# EMI Filter, ESD Protection, 14 V, 33 R, 20 pF, Flip-Chip-11
**URL**: https://novapart.co/products/EMIF02-USB03F2/emi-filter-esd-protection-14-v-33-r-20-pf-flip
**SKU**: EMIF02-USB03F2
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.1860
**Stock**: 10+
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (23-Jan-2024) |
| No. Of Pins | 12Pins |
| Product Range | EMIF Series |
| Filter Circuit | RC Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| No. Of Data Lines | 2 Data Lines |
| Filter Case / Package | Flip-Chip |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:4319998/)
## **EMIF02-USB03F2**
## 2-line IPAD™, EMI filter including ESD protection
**Datasheet** - **production data**
## **Description**
The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.
The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.
## **Figure 1. Pin layout (bump side)**
## **Features**
- 2-line, low-pass filter + 2-line ESD protection
- High efficiency in EMI filtering
- Lead-free package
- Very low PCB space occupation: < 2.80 mm[2]
- Very thin package: 0.65 mm
- High efficiency in ESD suppression (IEC 61000-4-2 level 4)
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
## **Complies with the following standards**
- IEC 61000-4-2 level 4 on external pins:
- 15 kV (air discharge)
- 8 kV (contact discharge)
- IEC 61000-4-2 level 1 on internal pins:
- 2 kV (air discharge)
- 2 kV (contact discharge)
|**3**
**2**
**1**||
|---|---|
|**ID**
**Dz**
roe|**A**|
|**Vbus**
**Pup**
**Pd1**
OOO|**B**|
|**D+**
**out**
**Pd2**
**D+**
**in**
OOO|**C**|
|**D-**
**out**
**GND**
**D-**
**in**
OOO|**D**|
## **Figure 2. Schematic**
**==> picture [208 x 121] intentionally omitted <==**
**----- Start of picture text -----**
Pup Dz ID Vbus
EMIF02-USB03F2
R3=1.3kΩ
D+OUT R2=33Ω D+IN
D-OUT R1=33Ω D-IN
R5=15kΩ R4=17kΩ
Pd2
Pd1
CLINE = 20 pF max.
**----- End of picture text -----**
## **Application**
ESD protection and EMI filtering for:
- USB OTG port
TM: IPAD is a trademark of STMicroelectronics.
September 2015
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This is information on a product in full production.
_www.st.com_
**Characteristics**
**EMIF02-USB03F2**
## **1 Characteristics**
## **Table 1. Absolute ratings (Tamb = 25 °C)**
|**Table 1.**|**Absolute ratings (Tamb = 25 °C)gs (Tamb = 25 °C)s (Tamb = 25 °C)(Tamb = 25 °C)Tamb = 25 °C)amb = 25 °C) = 25 °C))**|||
|---|---|---|---|
|**Symbol**|**Parameter and test conditions**|**Value**|**Unit**|
|VPP|**Internal pins (D3, C3, C2, B2, B1):**
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge
**External pins (D1, C1, A2, A3, B3):**
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge|2
2
15
8|kV|
|Tj|Maximum junction temperature|125|°C|
|Top|Operating temperature range|-40 to +85|°C|
|Tstg|Storage temperature range|-55 to 150|°C|
## **Figure 3. Electrical characteristics (definitions)**
**Table 2. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|14|||V|
|IRM|VRM= 3 V|||0.2|µA|
|CLINE|VLINE= 0 V, VOSC= 30 mV, F = 1 MHz,
measured in zero light condition|||20|pF|
|R1, R2|Tolerance ± 5%||33||Ω|
|R3|Tolerance ± 5%||1.30||kΩ|
|R4|Tolerance ± 5%||17||kΩ|
|R5|Tolerance ± 5%||15||kΩ|
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**Characteristics**
**==> picture [162 x 165] intentionally omitted <==**
**----- Start of picture text -----**
Figure 4. Filtering measurement
dB
0 HM MATOATeN
-10 |
-20 \
-30 Ce a
F (Hz)
-40 ve eri ng
100k 1M 10M 100M 1G
D+In D+Out D-In D-Out
**----- End of picture text -----**
**Figure 5. Analog crosstalk measurement**
**==> picture [169 x 139] intentionally omitted <==**
**----- Start of picture text -----**
dB
0
-10
-20
CTT.
