# EMI Filter, 2-Channel, Common Mode, ESD Protection, High Speed Serial Lines, µQFN-10

![Product image](https://novapart.co/image/farnell:2987055RL/)

**URL**: https://novapart.co/products/ECMF4-2450A60N10/emi-filter-2-channel-common-mode-esd-protection
**SKU**: ECMF4-2450A60N10
**Manufacturer**: STMICROELECTRONICS
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.2450
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Description

EMI Filter Type:Common Mode Filter with ESD Protection; No. of Data Lines:4 Data Lines; Filter Circuit:Common-Mode; Filter Case Style:µQFN; No. of Pins:10Pins; Product Range:-; SVH

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 10Pins |
| Product Range | ECMF Series |
| Filter Circuit | Common-Mode |
| Emi Filter Type | Common Mode Filter with ESD Protection |
| No. Of Data Lines | 4 Data Lines |
| Filter Case / Package | µQFN |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2987055RL/)

**ECMF4-2450A60N10** 

Datasheet 

## Common mode filter with ESD protection for high speed serial interface 

## **Features** 

- 6.4 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB 3.1 Gen 1 and Gen 2, MIPI, display port, etc. 

- High common mode attenuation on WLAN frequencies : 

   - From - 30 dB to - 33 dB at 2.4 – 2.47 GHz: Wi-Fi CH1-14 frequencies 

   - From - 20 dB to - 15 dB at 5.18 – 5.82 GHz: Wi-Fi CH36-165 frequencies 

- Very low PCB space consumption 

- Thin package: 0.5 mm max. 

- Lead free and RoHS package 

- High reduction of parasitic elements through integration 

D1+ to connector O **1** o a **10** D1+ to IC D1- to connector **2 9** D1- to IC GND **3 8** GND D2+ to connector **4 7** D2+ to IC D2- to connector **5 6** D2- to IC 

- Exceeds IEC 61000-4-2 level 4 standards: 

   - ±25 kV (air discharge) 

   - ±10 kV (contact discharge) 

## **Applications** 

- Notebook, laptop 

- Streaming box 

- Set top box 

- Portable devices 

- Tablet 

**Product status** ~~[Po~~ ECMF4-2450A60N10 

## **Description** 

The ECMF4-2450A60N10 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.1, HDMI 2.0, HDMI1.4, USB 3.1 Gen 1 and Gen 2, ethernet, MIPI, display port and other high speed serial interfaces. 

It has a very large differential bandwidth to comply with these standards and can also protect and filter 2 differential lanes. 

**DS12709** - **Rev 2** - **April 2019** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**ECMF4-2450A60N10 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage|IEC 61000-4-2:<br>Contact discharge<br>Air discharge|10<br>25|kV|
|IRMS|Maximum RMS current||100|mA|
|Top|Maximum operating temperature range||-55 to +125|°C|
|Tstg|Storage temperature range||-55 to +150||
|TL|Maximum temperature for soldering during 10 s||260||



**Figure 1. Electrical characteristics (definitions)** 

|**IRM**<br>**IR**<br>**IPP**<br>**I**<br>VRM<br>Maximum stand-off voltage<br>VCL<br>Clamping voltage at peak pulse current IPP<br>IRM<br>Leakage current at VRM<br>IPP<br>Peak pulse current<br>VBR<br>Breakdown voltage<br>CDIODE ESD diode capacitance<br>RDC<br>DC serial resistance<br>fC<br>Differential cut off frequency|**IRM**<br>**IR**<br>**IPP**<br>**I**<br>VRM<br>Maximum stand-off voltage<br>VCL<br>Clamping voltage at peak pulse current IPP<br>IRM<br>Leakage current at VRM<br>IPP<br>Peak pulse current<br>VBR<br>Breakdown voltage<br>CDIODE ESD diode capacitance<br>RDC<br>DC serial resistance<br>fC<br>Differential cut off frequency|**VCL**<br>**VBR**<br>**VRM**<br>**V**|
|---|---|---|
||**IRM**<br>**IR**<br>**IPP**||
||||
||||
||||
|||**VBR**<br>**VRM**|



**Table 2. Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|5.3|5.8||V|
|IRM|VRM= 3.6 V per line||< 1|50|nA|
||VRM= 5 V per line||3|70|nA|
|RDC|DC serial resistance, IDC= 20 mA||5||Ω|
|fc|Differential mode cut-off frequency at -3 dB||6.4||GHz|
|VCL|8 kV contact discharge after 30 ns, IEC 61000-4-2||17.3||V|
|CDIODE|VBIAS= 0 V, 2.5 GHz ≤ f ≤ 6 GHz, VOSC= 30 mV||0.25|0.40|pF|



