# EMI Filter, RC Pi Filter, 6-Channel, ESD Protection, µQFN-16
**URL**: https://novapart.co/products/EMIF06-MSD02N16/emi-filter-rc-pi-6-channel-esd-protection-qfn-16
**SKU**: EMIF06-MSD02N16
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.3750
**Stock**: 10+
**Lead Time**: 106 days (indicative)
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 16Pins |
| Product Range | - |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| No. Of Data Lines | 6 Data Lines |
| Filter Case / Package | µQFN |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:4384327/)
**EMIF06-MSD02N16**
Datasheet
## 6-line IPAD EMI filter and ESD protection in micro QFN package
## **Features**
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**==> picture [102 x 19] intentionally omitted <==**
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1
Micro QFN 16L 3.5 mm x 1.2 mm
(bottom view)
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- High design flexibility
- Lead free package
- Very low PCB space consuming: 3.5 mm x 1.2 mm
- Very thin package: 0.55 mm max.
- High efficiency in ESD suppression
- Complies with the following standards:
**==> picture [140 x 104] intentionally omitted <==**
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Vcc
DAT3 pull- up
WP/CD
DAT2_In R1 DAT2_Ex
DAT3_In R2 DAT3_Ex
CMD_In R3 CMD_Ex
CLK_In R4 CLK_Ex
DAT0_In R5 DAT0_Ex
DAT1_In R6 DAT1_Ex
GND GND
DAT3 pull- down
R12
R7 R8 R9 R10 R11
R13
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- IEC 61000-4-2 level 4 on external pins
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and μQFN packaging
## **Applications**
Where EMI filtering in ESD sensitive equipment is required:
- Portable devices
- Navigation systems
- Digital still cameras
- Industrial and medical devices
## **Description**
**Product status** EMIF06-MSD02N16 **Product label**
The EMIF06-MSD02N16 is a 6-line, highly integrated product designed to suppress EMI/RFI noise and protect against ESD all the devices implementing a SD card or a T-Flash card.
The EMIF06-MSD02N16 allows designers to choose either mechanical card detection of electrical card detection without any additional components.
By integrating 20 discrete components in a single DFN package of 4 mm², the EMIF06-MSD02N16 provides a robust and immune space-saving solution to interface the connector and the controller of the SD cad slot.
**DS5979** - **Rev 7** - **February 2022** For further information contact your local STMicroelectronics sales office.
www.st.com
**EMIF06-MSD02N16 Characteristics**
## **1**
## **Characteristics**
**Figure 1. Pin configuration**
**Table 1. Absolute maximum ratings (Tamb = 25 °C)**
|**Symbol**
~~a~~|**Parameter**
~~a~~|**Value**
~~a~~
~~ee~~|**Unit**
~~a~~|
|---|---|---|---|
|VPP|ESD IEC 61000-4-2
Contact discharge:
•
on DATx_In, CMD_In and CLK_In pins
•
On all other pins
Air discharge:
•
on DATx_In, CMD_In and CLK_In pins
•
On all other pins|±2
±8
±12
±15
~~ee~~|kV|
|Tj|Maximum junction temperature|125|°C|
|Top|Operating temperature range|- 40 to + 85|°C|
|Tstg|Storage temperature range|- 55 to + 150|°C|
**DS5979** - **Rev 7**
**page 2/14**
**EMIF06-MSD02N16 Characteristics**
**Figure 2. Electrical characteristics (definitions)**
**==> picture [437 x 195] intentionally omitted <==**
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I
IF
Symbol Parameter
VBR Breakdown voltage
IRM [Leakage current at VRM ]
VRM Stand-off voltage VBR VF
VCL Clamping voltage VCL VRM IRM V
Rd Dynamic resistance IR
IPP Peak pulse current
RI/O Series resistance between Input and Output
Cline Input capacitance per line
IPP
**----- End of picture text -----**
**Table 2. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|5||8|V|
|IRM|VRM= 3 V per line|||200|nA|
|R1, R2, R3, R4, R5, R6|Series resistors - tolerance ±20%|36|45|54|Ω|
|R7, R8, R9, R10, R11, R12|Pull-up resistors|80|90|100|kΩ|
|R13|Pull-down resistor - tolerance ±20%|375|470|565|kΩ|
|Cline|VLINE= 0 V dc, VOSC= 30 mV, F = 1 MHz|||20|pF|
