# Special Function IC, EMI Filters with Integrated ESD Protection, Flip Chip-11

![Product image](https://novapart.co/image/farnell:2462668/)

**URL**: https://novapart.co/products/EMIF05-SK01F3/special-function-ic-emi-filters-with-integrated
**SKU**: EMIF05-SK01F3
**Manufacturer**: STMICROELECTRONICS
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.0800
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 11Pins |
| Filter Circuit | C-R-C Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| Filter Case Style | Flip-Chip |
| No. Of Data Lines | 5 Data Lines |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2462668/)

## **EMIF05-SK01F3** 

## 5 line IPAD™, EMI filter including ESD protection 

− **Datasheet production data** 

## **Description** 

The EMIF05-SK01F3 chip is a highly integrated filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. 

**==> picture [84 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Flip Chip 11 bumps<br>**----- End of picture text -----**<br>


This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. 

## **Features** 

- EMI (I/O) low-pass filter 

- High efficiency in EMI/ESD protection 

- Very thin package 

- Lead-free package 

- High reliability offered by monolithic integration 

- High reduction of parasitic elements through integration and wafer level packaging 

**Figure 1. Pin configuration (bump view)** 

|**1**<br>**2**<br>**3**||
|---|---|
|I1<br>I2<br>O2<br>OOO|**A**|
|I3<br>O1<br>O<br>O|**B**|
|I4<br>GND<br>O3<br>OOO|**C**|
|I5<br>O5<br>O4<br>OOO|**D**|



## **Complies with the following standards:** 

- IEC 61000-4-2 level 4: 

   - ±15 kV (air discharge) 

   - ±8 kV (contact discharge) 

- IEC 61000-4-2 level 1: 

   - ±2 kV (air discharge) 

   - ±2 kV (contact discharge) 

## **Applications** 

Where EMI filtering in ESD sensitive equipment is required: 

- Mobile phones and communication systems 

- Computers, printers and MCU boards. 

**TM** : IPAD is a trademark of STMicroelectronics 

## **Figure 2. Functional schematic** 

**==> picture [187 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.7 k<br>INPUT OUTPUT<br>I1 to I5 O1 to O5<br>ESD level 4 1 nF<br>(8 kV contact)<br>C2 GND<br>**----- End of picture text -----**<br>


**Table 1. Pin name** 

|**INPUT**|**OUTPUT**|
|---|---|
|I1 (A1)|O1 (B3)|
|I2 (A2)|O2 (A3)|
|I3 (B1)|O3(C3)|
|I4 (C1)|O4 (D3)|
|I5 (D1)|O5 (D2)|



July 2014 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**EMIF05-SK01F3** 

## **1 Characteristics** 

**Table 2. Absolute maximum ratings (Tamb = 25 °C)** 

||**Table 2. Absolute maximum ratings (Tamb**|**= 25 °C)**||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VPP|External pins (A1, A2, B1, C1, D1):<br>ESD discharge IEC 61000-4-2, level 4<br>Air discharge<br>Contact discharge<br>Internal pins (A3, B3, C3, D3, D2):<br>ESD discharge IEC 61000-4-2(1), level 1<br>Air discharge<br>Contact discharge|15<br>8<br>2<br>2|kV|
|Top|Operating temperature range|- 40 to + 85|°C|
|Tstg|Storage temperature range|- 55 to 150||



1. Measurements done on IEC 61000-4-2 test bench.For further details see Application note AN3353, “IEC 61000-4-2 standard testing”. 

**Figure 3. Electrical characteristics (definitions)** 

**==> picture [337 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
Symbol       Parameter<br>VBR =        Breakdown voltage<br>I RM =        Leakage current at VRM<br>V RM =        Stand-off voltage<br>CX =        Line capacitance<br>RX = Series resistance between<br>input and ouptput<br>**----- End of picture text -----**<br>


**Table 3. Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|IRM|VRM= 3 V|||200|nA|
|VBR|IR= 1 mA|6||10|V|
|R1,R2, R3, R4, R5|Vline= 0 V, Vosc= 30 mV, F = 1 MHz|4.23|4.7|5.17|κΩ|
|C1, C2, C3, C4, C5|Vline= 0 V, Vosc= 30 mV, F = 1 MHz<br>(measured under zero light conditions)|0.8|1|1.2|nF|



