# EMI FILTER W/ESD PROTECTION, 2LINE

![Product image](https://novapart.co/image/farnell:3366957/)

**URL**: https://novapart.co/products/EMIF02-SPK03F2/emi-filter-w-esd-protection-2line
**SKU**: EMIF02-SPK03F2
**Manufacturer**: STMICROELECTRONICS
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.1720
**Stock**: 1000+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 5Pins |
| Product Range | EMIF Series |
| Filter Circuit | C-L-C Pi Filter |
| Emi Filter Type | EMI Filter with ESD Protection |
| No. Of Data Lines | 2 Data Lines |
| Filter Case / Package | WLCSP |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3366957/)

## **EMIF02-SPK03F2** 

## 2-channel EMI filter and ESD protection for speaker phone 

**Datasheet** − **production data** 

## **Features** 

- 2-channel EMI symmetrical (I/O) low-pass filter 

- High efficiency in EMI filtering: 

   - S21 attenuation, -40 dB at 900 MHz 

   - Xtalk, in audio band, -60 dB 

- Very low PCB space consumption: 0.89 x 1.26 mm 

- Very thin package: 0.6 mm after reflow 

- High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4) 

- High reliability offered by monolithic integration 

- High reduction of parasitic elements through integration and wafer level packaging 

- Packaged in lead-free Flip Chip 

## **Complies with the following standards** 

- IEC 61000-4-2 level 4: 

**==> picture [44 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Flip Chip<br>(5 bumps)<br>**----- End of picture text -----**<br>


## **Figure 1. Pin configuration (bump side)** 

**==> picture [81 x 97] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 2 1<br>O1 I1 A<br>GND B<br>O<br>O2 I2 C<br>eke<br>**----- End of picture text -----**<br>


- ±15 kV (air discharge) 

- ±8 kV (contact discharge) 

## **Application** 

- Mobile phones 

- Portable devices 

- Connectivity devices 

## **Description** 

The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. 

## **Figure 2. Functional schematic** 

**==> picture [144 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>I1 O1<br>C C<br>fT Ti<br>L<br>I2 O2<br>C C<br>HT<br>**----- End of picture text -----**<br>


The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. 

1/10 

June 2012 

Doc ID 023219 Rev 1 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**EMIF02-SPK03F2** 

## **1 Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VPP|ESD discharge IEC 61000-4-2(1)<br>Air discharge<br>Contact discharge|30|kV|
|ISPK|Maximum rms currrent per channel|800|mA|
|Tj|Maximum junction temperature|125|°C|
|Top|Operating temperature range|-30 to 85|°C|
|Tstg|Storage temperature range|-55 to + 150|°C|



1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353, “IEC 61000-4-2 standard testing”. 

## **Figure 3. Electrical characteristics - definitions** 

**==> picture [359 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Symbol Parameter IPP<br>VBR = Breakdown voltage Slope: 1/Rd<br>VCL = Clamping voltage<br>IRM = Leakage current @ VRM<br>VRM = Stand-off voltage VCL<br>IPP = Peak pulse current VCL<br>I = Breakdown current<br>R<br>Rd = Dynamic resistance<br>Slope: 1/Rd<br>IPP<br>**----- End of picture text -----**<br>


**Table 2. Electrical characteristics - values (Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|6|||V|
|Rd|tp = 100 ns||0.2||Ω|
|IRM|VRM= 3 V per line|||0.3|µA|
|RDC_L|DC resistance of the inductor||0.07|0.1|Ω|
|Cline|Vline = 0 V, VOSC= 30 mV, F = 1 MHz||250||pF|



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**Characteristics** 

## **Figure 4. Insertion losses versus frequency** 

**==> picture [461 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
EMIF02-SPK03F2<br>APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111<br>0<br>S21<br>-10<br>dB<br>-20<br>-30<br>-40<br>-50<br>-60<br>300k 1M 3M 10M 30M 100M 300M 1G 3G<br>F/Hz<br>I1-O1 I2-O2<br>**----- End of picture text -----**<br>


## **Figure 5. Analog crosstalk versus frequency** 

**==> picture [373 x 284] intentionally omitted <==**

**----- Start of picture text -----**<br>
EMIF02-SPK03F2<br>APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111<br>0<br>XTalk<br>-10<br>dB<br>-20<br>-30<br>-40<br>-50<br>-60<br>-70<br>300k 1M 3M 10M 30M 100M 300M 1G 3G<br>F/Hz<br>I1-O2<br>**----- End of picture text -----**<br>


