# Special Function IC, EMI Filters with Integrated ESD Protection, 208 MHz clock, Flip Chip-16
**URL**: https://novapart.co/products/EMIF06-MSD04F3/special-function-ic-emi-filters-with-integrated
**SKU**: EMIF06-MSD04F3
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.2120
**Stock**: 10+
**Lead Time**: 106 days (indicative)
## Description
EMI Filter Type:EMI Filter with ESD Protection; No. of Data Lines:6 Data Lines; Filter Circuit:RC Pi Filter; Filter Case Style:Flip-Chip; No. of Pins:16Pins; Product Range:-; SVHC:No SVHC (17-De
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 16Pins |
| Product Range | EMIF Series |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| No. Of Data Lines | 6 Data Lines |
| Filter Case / Package | Flip-Chip |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2462669/)
**EMIF06-MSD04F3**
**==> picture [61 x 39] intentionally omitted <==**
## 6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection
## **Features**
- EMI low-pass filter
- Integrated pull up resistors to prevent bus floating when no card is connected
- 208 MHz clock frequency compatible with SDR104 mode (SD3.0)
- Lead-free package
## **Benefits**
- Low power consumption
- Easy layout thanks to smart pin-out configuration
- Very low PCB space consumption
- High reliability offered by monolithic integration
- Reduction of parasitic elements thanks to CSP integration
## **Complies with the following standards:**
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Flip Chip
(16 bumps)
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## **Figure 1. Pin configuration (bump side)**
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4 3 2 1
A
B
C
D
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- IEC 61000-4-2 level 4:
- 15 kV (air discharge)
-
- 8 kV (contact discharge)
## **Application**
Micro (T-Flash) secure digital memory card in:
- Mobile phones
- Communication systems
## **Description**
The EMIF06-MSD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies.
**TM** : IPAD is a trademark of STMicroelectronics
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Doc ID 018849 Rev 1
_www.st.com_
**Characteristics**
**EMIF06-MSD04F3**
## **1 Characteristics**
## **Table 1. Absolute ratings (limiting values)**
|**Table 1.**|**Absolute ratings (limiting values)**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VPP|ESD discharge IEC 61000-4-2, level 4
Air discharge, card side
Contact discharge, card side
Air discharge, IC side
Contact discharge, IC side|15
8
2
2|kV|
|Tj|Maximum junction temperature|125|°C|
|Top|Operating temperature range|- 40 to + 85|°C|
|Tstg|Storage temperature range|- 55 to + 150|°C|
## **Figure 2. EMIF06-MSD04F3 configuration**
**==> picture [370 x 168] intentionally omitted <==**
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Vcc
Clk R1 SDClk
CMD R2 SDCMD
Dat0 R3 SDDat0
Host Dat1 R4 SDDat1 Card
side Dat2 R5 SDDat2 side
Dat3/CD R6 SDDat3/CD
R7 R9 R11
R8 R10
**----- End of picture text -----**
**Vss**
## **Table 2. Pin configuration**
|**Table 2.**|**Pin configuration**|||
|---|---|---|---|
|**Pin**|**Signal**|**Pin**|**Signal**|
|A1|Dat0|C1|CMD|
|A2|Dat1|C2|Vss|
|A3|SDDat1|C3|Vss|
|A4|SDDda0|C4|SDCMD|
|B1|Clk|D1|Dat3/CD|
|B2|Vcc|D2|Dat2|
|B3|Vss|D3|SDDat2|
|B4|SDClk|D4|SDDat3/CD|
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**EMIF06-MSD04F3**
**Characteristics**
**Table 3. Electrical characteristic**
|**Symbol**|**Parameter**|**Test conditions**|**Min.**
**Typ.**
**Max.**
**Unit**|
|---|---|---|---|
|VBR|Breakdown voltage|IR= 1 mA|14
16
V|
|IRM|Leakage current at VRM|VRM= 3 V|0.1
µA|
|R1, R2, R3,
R4, R5, R6|Serial resistance|Tolerance ±10 %, matching ±2 %|36
40
44
Ω|
|R7, R8, R9,
R10, R11|Pull-up resistance|Tolerance ±20 %, matching ±2 %|20
25
30
kΩ|
|Cline|Data line capacitance|V = 1.8 V, F = 10 MHz, VOSC= 30 mV|7.5
10
pF
9|
|||V = 2.9 V, F = 10 MHz, VOSC= 30 mV||
|F0|Cut-off frequency|S21 = -3 dB|550
MHz|
|tR,tF|Rise and fall time|Cload= 10 pF, low-ref = 0.58 V,
high-ref = 1.27 V|0.98
ns|
## **Figure 3. S21 attenuation measurements Figure 4. Analog crosstalk measurements**
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0 S21 (dB) 0 dB
-10
-5
-20
-30
-10
-40
-15 -50
-60
-20 -70
-80
-25
-90
F (Hz)
-100
-30 F (Hz)
100k 1M 10M 100M 1G -110
Clk Dat0 100k 1M 10M 100M 1G
Dat1 Dat2
Dat3 Cmd Clk-Dat0 Dat3-SDDat0
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**Characteristics**
**EMIF06-MSD04F3**
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**----- Start of picture text -----**
Figure 5. Line capacitance versus applied Figure 6. Line capacitance versus frequency
voltage (typical values) (typical values)
12 Cline (pF) 8 Cline (pF)
1011 tf~/ ft}ttttt yp|]tf}ft ftttft F=10 MHzVTAMBOSC=25 °C=30 mVRMS 7 | VBIAS=1.8 V ——.
