# Special Function IC, Common Mode Filters with ESD Protection, 1.7 GHz Bandwidth, µQFN-10

![Product image](https://novapart.co/image/farnell:2723329/)

**URL**: https://novapart.co/products/ECMF4-2450A17M10/special-function-ic-common-mode-filters-with-esd
**SKU**: ECMF4-2450A17M10
**Manufacturer**: STMICROELECTRONICS
**Category**: Passive Components || Filters || Integrated Passive Filters
**Price**: €0.1560
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 10Pins |
| Filter Circuit | Common-Mode |
| Emi Filter Type | Common Mode Filter with ESD Protection |
| Filter Case Style | QFN |
| No. Of Data Lines | 4 Data Lines |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2723329/)

## **ECMF4-2450A17M10** 

## Common mode filter with ESD protection for high speed serial interface 

Datasheet - production data 

## **Description** 

The ECMF4-2450A17M10 is a highly integrated common mode filter and low pass filter designed to suppress WiFi differential and common mode noise on high speed differential serial buses like HDMI. The device can protect and filter 2 differential lanes. 

## **Figure 1: Pin configuration** 

**==> picture [109 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
µQFN-10L 2.60 x 1.35 mm<br>**----- End of picture text -----**<br>


## **Features** 

- High differential mode attenuation on WLAN frequencies : 

   - -23 dB at 2.4 GHz and -32 dB at 5.0 GHz 

**==> picture [101 x 106] intentionally omitted <==**

**----- Start of picture text -----**<br>
D1+ 1 10 D1+<br>D1- 2 9 D1-<br>GND 3 8 GND<br>D2+ 4 7 D2+<br>D2- 5 6 D2-<br>**----- End of picture text -----**<br>


- Large bandwidth: 1.7 GHz 

- Very low PCB space consumption. 

- Thin package: 0.55 mm max. 

- Lead-free package. 

- High reduction of parasitic elements through integration. 

## **Applications** 

- Set top box 

- Streaming box 

- HDMI stick 

- Game console 

- Notebook, laptop 

- Portable devices 

November 2016 

DocID030008 Rev 1 

1/13 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**ECMF4-2450A17M10** 

## **1 Characteristics** 

**Table 1: Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage|IEC 61000-4-2:<br>Contact discharge (connector side)<br>Air discharge (connector side)|8<br>15|kV|
|IRMS|Maximum RMS current||100|mA|
|Top|Operatingtemperature||-40 to +85|°C|
|Tj|Maximumjunction temperature||125||
|Tstg|Storage temperature range||-55 to +150||



**Figure 2: Electrical characteristics (definitions)** 

**==> picture [407 x 200] intentionally omitted <==**

**Table 2: Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Test condition**|**Test condition**|**Min.**|<br>**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VBR|IR= 1 mA||4.5|5.5||V|
|IRM|VRM= 3 Vper line||||100|nA|
|RDC|DC serial resistance|||5.5||Ω|
|Fc|-3 dB differential mode cut-off frequency|||1.7||GHz|
|VCL|IPP= 1 A, 8/20µs||||10|V|
||IEC 61000 4-2, +8 kV contact (IPP= 16 A),<br>measured at 30 ns|||12.9|||
|Cdiode<br>[D+ or D-]/ GND|VD+/D-= 0 V, F = 2.5 GHz to 6 GHz|||0.35|0.45|pF|
|Rd|Dynamic resistance,<br>tP= 100 ns|D+ or D- to GND||0.48||Ω|
|||GND to D+ or D-||0.96|||



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**ECMF4-2450A17M10** 

**Characteristics** 

**Table 3: Pin description** 

|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D1+ (to connector)|6|D2- (to IC)|
|2|D1- (to connector)|7|D2+ (to IC)|
|3|GND|8|GND|
|4|D2+(to connector)|9|D1- (to IC)|
|5|D2- (to connector)|10|D1+ (to IC)|



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**ECMF4-2450A17M10** 

## **Characteristics** 

## **1.1 Characteristics (curves)** 

**Figure 3: Differential attenuation versus frequency (Z0 diff = 100 Ω) – evaluation board with SMA connector** 

## **Figure 4: Common mode attenuation versus frequency (Z0 com = 50 Ω)** 

## **Figure 5: ESD response to IEC61000-4-2 (+8 kV contact discharge)** 

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**ECMF4-2450A17M10** 

**Characteristics** 

## **Figure 6: ESD response to IEC61000-4-2 (-8 kV contact discharge)** 

**Figure 7: HDMI1.4 2.228 Gbps source eye diagram Figure 8: HDMI1.4 2.228 Gbps source eye diagram (without ECMF4-2450A17M10) (with ECMF4-2450A17M10)** 

**==> picture [449 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9: HDMI1.4 1.485 Gbps source eye diagram  Figure 10: HDMI1.4 1.485 Gbps source eye diagram<br>(without ECMF4-2450A17M10)  (with ECMF4-2450A17M10)<br>**----- End of picture text -----**<br>


