EE-SX1109

## **Photomicrosensor (Transmissive) EE-SX1109** 

**Be sure to read** _**Precautions**_ **on page 25.** 

## ■ **Dimensions** 

**Note:** All units are in millimeters unless otherwise indicated. 

## ■ **Features** 

- Ultra-compact with a 6-mm-wide sensor and a 3-mm-wide slot. 

- PCB surface mounting type. 

- High resolution with a 0.5-mm-wide aperture. 

## ■ **Absolute Maximum Ratings (Ta = 25** ° **C)** 

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Optical<br>axis<br>Cross section AA<br>Recommended<br>Internal Circuit<br>Soldering Pattern<br>OE Vs<br>Terminal No.      Name<br>A     Anode<br>K     Cathode<br>C     Collector Unless otherwise specified, the<br>tolerances are ±0.15 mm.<br>E     Emitter<br>**----- End of picture text -----**<br>


|**(Ta = 25**°**C)**|**(Ta = 25**°**C)**|||
|---|---|---|---|
|**Item**||**Symbol**|**Rated value**|
|**Emitter**|**Forward current**|IF|25 mA<br>(see note 1)|
||**Pulse forward cur-**<br>**rent**|IFP|100 mA<br>(see note 2)|
||**Reverse voltage**|VR|5 V|
|**Detector**|**Collector–Emitter**<br>**voltage**|VCEO|20 V|
||**Emitter–Collector**<br>**voltage**|VECO|5 V|
||**Collector current**|IC|20 mA|
||**Collector dissipa-**<br>**tion**|PC|75 mW<br>(see note 1)|
|**Ambient tem-**<br>**perature**|**Operating**|Topr|–30°C to 85°C|
||**Storage**|Tstg|–40°C to 90°C|
||**Reflow soldering**|Tsol|255°C<br>(see note 3)|
||**Manual soldering**|Tsol|350°C<br>(see note 3)|



- **Note: 1.** Refer to the temperature rating chart if the ambient temperature exceeds 25°C. 

   **2.** Duty: 1/100; Pulse width: 0.1 ms 

   **3.** Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. 

## ■ **Electrical and Optical Characteristics (Ta = 25** ° **C)** 

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## ■ **Engineering Data** 

**Forward Current vs. Collector Dissipation Temperature Rating** 

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Forward Current vs. Forward<br>Voltage Characteristics (Typical) Characteristics (Typical)<br>60 4,010 Ta = 25°C<br>VCE = 5 V<br>«PLT 710“COOaaa YT<br>° ELLwtAL VELai TT<br>Ly‘0 mol“TYA [fit] TT<br>PLE LTA "ZEEE EEE<br>°o 02 04 08 08 1 12 14 18 18 9 10 20 30 40<br>Forward voltage VF (V) Forward current IF (mA)<br>Relative Light Current vs. Ambient<br>Temperature Characteristics (Typical) ature Characteristics (Typical)<br>IF = 5 mA<br>160f | | fd VCE = 5 VCE = 5 V = 5 V  ————————————————SS SS SS SS SS SS SS<br>120140140 fr | tf vol[a[aa ttEFFttEFFtttt tt<br>ne} ptt ft i === == VCE = 10 VCE = 10 V = 10 V<br>= a<br>w PT NL== o P eeA ep AA<br>VCECE = 2 V<br>60PtPt | | | aS=a===——AA | ae<br>P| tt fd eERE<br>40 (SeeERE ERE En)<br>7<br>PP pnffff<br>200—40Pf—200—40Pf—20—40Pf—20Pf—20—20 0 |200200 ft400400 «60 80100 attLtTIZAT“—30-20-10ayAA0“—30-20-10ayAA0ayAA0yAA0A00 10 20 30 40A50|A50|50|| 60TT70TT7070<br>Ambient temperature Ta (°C)°C)C) Ambient temperature Ta (°C)<br> (mA)<br>F A)<br>μ<br> (<br>L<br>Forward current  I Light current  I<br> (%)<br>L<br> (nA)<br>D<br>Dark current   I<br>Relative light current  I<br>**----- End of picture text -----**<br>


**Light Current vs. Forward Current Characteristics (Typical)** 

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 (mW)<br>C<br>Collector dissipation P<br>**----- End of picture text -----**<br>


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———n30PTT IN | ”<br>oflpo NA 60©<br>0SeeeNeEee> ee<br>°40<br>Ambient temperature Ta ( 200 «20400 °C)<br>Light Current vs. Collector − Emitter<br>Voltage Characteristics (Typical)<br>Ta = 25°C<br>600700Py TP pT<br>500PyPy | iy fd<br>”<br>P| ff IFF = 10 mA tt<br>200“Wcrfcrf oo LOL<br> (| IFF = 5 mA<br>po<br>—— a<br>ofPit22224fdPit22224fd22224fdfd<br>Collector−Emitter voltage VCE (V)−Emitter voltage VCE (V)Emitter voltage VCE (V)CE (V) (V)<br> (mA) C<br>F<br>Forward current  I<br>Collector dissipation P<br>A)<br>μ<br> (<br>L<br>Light current  I<br>**----- End of picture text -----**<br>


