contact discharge, internal pins|15<br>8<br>2<br>2|kV|
|Tj|Maximum junction temperature|125|°C|
|Top|Operating temperature range|- 30 to + 85|°C|
|Tstg|Storage temperature range|- 55 to + 150|°C|



## **Figure 2. EMIF06-USD04F3 Schematic** 

**Table 2. Pin configuration** 

|**Pin**|**Signal**|**Pin**|**Signal**|
|---|---|---|---|
|A1|dat0|C1|Cmd|
|A2|dat1|||
|A3|SDdat1|C3|GND|
|A4|SDdat0|C4|SDcmd|
|B1|clk|D1|dat3|
|B2|Vcc|D2|dat2|
|B3|GND|D3|SDdat2|
|B4|SDclk|D4|SDdat3|



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**EMIF06-USD04F3** 

**Characteristics** 

**Table 3. Electrical characteristics (values, Tamb = 25 °C)** 

|**Table 3. Electrical characteristics (values, Tamb = 25 °C)(values, Tamb = 25 °C)values, Tamb = 25 °C)amb = 25 °C)= 25 °C))**||
|---|---|
|**Symbol**<br>**Parameter**<br>**Test conditions**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~a~~||
|VBR<br>Breakdown voltage<br>IR= 1 mA<br>14<br>20<br>V<br>~~a~~||
|IRM<br>Leakage current at VRM<br>VRM= 3 V<br>100<br>nA<br>~~a~~||
|R1, R2, R3,<br>R4, R5, R6<br>Serial resistance<br>Tolerance ±10%, matching ±2%<br>40<br>Ω<br>~~aa~~||
|R9, R10, R11,<br>R12<br>Pull-up resistance<br>Tolerance ±10%, matching ±2%<br>50<br>kΩ<br>R13<br>Pull-up resistance on cmd<br>Tolerance ±10%<br>15<br>kΩ<br>Cline<br>Data line capacitance<br>V = 0 V, F = 10 MHz, VOSC= 30 mV<br>10<br>12<br>pF<br>V = 1.8 V, F = 10 MHz, VOSC= 30 mV<br>7.5<br>10<br>V = 2.9 V, F = 10 MHz, VOSC= 30 mV<br>9<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~<br>~~GG~~<br>~~ee~~<br>~~ee~~<br>~~a =—=_=-)~~<br>~~ee~~||
|**Figure 3. Electrical characteristics(definitions)**||
|I||
|Symbol<br>Parameter||
|V<br>=<br>Breakdown voltage<br>BR||
|V<br>=<br>Stand-off voltage<br>RM<br>I<br>=<br>Leakage current at V<br>RM<br>RM<br>V<br>VCLVBR<br>VRM<br>IRM||
|=<br>Line capacitance<br>Cline<br>IPP||



## **Figure 4. Attenuation versus frequency** 

**Figure 5. Analog crosstalk versus frequency** 

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S21(dB) XTalk(dB)<br>0 0<br>-10<br>-5 -20<br>-30<br>-10<br>-40<br>-50<br>-15<br>-60<br>-70<br>-20<br>-80<br>-90<br>-25<br>-100<br>F(Hz)<br>-30 -110<br>F(Hz)<br>100 K 1M 10M 100M 1G -120<br>Clk Data0 100 K 1M 10M 100M 1G<br>Data1 Data2<br>Data3 Cmd2 Clk-Data0 Data3-SDData0<br>**----- End of picture text -----**<br>


DocID023184 Rev 4 3/8 ~~oe~~ 

**Characteristics** 

**EMIF06-USD04F3** 

**==> picture [426 x 23] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 6. ESD response to IEC 61000-4-2  Figure 7. ESD response to IEC 61000-4-2<br>(+8 kV contact discharge) (-8 kV contact discharge)<br>**----- End of picture text -----**<br>


**Figure 8. Line capacitance versus frequency and bias voltage (typical values)** 

**==> picture [279 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
Cline (pF)<br>12<br>11 VBIAS = 0V<br>10<br>9 See eT<br>8 esa ee VBIAS = 1.8V ae.—iNSSN<br>7 we SN<br>6 teeeeeee<br>5 VBIAS = 2.9V<br>4<br>3<br>2 Vosc= 30 mVRMS<br>1 TAMB= 25 °C F(MHz)<br>0<br>1 10 100<br>**----- End of picture text -----**<br>


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**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark. 

## **Figure 9. Package dimensions** 

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400 µm ± 40<br>500 µm ± 50<br>255 µm ± 40<br>170 µm ± 10<br>1.54 mm ± 40 µm<br>170 µm ± 10<br>400 µm ± 40<br>1.54 mm ± 40 µm<br>**----- End of picture text -----**<br>


**Figure 10. Footprint** 

## **Figure 11. Marking** 

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Dot, ST logo<br>Copper pad Diameter: ECOPACK status<br>220 µm recommended<br>260 µm maximum xx = marking<br>z = manufacturing<br>Solder mask opening: location<br>300 µm minimum yww = datecode x x z<br>y = year,<br>Solder stencil opening: ww = week<br>220 µm recommended y w w<br>**----- End of picture text -----**<br>


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**EMIF06-USD04F3** 

**Package information** 

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Figure 12. Tape and reel specification<br>Dot identifying Pin A1 location Ø 1.55 ±0.05<br>2.0 ±0.05 4.0 ±0.1<br>0.20 ±0.02<br>0.59 ±0.05 1.65 ±0.05 4.0 ±0.1<br>All dimensionsare in mm<br>User direction of unreeling<br>yww xxz STE yww xxz STE yww xxz STE<br>1.75 ±0.1<br>1.65 ±0.05<br>8.0 +0.3/-0.1 3.5 ±0.05<br>**----- End of picture text -----**<br>


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**Ordering information** 

## **3 Ordering information** 

## **Figure 13. Ordering information scheme** 

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EMIF   06 - USD  04  F3<br>EMI filter<br>Number of lines<br>Application<br>USD = Micro SD card<br>Version<br>04 = Design version<br>Package<br>F = Flip chip<br>3= Lead-free, pitch = 400 µm, bump = 255 µm<br>**----- End of picture text -----**<br>


**Table 4. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF06-USD04F3|JZ|Flip Chip|2.6 mg|5000|Tape and reel 7”|



_Note:_ 

_More information is available in the STmicroelectronics Application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements”_ 

_AN4541: “EMI Filters for SD3.0 card: High speed SD card protection and filtering devices”_ 

## **4** 

## **Revision history** 

**Table 5. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-May-2012|1|First issue.|
|27-Jun-2012|2|Added tolerances in_Figure 12_.|
|30-Jun-2014|3|Updated_Figure 4_,_Figure 5_and breakdown voltage value in_Table 3_.|
|06-Jan-2015|4|Added mention for new AN4541.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2015 STMicroelectronics – All rights reserved 

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- [Supplier page](https://es.farnell.com/en-ES/stmicroelectronics/emif06-usd04f3/emi-filter-flip-chip-15/dp/2462670)
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