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**ECMF4-2450A17M10** 

**Application** information 

## **2 Application information** 

**Figure 11: HDMI schematic** 

**==> picture [121 x 180] intentionally omitted <==**

**----- Start of picture text -----**<br>
ECMF4-2450A17M10<br>D0<br>D1<br>ECMF4-2450A17M10<br>D2<br>CLK<br>HDMI2C1-6C1<br>HDMI ASIC<br>HDMI connector<br>**----- End of picture text -----**<br>


~~a~~ 6/13 DocID030008 Rev 1 ~~7~~ 

**ECMF4-2450A17M10** 

**Package** information 

## **3 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

## **3.1 µQFN10L package information** 

**Figure 12: µQFN10L package outline** 

**==> picture [407 x 285] intentionally omitted <==**

**Table 4: µQFN10L package mechanical data** 

|**Ref.**|||**Dimensions**|**Dimensions**|||
|---|---|---|---|---|---|---|
|||**Millimeters**|||**Inches**||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.45|0.50|0.55|0.018|0.020|0.022|
|A1|0.00|0.02|0.05|0.00|0.0008|0.002|
|b|0.15|0.20|0.25|0.006|0.008|0.010|
|D|2.55|2.60|2.65|0.1|0.102|0.104|
|E|1.30|1.35|1.40|0.051|0.053|0.055|
|e||0.50|||0.020||
|L|0.40|0.50|0.60|0.016|0.020|0.024|



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**ECMF4-2450A17M10** 

## **Package** information 

**==> picture [421 x 244] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13: Footprint recommendations,  Figure 14: Marking layout<br>dimensions in mm (inches)<br>0.20<br>0.70<br>! ME<br>1.75<br>0.50<br>awe |<br>Product marking may be rotated by 90° for assembly plant differentiation. In no<br>case should this product marking be used to orient the component for its<br>placement on a PCB. Only pin 1 mark is to be used for this purpose.<br>**----- End of picture text -----**<br>


**Figure 15: Package orientation in reel** 

**==> picture [154 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 16: Tape and reel orientation<br>**----- End of picture text -----**<br>


**Figure 17: Reel dimensions in mm** 

**Figure 18: Inner box dimension definition in mm** 

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**ECMF4-2450A17M10** 

**Package** information 

**Figure 19: Tape dimension definitions** 

**Table 5: Tape and reel mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
||**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|P1|3.9|4.0|4.1|
|P0||4.0||
|Ø D0|1.4|1.5|1.6|
|Ø D1|1|||
|F|3.45|3.5|3.55|
|K0|0.6|0.7|0.8|
|P2|1.95|2|2.05|
|W|7.9|8|8.3|



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**Recommendation** on PCB assembly 

**ECMF4-2450A17M10** 

## **4 Recommendation on PCB assembly** 

## **4.1 Solder paste** 

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 

2. “No clean” solder paste is recommended. 

3. Offers a high tack force to resist component movement during high speed. 

4. Solder paste with fine particles: powder particle size is 20-45 μm. 

## **4.2** 

## **Placement** 

1. Manual positioning is not recommended. 

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 

3. Standard tolerance of ±0.05 mm is recommended. 

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 

## **4.3** 

## **PCB design preference** 

1. To control the solder paste amount, the closed via is recommended instead of open vias. 

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 

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**Recommendation** on PCB assembly 

**ECMF4-2450A17M10** 

## **4.4 Reflow profile** 

**Figure 20: ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** 

Minimize air convection currents in the reflow oven to avoid component movement. 

Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. 

DocID030008 Rev 1 

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**Ordering** information 

**ECMF4-2450A17M10** 

## **5 Ordering information** 

**Figure 21: Ordering information scheme** 

**==> picture [416 x 280] intentionally omitted <==**

**----- Start of picture text -----**<br>
ECMF 4 – 24 50 A 17 M10<br>Function<br>Common mode filter with ESD protection<br>Number of lines<br>4 = 4 filtered lines with ESD protection<br>1st common mode rejection<br>24 = 2.4 GHz<br>2nd common mode rejection<br>50 = 5.0 GHz<br>Version<br>A = 1st version<br>Differential bandwidth<br>17 = 1.7 GHz<br>Package<br>M10: µQFN-10L<br>Table 6: Ordering information<br>Order code  Marking  Package  Weight  Base qty.  Delivery mode<br>ECMF4-2450A17M10  ME  µQFN-10L  5 mg 3000  Tape and reel<br>**----- End of picture text -----**<br>


## **6 Revision history** 

**==> picture [151 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Table 7: Document revision history<br>**----- End of picture text -----**<br>


|**Date**|**Revision**|**Changes**|
|---|---|---|
|08-Nov-2016|1|Initial release.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2016 STMicroelectronics – All rights reserved 

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- [Supplier page](https://es.farnell.com/en-ES/stmicroelectronics/ecmf4-2450a17m10/common-mode-filters-esd-uqfn-10/dp/2723329)
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