# Common Mode Filter, ESD Protection, AEC-Q101, QFN-10L

![Product image](https://novapart.co/image/farnell:3605810RL/)

**URL**: https://novapart.co/products/ECMF4-2459A6M10Y/common-mode-filter-esd-protection-aec-q101-qfn-10l
**SKU**: ECMF4-2459A6M10Y
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.2450
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 10Pins |
| Product Range | ECMF Series |
| Filter Circuit | Common-Mode |
| Emi Filter Type | Common Mode Filter with ESD Protection |
| No. Of Data Lines | 4 Data Lines |
| Filter Case / Package | QFN |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3605810RL/)

**ECMF4-2459A6M10Y** 

Datasheet 

Automotive common mode filter with ESD protection 

## **Features** 

- AEC-Q101 qualified 

- 9 GHz differential bandwidth to comply with HDMI 2.0, HDMI2.1, HDMI 1.4, USB 3.2 generation 1 and 2, MIPI and DisplayPort, FPD link III and GMSL 

- Common mode attenuation on LTE, GPS, Wi-Fi and V2x frequencies: 

   - -13 dB at 1.5 GHz 

   - -34 dB at 2.4 GHZ 

   - -20 dB at 5.9 GHZ 

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D1+ Con 1 10 D1+ IC<br>• Wettable flank for automatic optical inspection<br>D1- Con 2 9 D1- IC • Low PCB space consumption: 3.5 mm²<br>GND 3 8 GND • Thin package for compact applications: 0.75 mm<br>• RoHS package<br>D2+ Con 4 7 D2+ IC<br>D2- Con 5 6 D2- IC<br>**----- End of picture text -----**<br>


## **Complies with the following standards** 

- UL94, V0 

- J-STD-020 MSL level 1 

- J-STD-002 

- IPC7531 footprint and JEDEC registered package 

- ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4: 

**Product status link** ECMF4-2459A6M10Y **Product summary Order code** ECMF4-2459A6M10Y 

   - 8 kV (contact discharge) 

   - 15 kV (air discharge) 

- ISO 10605, C = 330 pF – R = 330 Ω: 

   - 8 kV (contact discharge) 

   - 15 kV (air discharge) 

## **Description** 

The ECMF4-2459A6M10Y is an integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed buses HDMI 2.0, HDMI2.1, HDMI 1.4 and DisplayPort, FPD link III, GMSL, USB3.2 generation 1 and 2 , MIPI. It is designed to replace discrete common mode chokes or LTCC. 

The device embeds ESD protections on connector side to meet ISO 10605 requirements. 

Packaged in QFN-10L with wettable flank, it is compatible with automatic visual inspection. 

**DS13469** - **Rev 1** - **October 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**ECMF4-2459A6M10Y Characteristics** 

## **1** 

## **Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**||**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage|ISO 10605 (C = 330 pF, R = 330 Ω):<br>Contact discharge<br>Air discharge|8<br>15|kV|
|||ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):<br>Contact discharge<br>Air discharge|8<br>15|kV|
|IRMS|RMS current||100|mA|
|Top|Operating ambient temperature range||-55 to +125|°C|
|Tstg|Storage temperature range||-55 to +150||



**Figure 1. Electrical characteristics (definitions)** 

**I** VRM Maximum stand-off voltage VCL Clamping voltage at peak pulse current IPP **IPP** IRM Leakage current at VRM IPP Peak pulse current VBR Breakdown voltage **IIRMR V** RDC DC serial resistance **VRM VBR VCL** fC Differential cut off frequency 

**Table 2. Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|5.3|5.8||V|
|IR|VR= 3.6 V|||50|nA|
|IRM|VRM= 5 V|||70|nA|
|RDC|IDC= 20 mA||5||Ω|
|fc|SDD21= -3 dB||9||GHz|
|VCL|8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω)||18.5||V|



**DS13469** - **Rev 1** 

**page 2/12** 

**ECMF4-2459A6M10Y Characteristics (curves)** 

## **1.1** 

## **Characteristics (curves)** 

**==> picture [480 x 24] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 2. Differential attenuation versus frequency Figure 3. Common mode attenuation versus frequency<br>  (Z0_diff = 100 Ω)  (Z0_com = 50 Ω)<br>**----- End of picture text -----**<br>


**Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)** 

**Figure 6. TDR with 200 ps rise time** 

**Figure 7. TLP characteristic** 

**==> picture [213 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 I(A)<br>15 Tj initial = 25 tp = 100 ns°C<br>10<br>5 PLT TTT TT YA [fl<br>0<br>Goes<br>-5 4<br>-10<br>-15<br>V(V)<br>-20<br>-30 -20 -10 0 10 20 30<br>**----- End of picture text -----**<br>


**DS13469** - **Rev 1** 

**page 3/12** 

**ECMF4-2459A6M10Y Characteristics (curves)** 

**Figure 8. HDMI2.0 – 5.94 Gbps eye diagram  without Figure 9. HDMI2.0 – 5.94 Gbps eye diagram  with device device (with worst cable and equaliser) (with worst cable and equaliser)** 

**Figure 10. HDMI2.1 – 12 Gbps eye diagram without device (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE** 

**Figure 11. HDMI2.1 – 12 Gbps eye diagram with device (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE** 

**Figure 12. USB3.2 Gen1 – 5 Gbps Type-C eye diagram without device (with type C connector, reference cable and equalizer)** 

**Figure 13. USB3.2 Gen1 – 5 Gbps Type-C eye diagram with device (with type C connector, reference cable and equalizer)** 