**DS12709** - **Rev 2** 

**page 2/14** 

**ECMF4-2450A60N10 Characteristics** 

**Table 3. Pin description** 

|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D1+ to connector|6|D2- to IC|
|2|D1- to connector|7|D2+ to IC|
|3|GND|8|GND|
|4|D2+ to connector|9|D1- to IC|
|5|D2- to connector|10|D1+ to IC|



**DS12709** - **Rev 2** 

**page 3/14** 

**ECMF4-2450A60N10 Characteristics (curves)** 

## **1.1 Characteristics curves** 

**==> picture [504 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 2. Differential attenuation versus frequency (Z0 DIFF Figure 3. Common mode attenuation versus frequency (Z0<br>= 100 Ω) COM [ = 50 Ω)]<br>SDD21(dB) SCC21(dB)<br>0 0<br>From - 20 dB to -15 dB<br>5 @5.18 - 5.82 GHz<br>-1<br>-10<br>Wi-Fi CH36-165 [<br>-2 -15<br>SAGheec2ds -20 From - 30 dB to - 33 dB<br>-3 ; -25 @2.4-Wi-Fi 2.47CH1-14GHz<br>-30<br>-4<br>-35<br>f(Hz) f(Hz)<br>-5 -40<br>1E8 1E9 8E9 1E8 1E9 8E9<br>**----- End of picture text -----**<br>


**Figure 4. HDMI2.1 12 Gbps eye diagram without ECMF4-2450A60N10 (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE** 

**Figure 5. HDMI2.1 12 Gbps eye diagram with ECMF4-2450A60N10 (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE** 

**DS12709** - **Rev 2** 

**page 4/14** 

**ECMF4-2450A60N10 Characteristics (curves)** 

**Figure 6. HDMI2.0 5.94 Gbps eye diagram without ECMF4-2450A60N10 (with worst case cable and equalizer)** 

**Figure 8. USB3.1 Gen 2 10.0 Gbps eye diagram without ECMF4-2450A60N10 (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)** 

**Figure 10. USB3.1 Gen 1 5.0 Gbps eye diagram without ECMF4-2450A60N10 (with type C connector, reference cable and equalizer)** 

**Figure 7. HDMI2.0 5.94 Gbps eye diagram with ECMF4-2450A60N10 (with worst case cable and equalizer)** 

**Figure 9. USB3.1 Gen 2 10.0 Gbps eye diagram with ECMF4-2450A60N10 (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)** 

**Figure 11. USB3.1 Gen 1 5.0 Gbps eye diagram with ECMF4-2450A60N10 (with type C connector, reference cable and equalizer)** 

**DS12709** - **Rev 2** 

**page 5/14** 

**ECMF4-2450A60N10 Characteristics (curves)** 

**==> picture [494 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 12. ESD response to IEC61000-4-2 (+8 kV contact Figure 13. ESD response to IEC61000-4-2 (-8 kV contact<br>discharge) discharge)<br>**----- End of picture text -----**<br>


**==> picture [211 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 14. TLP characteristic<br>20 Ipp (A)<br>tp=100ns<br>15<br>10<br>  5<br> 0<br>- 5<br>-10<br>-15<br>VCL(V)<br>-20<br>-25 -20 -15 -10  -5   -0    5  10  15   20   25<br>**----- End of picture text -----**<br>


**DS12709** - **Rev 2** 

**page 6/14** 

**ECMF4-2450A60N10 Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 µQFN10L package information** 

## **Figure 15. µQFN10L package outline** 

**==> picture [222 x 225] intentionally omitted <==**

**----- Start of picture text -----**<br>
Top view<br>D<br>Idex area<br>E<br>Side view<br>A3<br>A1<br>A seating<br>plane<br>Bottom view<br>e b<br>1 5<br>PIN # 1 ID<br>L<br>10 6<br>**----- End of picture text -----**<br>


**Table 4. µQFN10L package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
|**Ref.**|**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|A|0.41|0.45|0.50|
|A1|0.00|0.02|0.05|
|A3||0.127||
|b|0.15|0.20|0.25|
|D|2.15|2.20|2.25|
|E|1.30|1.35|1.40|
|e||0.40||
|L|0.40|0.50|0.60|