-30 1RR
-40
-50 1 a CNT
-60
TC HPot
-70
-80
-90
I0peat a0
-100
-110
-120 F (Hz)
-130 +IA att eR
100k 1M 10M 100M 1G
D-In D+Out DZ ID
**----- End of picture text -----**
**Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input VIN and on one output VOUT**
**Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input VIN and on one output VOUT**
**==> picture [345 x 336] intentionally omitted <==**
**----- Start of picture text -----**
10.0 V / Div.
IN
, \~/ VCL = -47 V
100 ns / Div. 100 ns / Div.
10.0 V / Div.
OUT
VCL = -23 V
100 ns / Div. 100 ns / Div.
pacitance versus reverse voltage applied (typical values)acitance versus reverse voltage applied (typical values)ge applied (typical values)e applied (typical values)pplied (typical values)lied (typical values)(typical values)typical values)ypical values)ical values))
C(pF)
20 (| | | | | | | | tT tT TT tT Th Th Th rT hh
18 EEE EEE EE EE EEE EEE EEEE EES
16 ROE EEE EE EE EEE EEE EEEEE EES
NER
14
LT i[RmeET TTT Tt? tT tT tT tt PhP rrreeerh
12
a
10 aa a eee
8 EEEEEEEEEEE
6 FREER EE EE E EE EEEEE EE ERE E EEEE E
4 EREEEEEEEEEEEEEEEEEEEEES
2 (| | | | | | tf ft tf VLINE (V) a
0 PEREEEEEEEE SEREREEEH
0 1 2 3 4 5 6 7 8 9 10 11 12
**----- End of picture text -----**
**==> picture [208 x 100] intentionally omitted <==**
**----- Start of picture text -----**
20.0 V / Div.
VCL = 74 V
IN
a
100 ns / Div.
10.0 V / Div.
VCL = 27 V
OUT
100 ns / Div.
**----- End of picture text -----**
## **Figure 8. Junction capacitance versus reverse voltage applied (typical values)acitance versus reverse voltage applied (typical values)ge applied (typical values)e applied (typical values)pplied (typical values)lied (typical values)(typical values)typical values)ypical values)ical values))**
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**Application information**
## **2 Application information**
## **Figure 9. Application schematic**
**==> picture [244 x 134] intentionally omitted <==**
**----- Start of picture text -----**
Vbus Vbus
3.3V ID ID
Pup Dz ID Vbus
EMIF02-USB03F2
R3=1.3kΩ
D+ D+OUT R2=33Ω D+IN D+
D- D-OUT R1=33Ω D-IN D-
R5=15kΩ R4=17kΩ
GND GND
Pd2
Pd1
R1 = R2 = 33 Ω
Cline = 20 pF max.
USB OTG connector
USB OTG Xceiver
**----- End of picture text -----**
## **Figure 10. Aplac model**
**==> picture [284 x 245] intentionally omitted <==**
**----- Start of picture text -----**
C3 C1
Ls Rs Lbump Rbump Rbump Lbump Rs Ls
Port1 Port2
50 50
A3 A2 B3 B2 B1 C2 D2
MODEL = D02_usb03_gnd
MODEL = D02_usb03
bulk bulk bulk bulk bulk bulk bulk
B2 B1 C2 D2
R_1k3 R_17k
R_15k
C3 R_33R C1 D3 R_33R D1 Lbump
Rbump
MODEL = D02_usb03 MODEL = D02_usb03
Cgnd
Lgnd
bulk bulk bulk bulk
Cbump Rsubump Cbump Rsubump Rgnd
A2 bulk B1 bulk
Cbump Rsubump Cbump Rsubump
B2 bulk C1 bulk
Cbump Rsubump Cbump Rsubump
C2 bulk D3 bulk
Cbump Rsubump Cbump Rsubump
C3 bulk D1 bulk
Cbump Rsubump Cbump Rsubump
B3 bulk A3 bulk
**----- End of picture text -----**
## **Figure 11. Aplac parameters**
Ls 950pH Rs_usb03_gnd 0.9 Rs 150m Lgnd 50pH R_33R 33 Rgnd 100m R_1k3 1.3k Cgnd 0.15pF R_15k 15k Lbump 50pH R_17k 17k Rbump 20m Cz_usb03 11pF Cbump 2.4pF Rs_usb03 1 Rsubump 100m Cz_usb03_gnd 220pF
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**Package information**
## **3 Package information**
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark.