**DS13469** - **Rev 1** 

**page 4/12** 

**ECMF4-2459A6M10Y Characteristics (curves)** 

**Figure 14. USB3.2 Gen2 – 10 Gbps eye diagram without device (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)** 

**Figure 16. FPD LinkIII – 4.16 Gbps eye diagram without device** 

**Figure 18. GMSL – 3.12 Gbps eye diagram without device** 

**Figure 15. USB3.2 Gen2 – 10 Gbps eye diagram with device (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)** 

**Figure 17. FPD LinkIII – 4.16 Gbps eye diagram with device** 

**Figure 19. GMSL – 3.12 Gbps eye diagram with device** 

**DS13469** - **Rev 1** 

**page 5/12** 

**ECMF4-2459A6M10Y Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 QFN-10L package information** 

**Figure 20. QFN-10L package outline** 

**==> picture [248 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
L A<br>D<br>e<br>b A1<br>A3 E<br>CD<br>CW<br>1 1<br>10(N)<br>6 5<br>plane Seatin<br>g<br>**----- End of picture text -----**<br>


**Table 3. QFN-10L mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches(1)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.70|0.75|0.80|0.0275|0.0295|0.0315|
|A1|0.00|0.02|0.05|0.0000|0.0008|0.0020|
|A3||0.20|||0.0079||
|b|0.15|0.20|0.25|0.0059|0.0079|0.0099|
|D|2.55|2.60|2.65|0.1003|0.1024|0.1044|
|E|1.30|1.35|1.40|0.0511|0.0531|0.0552|
|e||0.50|||0.0197||
|L|0.45|0.50|0.55|0.0177|0.0197|0.0217|
|CW|0.01|0.05|0.09|0.0003|0.0020|0.0032|
|CD|0.10|||0.0039|||



_1. Value in inches are converted from mm and rounded to 4 decimal digits_ 

**DS13469** - **Rev 1** 

**page 6/12** 

**ECMF4-2459A6M10Y PCB assembly recommendations** 

**3** 

## **PCB assembly recommendations** 

**Figure 21. Recommended stencil opening (mm)** 

**==> picture [230 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.190 0.500<br>pa L e l e i a t al<br>2.190<br>Stencil opening thickness: 100 µm<br>0.660<br>1.710<br>**----- End of picture text -----**<br>


**Figure 22. Wettable flank profile** 

## **3.1 Solder paste** 

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 

2. “No clean” solder paste is recommended. 

3. Offers a high tack force to resist component movement during high speed. 

4. Use solder paste with fine particles: powder particle size is 20-38 μm. 

**DS13469** - **Rev 1** 

**page 7/12** 

**ECMF4-2459A6M10Y QFN-10L packing information** 

## **3.2 QFN-10L packing information** 

**Figure 23. Footprint recommendations (mm)** 

**==> picture [149 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.200 0.500<br>—| F a<br>aa d<br>vacua<br>lin<br>|_______. 2.200<br>00<br>.7<br>0<br>1.750<br>**----- End of picture text -----**<br>


**Figure 25. Package orientation in reel** 

**==> picture [80 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 24. Marking<br>**----- End of picture text -----**<br>


**==> picture [127 x 127] intentionally omitted <==**

**----- Start of picture text -----**<br>
XXYM<br>a<br>Dot indicates pin 1<br>XX: Marking<br>Y: Year<br>M: Month<br>**----- End of picture text -----**<br>


**Figure 26. Tape and reel orientation** 

**==> picture [183 x 30] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin 1 located according to EIA-481<br>Note: Pocket dimensions are not on scale<br>Pocket shape may vary depending on package<br>**----- End of picture text -----**<br>


**Figure 27. Reel dimensions (mm)** 

**==> picture [155 x 103] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ø 180 max<br>14.4<br>2±0.5<br>Ø 13<br>Ø 60  Ø 20.2 min<br>**----- End of picture text -----**<br>


**Figure 28. Inner box dimensions (mm)** 

**==> picture [106 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>205<br>205<br>**----- End of picture text -----**<br>


**DS13469** - **Rev 1** 

**page 8/12** 

**ECMF4-2459A6M10Y Solder reflow** 

## **Figure 29. Tape and reel outline** 

**Table 4. Tape and reel mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
||**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|ØD0|1.40|1.50|1.50|
|ØD1|0.80|||
|F|1.65|1.75|1.85|
|K0|0.85|0.95|1.05|
|P0|3.9|4.0|4.1|
|P1|3.9|4.0|4.1|
|P2|1.95|2.00|2.05|
|W|7.9|8.0|8.3|



## **3.3** 

## **Solder reflow** 

**Figure 30. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** 

**==> picture [244 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
[| 240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>pense teeta reffa i<br>(90m ax) -3 °C/s<br>150 PT || /<br>er [LN] [G] Ld -6° C/s<br>100<br>Ploeg| | Tt EN<br>0.9 °C/s<br>50 Z a<br>Time (s)<br>A C EC<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>


_Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._ 

**DS13469** - **Rev 1** 

**page 9/12** 

**ECMF4-2459A6M10Y Ordering information** 

## **4 Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF4-2459A6M10Y|CY(1)|QFN-10L|7 mg|3000|Tape and reel|



_1. The marking can be rotated to differentiate assembly location_ 

**DS13469** - **Rev 1** 

**page 10/12** 

**ECMF4-2459A6M10Y** 

## **Revision history** 

**Table 5. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|20-Oct-2020|1|Initial release.|



**DS13469** - **Rev 1** 

**page 11/12** 

**ECMF4-2459A6M10Y** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS13469** - **Rev 1** 

**page 12/12** 



## Links

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- [Supplier page](https://es.farnell.com/stmicroelectronics/ecmf4-2459a6m10y/common-mode-filter-w-esd-qfn-10/dp/3605810RL)
---

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