EE-SX3239-P2

## **Photomicrosensor** 

## **EE-SX3239-P2/-SX4239-P2** 

## **(Transmissive)** 

## **Dimensions** 

## **Features** 

**Note:** All units are in millimeters unless otherwise indicated. 

- Snap-in mounting model. 

- Mounts to 1.0-, 1.2- and 1.6-mm-thick panels. 

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Post header<br>175489-3 (Tyco Electronics AMP)<br>**----- End of picture text -----**<br>


- High resolution with a 0.5-mm-wide sensing aperture. 

- With a 5-mm-wide slot. 

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- Photo IC output signals directly connect with C-MOS and TTL. 

- Connects to Tyco Electronics AMP’s CT-series connectors. 

## **Absolute Maximum Ratings (Ta = 25** ° **C)** 

|**Absolute Maximum Ratings**<br>**(Ta = 25**°**C)**<br>7|**Absolute Maximum Ratings**<br>**(Ta = 25**°**C)**<br>7|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|
|---|---|---|---|
|**Item**||**Symbol**|**Rated**<br>**value**|
|**Power supply voltage**||VCC|7 V|
|**Output voltage**||VOUT|28 V|
|**Output current**||IOUT|16 mA|
|**Permissible output**<br>**dissipation**||POUT|250 mW<br>(see note)|
|**Ambient**<br>**temperature**|**Operating**|Topr|–20°C to<br>75°C|
||**Storage**|Tstg|–40°C to<br>85°C|
|**Soldering temperature**||Tsol|---|



**Note:** Refer to the temperature rating chart if the ambient temperature exceeds 25 ° C. 

Recommended Mating Connectors: Tyco Electronics AMP 175778-3 (crimp-type connector) 173977-3 (press-fit connector) 

## **Electrical and Optical Characteristics (Ta = 25** ° **C, VCC = 5 V** ± **10%)** 

|**Item**|**Symbol**|**Value**|**Condition**|
|---|---|---|---|
|**Current consumption**|ICC|16.5 mA max.|With and without incident|
|**Low-level output voltage**|VOL|0.35 V max.|IOUT= 16 mA<br>without incident (EE-SX3239-P2),<br>with incident (EE-SX4239-P2)|
|**High-level output voltage**|VOH|(VCCx 0.9) V min.|VOUT= VCCwith incident (EE-SX3239-P2),<br>without incident (EE-SX4239-P2), RL= 47 kΩ|
|**Response frequency**|f|3 kHz min.|VOUT= VCC,RL= 47 kΩ (see note)|



**Note:** The value of the response frequency is measured by rotating the disk as shown below. 

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Disk<br>N<br>2.1 mm<br>Lo re<br>0.5 mm<br>LT 0.5 mm<br>t = 0.2 mm<br>**----- End of picture text -----**<br>


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~~**EE-SX3239-P2/-SX4239-P2**~~ 

~~**EE-SX3239-P2/-SX4239-P2**~~ 

## **Engineering Data** 

**Output Allowable Dissipation vs. Ambient Temperature Characteristics** 

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Output allowable dissipation Pc  (mW)<br>**----- End of picture text -----**<br>


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Ambient temperature Ta ( ° C)<br>**----- End of picture text -----**<br>


**Sensing Position Characteristics (Typical)** 

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d1 = 0 ± 0.3 mm VTa = 25CC = 5 V ° C<br>RL = 47 k Ω<br>ia<br>(OFF)<br>Center of optical axis<br>/ “<br>(ON)<br>Distance d (mm)<br>Output transistor<br>Light interrupting plate<br>**----- End of picture text -----**<br>


## **Recommended Mounting Holes** 

- When mounting the Photomicrosensor to a panel with a hole opened by pressing, make sure that the hole has no burrs. The mounting strength of the Photomicrosensor will decrease if the hole has burrs. 

- When mounting the Photomicrosensor to a panel with a hole opened by pressing, be sure to mount the Photomicrosensor on the pressing side of the panel. 

   - After mounting the Photomicrosensor to any panel, make sure that the Photomicrosensor does not wobble. 

   - When mounting the Photomicrosensor to a molding with a hole, make sure that the edges of the hole are sharp enough, otherwise the Photomicrosensor may fall out. 

- The mounting strength of the Photomicrosensor will increase if the Photomicrosensor is mounted to a panel with a hole that is only a little larger than the size of the Photomicrosensor, in which case, however, it will be difficult to mount the Photomicrosensor to the panel. The mounting strength of the Photomicrosensor will decrease if the Photomicrosensor is mounted to a panel with a hole that is comparatively larger than the size of the Photomicrosensor, in which case, however, it will be easy to mount the Photomicrosensor to the panel. When mounting the Photomicrosensor to a panel, open an appropriate hole for the Photomicrosensor according to the application. 

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