## **3.1 Flip-Chip package information**
## **Figure 12. Flip-Chip package outline**
**==> picture [352 x 258] intentionally omitted <==**
**----- Start of picture text -----**
650 µm ± 65
315 µm ± 50
500 µm
220 µm
1.44 mm ± 30 µm
500 µm
1.94 mm ± 30 µm
220 µm
**----- End of picture text -----**
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**Package information**
## **3.2 Packing information**
## **Figure 13. Flip-Chip tape and reel outline**
**==> picture [431 x 217] intentionally omitted <==**
**----- Start of picture text -----**
Dot identifying Pin A1 location
Ø 1.5 ± 0.1
i] ——.. 4 ± 0.1 |
I ! . |.
: ! | .
| : : |
2.04 i] I
1i
i i
1i
I i i
I i I
rot 1 1
+, I — l 0.73 ± 0.05 _ — ——. 1 4 ± 0.1 1
User direction of unreeling
All dimensions in mm "=e
yww xxz STE yww xxz STE yww xxz STE
1.75 ± 0.1
3.5 ± 0.1
8 ± 0.3
1.58
**----- End of picture text -----**
_Note: More information is available in the application notes:_
_AN1235:”Flip Chip: Package description and recommendations for use” AN1751: “EMI filters: Recommendations and measurements”_
**Figure 14. Footprint**
**Figure 15. Marking**
**==> picture [174 x 86] intentionally omitted <==**
**----- Start of picture text -----**
Dot, ST logo
xx = markingECOPACK status @ i
z = manufacturing location s/f
yww = datecode
(y = year
ww = week)
x x z
|_|[|[|[| y [|[| w w
**----- End of picture text -----**
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**Ordering information**
## **4 Ordering information**
**==> picture [191 x 11] intentionally omitted <==**
**----- Start of picture text -----**
Figure 16. Ordering information scheme
**----- End of picture text -----**
**==> picture [376 x 68] intentionally omitted <==**
**----- Start of picture text -----**
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
**----- End of picture text -----**
**Information** x = resistance value (ohm) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version
**Package** F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 315 µm
**Table 3. Ordering information**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF02-USB03F2|FU|Flip Chip|4 mg|5000|Tape and reel 7”|
## **5 Revision history**
**Table 4. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|14-Oct-2004|1|Initial release.|
|25-Oct-2004|2|_Figure 12_: Flip Chip marking dimensions updated.|
|27-Oct-2004|3|Minor layout update. No content change.|
|28-Apr-2008|4|Updated ECOPACK statement. Updated_Figure 12_,_Figure 13_,
_Figure 14_,_Figure 15_and_Figure 16_Reformatted to current standards.|
|08-Feb-2010|5|Updated the maximum value of IRMin_Table 2_. Updated_Figure 12_and
_Figure 13_for die dimension reductions.|
|15-Sep-2015|6|Updated_Figure 14_and reformatted to current standards.|
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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY**
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
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## Links
- [View this product on Novapart](https://novapart.co/products/EMIF02-USB03F2/emi-filter-esd-protection-14-v-33-r-20-pf-flip)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/emif02-usb03f2/emi-filter-esd-protection-flip/dp/4319998)
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