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**Characteristics** 

## **Figure 4. Attenuation versus frequency** 

## **Figure 5. Analog crosstalk versus frequency** 

**==> picture [448 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
S21(dB)<br>0 XTalk (dB)<br>-5 Tl LOMLL 0<br>-10 CT Loo Lo -10<br>-15 Pr LOCCSCo nis -20 aPra UTTSTa |<br>-20 Cm ZA |  eal<br>CC Co a ine<br>-25-30 NLLA7 A -30-40 SEE ETT EET TIE | Pat pz aillea<br>-35 a<br>ET -50 PUTT UTIIII-A<br>-40<br>POSS nee iceman mannii<br>-45 -60<br>-50-55 HHH SSH“Beeb | | lel fe F (Hz) | -70 Incvi C<br>-60 a -80<br>100k 1M a 10M 100M 1G i -90 ATT<br>I1-O1 I2-O2 100k 1M 10M 100M 1G<br>I3-O3 I4-O4<br>I5-O5 I1-O2 I1-O5<br>**----- End of picture text -----**<br>


**Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge)** 

**Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge)** 

**==> picture [435 x 108] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0 V / Div 2.0 V / Div<br>1 11.87 V 4 -1.73 V<br>1 VCL: Peak clamping voltage<br>2 VCL :clamping voltage at 30 ns<br>3 VCL :clamping voltage at 60 ns<br>4 VCL :clamping voltage at 100 ns 1 VCL: Peak clamping voltage<br>2 3.61 V 3 3.16 V 3 -4.18 V 2 VCL :clamping voltage @ 30 ns<br>3 VCL :clamping voltage @ 60 ns<br>4 1.20  V 4 VCL :clamping voltage @ 100 ns<br>1 -10.88  V 2 -5.19 V<br>20 ns / Div 20 ns / Div<br>**----- End of picture text -----**<br>


**Figure 8. Line capacitance versus applied voltage** 

**==> picture [312 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 20. 0 C(pF)<br>1 00. 0<br>800<br>600<br>400<br>200<br>VBIAS (V)<br>0<br>0 1 2 3 4 5 6 7<br>**----- End of picture text -----**<br>


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**EMIF05-SK01F3** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark. 

**Figure 9. Package dimensions** 

**==> picture [348 x 180] intentionally omitted <==**

**----- Start of picture text -----**<br>
�� 255 ± 40 µm 500 µm ± 50<br>400 ± 30 µm<br>1180 ± 30 µm<br>175 µm<br>175 µm<br>400 ± 30 µm<br>1580 ± 30 µm<br>**----- End of picture text -----**<br>


**Figure 10. Footprint** 

**Figure 11. Marking** 

**==> picture [404 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
Copper pad Diameter:<br>220 µm recommended<br>260 µm maximum<br>Dot, ST logo<br>Solder mask opening:<br>300 µm minimum ECOPACK [® ] grade<br>KN<br>Solder stencil opening:<br>220 µm recommended<br>**----- End of picture text -----**<br>


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**Package information** 

**==> picture [404 x 239] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 12. Tape and reel specification<br>Dot identifying Pin A1 location 2.0± 0.05 4.0 ± 0.1 Ø 1.50 ± 0.10<br>0.20 ± 0.02<br>1.28 ± 0.05 4.0 ± 0.1<br>0.59± 0.05<br>All dimensions are typical values in mm User direction of unreeling<br>KN KN KN<br>1.75 ± 0.1<br>3.5 ±- 0.05<br>8.0 +0.3 -0.10<br>1.65 ± 0.05<br>**----- End of picture text -----**<br>


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**Ordering information** 

**EMIF05-SK01F3** 

## **3 Ordering information** 

**==> picture [404 x 230] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. Ordering information scheme<br>EMIF    05   -     SK      01   F3<br>EMI Filter<br>Number of lines<br>Application<br>2 letters = SK<br>Version<br>2 digits = 01<br>Package<br>F = Flip chip<br>x = 3: Lead-free pitch = 400 µm, bump = 255 µm<br>**----- End of picture text -----**<br>


**Table 4. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF05-SK01F3|KN|Flip Chip|2.0 mg|5000|Tape and reel 7”|



_Note: More information is available in the STMicroelectronics Application notes: AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements”_ 

## **4 Revision history** 

**Table 5. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|07-Jul-2014|1|First issue.|



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