**DS12709** - **Rev 2** 

**page 7/14** 

**ECMF4-2450A60N10 Package information** 

**Figure 16. Marking layout** 

**==> picture [191 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
MJ<br>**----- End of picture text -----**<br>


_Note: The marking codes can be rotated by 90 ° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose._ 

**Figure 17. Tape and reel outline** 

**==> picture [428 x 240] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin 1 located according to EIA-481<br>P0 Ø D0<br>E1<br>F<br>W<br>B0<br>P1 P2 A0 Ø D1<br>K0<br>User direction of unreeling<br>Note: Pocket dimensions are not on scale<br>Pocket shape may vary depending on package<br>**----- End of picture text -----**<br>


**DS12709** - **Rev 2** 

**page 8/14** 

**ECMF4-2450A60N10 Package information** 

**Table 5. Tape and reel mechanical data** 

|**Rf**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|
|---|---|---|---|
|**e.**|**Min.**|**Typ.**|**Max.**|
|P1|3.9|4.0|4.1|
|P0|3.9|4.0|4.1|
|Ø D0|1.4|1.5|1.6|
|Ø D1|0.35|0.40|0.45|
|F|3.45|3.5|3.55|
|E1|1.65|1.75|1.85|
|K0|0.6|0.65|0.7|
|P2|1.95|2|2.05|
|W|7.9|8|8.1|
|A0|1.50|1.55|1.60|
|B0|2.35|2.40|2.45|



**DS12709** - **Rev 2** 

**page 9/14** 

**ECMF4-2450A60N10 Recommendation on PCB assembly** 

**3 Recommendation PCB assembly** 

## **3.1 Footprint** 

**Figure 18. Footprint in mm** 

**==> picture [209 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.200<br>0.400<br>0.700<br>1.750<br>**----- End of picture text -----**<br>


SMD footprint design is recommended. 

## **3.2 Stencil opening design** 

Recommended design reference: stencil opening thickness: 100 μm 

**Figure 19. Stencil opening recommendations** 

**==> picture [169 x 163] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.190<br>0.400<br>0.660<br>1.710<br>**----- End of picture text -----**<br>


**DS12709** - **Rev 2** 

**page 10/14** 

**ECMF4-2450A60N10 Solder paste** 

## **3.3 Solder paste** 

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 

2. “No clean” solder paste is recommended. 

3. Offers a high tack force to resist component movement during PCB movement. 

4. Solder paste with fine particles: powder particle size is 20-38 μm. 

## **3.4 Placement** 

1. Manual positioning is not recommended. 

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0.05 mm is recommended. 

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 

## **3.5 PCB design preference** 

1. To control the solder paste amount, the closed via is recommended instead of open vias. 

2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 

## **3.6 Reflow profile** 

## **Figure 20. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** 

**==> picture [285 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>(90m ax) -3 °C/s<br>150<br>-6° C/s<br>100<br>0.9 °C/s<br>50<br>Time (s)<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>


_Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._ 

**DS12709** - **Rev 2** 

**page 11/14** 

**ECMF4-2450A60N10 Ordering information** 

**4** 

## **Ordering information** 

**Figure 21. Ordering information scheme** 

**==> picture [355 x 255] intentionally omitted <==**

**----- Start of picture text -----**<br>
ECMF 4 - 24 50 A 60 N10<br>Function<br>Common mode filter with ESD protection<br>Number of lines<br>4 = 4 filtered lines with ESD protection<br>First common mode peak rejection<br>24 = 2.4 GHz<br>Second common mode peak rejection<br>50 = 5.0 GHz<br>Version<br>Differential bandwith<br>60 : > 6.0 GHz<br>Package<br>N10 = µQFN 10-L 400 µm pitch<br>**----- End of picture text -----**<br>


**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF4-2450A60N10|MJ(1)|µQFN-10L|3.9 mg|3000|Tape and reel|



_1. The marking can be rotated by 90° to differentiate assembly location_ 

**DS12709** - **Rev 2** 

**page 12/14** 

**ECMF4-2450A60N10** 

## **Revision history** 

**Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|27-Jul-2018|1|Initial release.|
|24-Apr-2019|2|UpdatedTable 6.|



**DS12709** - **Rev 2** 

**page 13/14** 

**ECMF4-2450A60N10** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2019 STMicroelectronics – All rights reserved 

**DS12709** - **Rev 2** 

**page 14/14** 



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- [Supplier page](https://es.farnell.com/stmicroelectronics/ecmf4-2450a60n10/common-mode-filter-w-esd-protect/dp/2987055RL)
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