**DS5979** - **Rev 7**
**page 3/14**
**EMIF06-MSD02N16 Characteristics (curves)**
## **1.1 Characteristics (curves)**
**Figure 3. S21 attenuation measurement**
**==> picture [174 x 155] intentionally omitted <==**
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dB
0.00 ai eae ae an
-10.00 THM TIN
|
-20.00 N
-30.00 MUTA TIT
-40.00
F (Hz)
-50.00
100.0k 1.0M 10.0M 100.0M 1.0G
DAT0 DAT1
DAT2 DAT3
CLK CMD
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**Figure 4. Analog cross talk measurements**
**==> picture [198 x 149] intentionally omitted <==**
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0.00
-10.00
-20.00 To O_o oon
PLAIN FETT ETI CCT CTT
-30.00 00
-40.00
-50.00 CCaCT Co ee
-60.00
-70.00
-80.00 P HenIE CISCCCOCTa
-90.00 EAI CA
-100.00 “NON PRYPieTIESAL e
-110.00 ae We
-120.00 F (Hz)
-130.00-140.00 CCCn Con EC
100.0k 1.0M 10.0M 100.0M 1.0G
DAT2 -DAT3 DAT2 -DAT1
**----- End of picture text -----**
**Figure 5. ESD response to IEC 61000-4-2 (+12 kV air discharge) on one input (Vin) and on one output (Vout)**
**Figure 6. ESD response to IEC 61000-4-2 (- 12 kV air discharge) on one input (Vin) and on one output (Vout)**
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55V Max
(ee
Nat IN |
e a
39V Max
OUT
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IN
-41V Max
OUT
-34V Max
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**Figure 7. Line capacitance versus reverse voltage applied on DATx and CMD line**
**==> picture [224 x 129] intentionally omitted <==**
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CLINE (pF)
16141210864 Mmeeaeeeses |eeeee
2 VLINE(V)
0 a PE Pf
0.0 1.0 2.0 3.0 4.0 5.0
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**DS5979** - **Rev 7**
**page 4/14**
**EMIF06-MSD02N16 Application information**
## **2 Application information**
The EMIF06-mSD02N16 is a dedicated interface device for micro SD card/T-Flash card. The device provides:
- ESD protection
- EMI filterering
- Pull-up resistors
- Card detection circuit
## **2.1 ESD protection**
Each pin is connected to a TVS diode able to withstand 12 kV on all pins except on DATx_In, CMD_In and CLK_In.
## **2.2**
## **EMI filtering**
DATx, CMD and CLK lines are immunized against EMI radiations thanks to pi-filters. To avoid any degradation of the signal integrity at high frequency, the total line capacitance stays lower than 20 pF making the device compatible with a clock frequency up to 52 MHz.
## **2.3**
## **Pull-up resistors**
As recommended by the SD Specifications (Part 1 Physical Layer Version 2.00), all the data lines DATx and the CMD line must be pulled-up with resistors of 10 to 100 kΩ to avoid bus floating not only in SD 4-bit mode but also in SD 1-bit and SPI mode.
For the EMIF06-MSD02N16 device the pull-up resistor value has been fixed at 90 kΩ. This value makes the EMIF06-MSD02N16 compatible with most of the level shifters that may be used in the circuit including auto direction-sensing translators known to exhibit a weak current output.
## **2.4 Card detection circuit**
The EMIF06-mSD02N16 provides the flexibility to use either mechanical card detection with a dedicated pin connected to the memory card slot or the electrical card detection using the internal pull-up resistor of DAT3 of the micro SD card/T-Flash card.
In case of mechanical card detection, the user must add a pull-up on the circuit connected to the CD (Card Detect) of the micro-SD/T-Flash slot as shown in Figure 8.
## **Figure 8. Mechanical card detection**
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VDD
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Pull-up
resistor
Host GND
controller WP/CD
7 GND PT |
Contact when
insertingthecard
aD
SD card
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**DS5979** - **Rev 7**
**page 5/14**
**EMIF06-MSD02N16 Card detection circuit**
A pull-up of 90 kΩ is embedded into the EMIF06-MSD02N16. The routing corresponding to the mechanical card detection configuration is shown in Figure 9.