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**Characteristics** 

**EMIF02-SPK03F2** 

**==> picture [197 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 6. Audio band analog crosstalk<br>**----- End of picture text -----**<br>


**Figure 7. Clamping voltage VCL versus peak pulse current IPP for short pulse duration such as ESD surges** 

**==> picture [30 x 12] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ipp (A)<br>**----- End of picture text -----**<br>


**==> picture [328 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
32 aGOOO OY OO (ON<br>30 p [| o a CO C/O<br>28 |a| Triangular pulse tP = 100 ns aa A e<br>26 [|[| Direct and reverse polarity aa sA PRA O CO<br>24 |sD TJ initial = 25 °C S(O a(OO I I S/N  (<br>22 (nla (SSSN EN 2 EEENSG (<br>20 popo<br>18 Po[TT<br>16 pp o o<br>14 aa OSO (SS (S/S N I ” A OG (<br>12 ORs (OO N (OO I AYYZ I II OSS(O(<br>108 (SAaRSSSSSSS A SSSS NS GSGS GSGY OO?ASA EEIOSOS (OSOOGSOOOO (<br>6 poe[eT<br>42 poaa [ SSSS SOGOGS GOGOZT08 GOES || V CL (V)<br>0 S ON N -/ASN(GO<br>0 2 4 6 8 10 12 14 16<br>**----- End of picture text -----**<br>


_Note: For further information on the dynamic characteristic see the STMicroelectronics’ application note AN4022, “TVS short pulse Rd measurement and correlation with TVS clamping voltage during ESD”._ 

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**Characteristics** 

## **Figure 8. ESD test conditions** 

**==> picture [127 x 40] intentionally omitted <==**

**----- Start of picture text -----**<br>
2 x -20 dB<br>50 Ω input<br>**----- End of picture text -----**<br>


## **Figure 9. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) Ix to Ox** 

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**Characteristics** 

**EMIF02-SPK03F2** 

## **Figure 10. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) Ix to Ox** 

## **Figure 11. Total harmonic distortion plus noise** 

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**EMIF02-SPK03F2** 

**Ordering information scheme** 

## **2 Ordering information scheme** 

## **Figure 12. Ordering information scheme** 

**==> picture [290 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
EMIF    yy    -    xxx  zz    Fx<br>EMI Filter<br>Number of lines<br>Information<br>x = resistance value (Ohms)<br>z = capacitance value / 10(pF)<br>or<br>3 letters = application<br>2 digits = version<br>Package<br>F = Flip Chip<br>x = 2: lead-free, pitch = 500 µm, bump = 255 µm<br>**----- End of picture text -----**<br>


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**Package information** 

## **3 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

**Figure 13. Package dimensions** 

**==> picture [254 x 163] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 µm ±10<br>315 µm ±50 650 µm ±65<br>250 µm ±10<br>0.89 mm ±50 µm<br>500 µm ±15<br>435 µm 1.26 mm ±50 µm<br>**----- End of picture text -----**<br>


## **Figure 14. Footprint** 

## **Figure 15. Marking** 

**==> picture [406 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dot, ST logo<br>ECOPACK status<br>xx = marking<br>z = manufacturing location<br>250 µm recommended, 300 µm max.Copper pad  Diameter: yww = datecode(y = year<br>ww = week)<br>Solder stencil opening:<br>330 µm recommended x x z<br>340 µm min. for 315 µm copper pad diameterSolder mask opening recommendation: y w w<br>**----- End of picture text -----**<br>


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**Ordering information** 

## **Figure 16. Tape and reel specification** 

**==> picture [370 x 207] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.22<br>ST ST ST<br>yww xxz yww xxz yww xxz<br>1.02 4.0<br>0.73± 0.05<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>1.39<br>3.5<br>8.0<br>**----- End of picture text -----**<br>


_Note: More information is available in the application notes:_ 

_AN1235,”IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751, “EMI filters: recommendations and measurements”_ 

## **4 Ordering information** 

**Table 3. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|EMIF02-SPK03F2|JX|Flip Chip|1.8 mg|5000|Tape and reel 7”|



## **5** 

## **Revision history** 

**Table 4. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|19-Jun-2012|1|Initial release.|



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**EMIF02-SPK03F2** 

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