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Dark Current vs. Ambient Temper-<br>ature Characteristics (Typical)<br>**----- End of picture text -----**<br>


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500PyPy | iy fd 120140140 fr | tf VCE = 5 VCE = 5 V = 5 V vol[a[aa ttEFFttEFFtttt tt<br>ne} ptt ft i === == ee VCE = 10 VCE = 10 V = 10 V<br>” = a AI<br>P| ff IFF = 10 mA tt w PT NL== o P eeA ep AA<br>VCECE = 2 V<br>“Wcrf200“Wcrfcrf oo LOL 60PtPt | | | S=a===——AaS=a===——AA | ae<br> (| IFF = 5 mA 40 P| tt fd (SeeERE En) e 2en8<br>po 7<br>—— a PP pnffff<br>ofPit22224fdPit22224fd22224fdfd 200—40Pf—200—40Pf—20—40Pf—20Pf—20—20 0 |200200 ft400400 «60 80100 attLtTIZAT“—30-20-10ayAA0“—30-20-10ayAA0ayAA0yAA0A00 10 20 30 40A50|A50|50|| 60TT70TT7070 80|90<br>Collector−Emitter voltage VCE (V)−Emitter voltage VCE (V)Emitter voltage VCE (V)CE (V) (V) °<br>Ambient temperature Ta (°C)°C)C) Ambient temperature Ta (°C)<br>Response Time vs. Load Resist- Sensing Position Characteris- Sensing Position Characteris-<br>ance Characteristics (Typical) tics (Typical) tics (Typical)<br>1,000 presSSaeeee OS OS Ta = 25VCC = 5 V °C mr.La===s .6| 100120 VIFCE= 5 mA  = 5 V  Fe 100120 VIFCE= 5 mA  = 5 V<br>100 EEIAISHaaa okaee> eeeeee EEEH| 80 oN i 80<br>Sepeee es0SSS SSerayee a | 40<br>oo 7<br>LLL1a ee10 | TT100 —06: —04Py—02 INC0 02ks o4 0.6 20 —12-09 -06 -03 0 03 06 O09<br>Load resistance RL (kΩ) Distance d (mm) Distance d (mm)<br>L<br>μ<br> (nA)<br>L D<br>Dark current   I<br>Relative light current  I<br>s)<br>μ<br> (%)  (%)<br>L L<br>Response time tr, tf (<br>Relative light current  I Relative light current  I<br>**----- End of picture text -----**<br>


## **Response Time Measurement Circuit** 

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Input<br>——t<br>90 %<br>Output ° 10 %<br>tr tf<br>Input I- vec<br>Output<br>**----- End of picture text -----**<br>


**EE-SX1109** Photomicrosensor (Transmissive) 

71 

Unit: mm (inch) 

## ■ **Tape and Reel** 

## **Reel** 

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21±0.8 dia.<br>2±0.5 330+2 dia.<br>13±<br>0.5 dia.<br>80±1 dia.<br>as =<br>Z, |<br>hf<br>Product name<br>Quantity<br>Po 4 |<br>Lot No.<br>q H<br>12.4 [+2] 0<br>18.4 max.<br>**----- End of picture text -----**<br>


**Tape** 

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1.5 dia.<br>bdo 59-O<br>| f. ep<br>Terminating part  Parts mounted Leading part<br>(40 mm min.) (400 mm min.)<br>TO ee<br>Empty<br>Pull-out direction (40 mm min.)<br>= a<br>**----- End of picture text -----**<br>


## **Tape configuration** 

## **Tape quantity** 

1,000 pcs./reel 

**EE-SX1109** Photomicrosensor (Transmissive) 

72 

## **Precautions** 

## ■ **Soldering Information** 

## **Reflow soldering** 

- The following soldering paste is recommended: 

   - Melting temperature: 216 to 220°C 

   - Composition: Sn 3.5 Ag 0.75 Cu 

- The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. 

- Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. 

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260°C max.<br>1 to 5°C/s 255°C max.<br>230°C max.<br>1 to 5°C/s 150 to 180°C<br>10 sec max.<br>120 sec<br>40 sec max.<br>Time<br>Temperature<br>**----- End of picture text -----**<br>


## **Manual soldering** 

- Use ”Sn 60” (60% tin and 40% lead) or solder with silver content. 

- Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. 

- Solder each point for a maximum of three seconds. 

- After soldering, allow the product to return to room temperature before handling it. 

## **Storage** 

To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: 

Temperature: 10 to 30°C 

Humidity: 60% max. 

The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. 

If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. 

## **Baking** 

If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: 

Reel: 60°C for 24 hours or more 

Bulk: 80°C for 4 hours or more 

**EE-SX1109** Photomicrosensor (Transmissive) 

73