**Figure 9. Circuit routing for mechanical card detection**
**==> picture [378 x 128] intentionally omitted <==**
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Card detect pin Card detect host input Card detect host input Card detect pin
NC NC
Pin 1–DAT2 DAT2– Pin 1
Pin 2–CD/DAT3 CD/DAT3–Pin 2
Pin 3–CMD CMD– Pin 3
Pin 4–VCC VCC – Pin 4
Pin 5–CLK CLK – Pin 5
missy Pin 6–GND — Cs | Ss a GND– Pin 6 icro
| Pin 7–DAT0 —E = — = my= DAT0– Pin 7 | mises |
Pin 8–DAT1 DAT1–Pin 8
Top le vel Top level
za —_ DAT3 pul l-up a — DAT3 pul l-up
Card detect pul l-up Card detect pull-up
Bottom view Top view
R HO
ST
ROLLE
CONT CONT
ST
ROLL
HO ER
**----- End of picture text -----**
In case of electrical card detection, the user must add a pull-down on the circuit connected to the CD/DAT3 pin of the micro-SD/T-Flash pin as shown in Figure 10.
**Figure 10. Electrical card detection**
**==> picture [144 x 136] intentionally omitted <==**
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Host
contr oller
DAT3 (CD)
Pull-down
resistor
_ GND g8seeeeage12345678 50 kΩ VDD
0
sz
SD card
**----- End of picture text -----**
A pull-down of 470k is embedded into the EMIF06-mSD02N16. The routing corresponding to the electrical card detection configuration is shown in Figure 11.
**Figure 11. Circuit routing for electrical card detection**
**==> picture [317 x 110] intentionally omitted <==**
**----- Start of picture text -----**
NC e ts a f NC
Pin 1–Pin 1– DAT2 DAT2 –Pin 1– Pin 1
Pin 2Pin 2 –CD/DAT3 el— dl ba P| a CD/DAT3 –Pin 2– Pin 2
Pin 3–Pin 3– CMD CMD –Pin 3–Pin 3
Pin 4–Pin 4– VCC — -— 5 : = VCC –Pin 4– Pin 4 ‘cro
Pin 5–Pin 5– CLK CLK –Pin 5– Pin 5
Pin 6 –Pin 6– GND GND –Pin 6– Pin 6
Pin 7Pin 7 –DAT0 DAT0 –Pin 7– Pin 7
Pin 8–Pin 8– DAT1 DAT1 –Pin 8– Pin 8
Top le vel Top level
W177 __ DAT3 pul l- l down 7 __ DAT3 pul l-down
Bottom view Top vie w
R HO
ST
ROLLE
CONT CONT
ST
HO ROLLER
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**DS5979** - **Rev 7**
**page 6/14**
**EMIF06-MSD02N16 Package information**
## **3 Package information**
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
## **3.1 Micro QFN 3.5x1.2-16L package information**
- Epoxy meets UL94, V0
## **Figure 12. Micro QFN 3.5x1.2-16L package outline**
**==> picture [361 x 300] intentionally omitted <==**
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A
E
Pin 1 1
Index area
D A1
M
E2
D2
L
k
1 L1
b b1
e
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**DS5979** - **Rev 7**
**page 7/14**
**EMIF06-MSD02N16 Micro QFN 3.5x1.2-16L package information**
**Table 3. Micro QFN 3.5x1.2-16L package mechanical data**
||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.45|0.50|0.55|0.018|0.020|0.022|
|A1|0.00||0.05|0.000||0.002|
|b|0.15|0.20|0.25|0.006|0.008|0.010|
|b1|0.25|0.30|0.35|0.010|0.012|0.014|
|D|3.45|3.50|3.55|0.136|0.138|0.140|
|D2|2.70|2.80|2.90|0.106|0.110|0.114|
|E|1.15|1.20|1.25|0.045|0.047|0.049|
|E2|0.20|0.30|0.40|0.008|0.012|0.016|
|e||0.40|||0.016||
|k||0.20|||0.008||
|L|0.20|0.25|0.30|0.008|0.010|0.012|
|L1||0.15|||0.006||
|M||0.20|||0.008||
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Figure 14. Marking
Figure 13. Micro QFN 3.5x1.2-16L footprint (dimensions in
mm)
Dot : Pin 1 Identification
3.00 XX = Marking (see Table4)
WW = Data code (week)
Y = Data code (year)
P = Assembly plant
XX
1.6 0.70 2.30 0.30 WW
0.45
YP
0.40
0.20
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**DS5979** - **Rev 7**
**page 8/14**
**EMIF06-MSD02N16 Micro QFN 3.5x1.2-16L package information**
**Figure 15. Tape and reel outline**
**==> picture [426 x 238] intentionally omitted <==**
**----- Start of picture text -----**
Dot identifying Pin A1 location