9 SL | 6
8 | eet P | VBIAS=2.9 V ———
5
7 | | | | | ee OT
6 | tt} yt} te tt tt ft ft 4 |
5 {| tt} yp tt te te tt ft tf
3
4 tf} ttt tt tt ft yt te
3 {tf} tty ty tt pp te 2
21 esteeee ee ee PRee VBIAS(V) 1 VTAMBOSC=25=30 mV °C RMS | F (MHz)
0 ttt E EE? |, tT tt 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 1 10 100 500
**----- End of picture text -----**
## **Figure 7. Digital crosstalk measurements**
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**EMIF06-MSD04F3**
**Characteristics**
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Figure 8. Host side response to IEC 61000-4-2 (+8 kV contact discharge) on card side
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## **Figure 9. Host side response to IEC 61000-4-2 (-8 kV contact discharge) on card side**
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**EMIF06-MSD04F3**
**Layout recommendations**
## **2 Layout recommendations**
## **Figure 10. Layout recommendations**
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Dat1
Vcc
Dat0
Vss
Dat1
Clk
Dat0
Vcc
Clk
NC
CMD
NC
Dat3/CD
Vss
Dat2
Input Output CMD
Dat3/CD
Top level
Dat2
Second level
Top View
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## **3 Ordering information scheme**
## **Figure 11. Ordering information scheme**
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EMIF 06 - MSD 04 F3
EMI filter
Number of lines
Application
MSD = micro SD card
Version
04 = 7.5 pF line capacitance
Package
F = Flip Chip
3= lead-free, pitch = 400 µm, bump = 255 µm
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**EMIF06-MSD04F3**
**Package information**
## **4 Package information**
- Epoxy meets UL94, V0
- Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark.
## **Figure 12. Package dimensions**
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400 µm ± 40
605 µm ± 55
255 µm ± 40
170 µm ± 10
1.54 mm ± 40 µm
170 µm ± 10
400 µm ± 40
1.54 mm ± 40 µm
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## **Figure 13. Footprint**
## **Figure 14. Marking**
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Dot, ST logo
Copper pad Diameter: ECOPACK status
220 µm recommended
260 µm maximum xx = marking
z = manufacturing
Solder mask opening: location
300 µm minimum yww = datecode x x z
y = year,
Solder stencil opening: ww = week
220 µm recommended y w w
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**Ordering information**
**EMIF06-MSD04F3**
## **Figure 15. Tape and reel specification**
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**----- Start of picture text -----**
Dot identifying Pin A1 location Ø 1.55
2.0 4.0
0.20
0.69 1.65 4.0
All dimensionsare typical values in mm
User direction of unreeling
yww xxz STE yww xxz STE yww xxz STE
1.75
1.65
3.5
8.0
**----- End of picture text -----**
## **5 Ordering information**
## **Table 4. Ordering information**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF06-MSD04F3|JW|Flip Chip|3.2 mg|5000|Tape and reel 7”|
_Note: More information is available in the application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements"_
## **6 Revision history**
## **Table 5. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|12-July-2011|1|First issue.|
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**EMIF06-MSD04F3**
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## Links
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- [Supplier page](https://es.farnell.com/stmicroelectronics/emif06-msd04f3/emi-filter-flip-chip-16/dp/2462669)
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