Ø 1.55 ± 0.05
2.00 ± 0.1 4.00 ± 0.1
N6 N6 N6 N6 N6 N6
0.80 ± 0.1 1.70 ± 0.1 4.00 ± 0.1
All dimensions in mm User direction of unreeling
1.75 ± 0.1
5.5 ± 0.1
12.00 ± 0.3
3.70 ± 0.1
**----- End of picture text -----**
In no case should the product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
**DS5979** - **Rev 7**
**page 9/14**
**EMIF06-MSD02N16 Recommendation on PCB assembly**
## **4 Recommendation on PCB assembly**
## **4.1 Stencil opening design**
1. General recommendation on stencil opening design
- a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
- a. Stencil thickness (T) = 75 ~ 125 μm
- W
- b. Aspect ratio = T[≥1.5]
- L × W
- c. Aspect area = 2T L + W ≥0.66
3. Reference design
- a. Stencil opening thickness: 100 μm
- b. Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
- c. Stencil opening for leads: Opening to footprint ratio is 90%
## **Figure 16. Stencil opening dimensions**
**==> picture [299 x 327] intentionally omitted <==**
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L
T
W
Figure 17. Recommended stencil window position
5µm 5µm
15 µm
3.00
190 µm
15 µm
1.6 0.70 0.30
200 µm 2.30
0.45
2800 µm
50 µm 0.40 0.20
300 µm
2100 µm Footprint
50 µm Stencil window
350 µm 350 µm Footprint
450 µm 420 µm
200 µm
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**DS5979** - **Rev 7**
**page 10/14**
**EMIF06-MSD02N16 Solder paste**
## **4.2 Solder paste**
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
## **4.3**
## **Placement**
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
## **4.4 PCB design preference**
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
## **4.5 Reflow profile**
## **Figure 18. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting**
**==> picture [289 x 163] intentionally omitted <==**
**----- Start of picture text -----**
240-245 °C
Temperature (°C)
250 -2 °C/s
2 - 3 °C/s
200 60 sec
(90 max) -3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0 30 60 90 120 150 180 210 240 270 300
**----- End of picture text -----**
_Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._
**DS5979** - **Rev 7**
**page 11/14**
**EMIF06-MSD02N16 Ordering information**
## **5 Ordering information**
**Figure 19. Ordering information scheme**
EMIF 06 - MSD02 N16
EMI Filter Number of lines Information MSD = application 02 = version
Package N = narrow micro QFN 16 = 16 leads
**Table 4. Ordering information**
|**Part number**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF06-MSD02N16|N6|Micro QFN|6.17 mg|3000|Tape and reel (7”)|
**DS5979** - **Rev 7**
**page 12/14**
**EMIF06-MSD02N16**
## **Revision history**
**Table 5. Document revision history**
|**Date**|**Version**|**Changes**|
|---|---|---|
|21-Nov-2008|1|Initial release.|
|06-Sep-2019|2|UpdatedTable 3. Minor text changed.|
|11-May-2020|3|Updated product links and product label.|
|05-Nov-2020|4|UpdatedFigure 1.|
|20-Jan-2021|5|UpdatedTable 1.|
|27-Apr-2021|6|UpdatedTable 1.|
|01-Feb-2022|7|Updated Description,Figure 14andTable 4.|
**DS5979** - **Rev 7**
**page 13/14**
**EMIF06-MSD02N16**
## **IMPORTANT NOTICE – PLEASE READ CAREFULLY**
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved
**DS5979** - **Rev 7**
**page 14/14**
## Links
- [View this product on Novapart](https://novapart.co/products/EMIF06-MSD02N16/emi-filter-rc-pi-6-channel-esd-protection-qfn-16)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/emif06-msd02n16/filter-emi-rc-pi-uqfn-16/dp/4384327)
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