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ECMF06-6HSM16
Special Function IC, Common Mode Filters with ESD Protection, 100 mA DC, µQFN-16
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- Manufacturer: STMICROELECTRONICS
- Product type: Integrated Passive Filters
- No. of Pins: 16Pins
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- Filter Case Style: µQFN
- No. of Data Lines: 6 Data Lines
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.169 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **ECMF06-6HSM16**
## Common mode filter with ESD protection for high speed serial interface
**Datasheet** - **production data**
## **Features**
- Very large differential bandwidth to comply with HDMI Full HD, MIPI, USB2.0, USB3.0, Display Port and other high speed serial interfaces
- Provides -20 dB attenuation at 700 MHz in LTE bands
- High common mode attenuation: -25 dB between 800 MHz - 900 MHz
- Very low PCB space consumption
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µQFN-16L 4.10 x 1.35 mm<br>**----- End of picture text -----**<br>
- Thin package: 0.55 mm max.
- Lead-free package
- High reduction of parasitic elements through integration.
## **Figure 1. Pin configuration (top view)**
## **Complies with the following standards:**
- IEC 61000-4-2 level 4:
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D1+ 1 16 D1+<br>D1- 2 15 D1-<br>GND 3 14 GND<br>D2+ 4 13 D2+<br>D2- 5 12 D2-<br>GND 6 11 GND<br>D2+ a 7 10 D2+<br>D2- 8 9 D2-<br>eS<br>**----- End of picture text -----**<br>
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
## **Applications**
- Mobile phones
- Notebook, laptop
- Portable devices
- PND
## **Description**
This device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI Full HD, MIPI, Display Port and other high speed serial interfaces.The device has a very large differential bandwidth to comply with these standards. The device can protect and filter 3 differential lanes.
August 2014 This is information on a product in full production.
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_www.st.com_
**Characteristics**
**ECMF06-6HSM16**
## **1 Characteristics**
**Table 1. Absolute maximum ratings (Tamb = 25 °C)**
|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage|IEC 61000-4-2<br>Contact discharge (connector side)<br>Air discharge (connector side)|8<br>16|kV|
|IDC|Maximum DC current||100|mA|
|Top|Operating temperature range||-40 to +85|°C|
|Tj|Maximum junction temperature||125|°C|
|Tstg|Storage temperature range||- 55 to +150|°C|
**Figure 2. Electrical characteristics (definitions)**
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I<br>Symbol Parameter<br>VBR = Breakdown voltage<br>IRM = Leakage current @ VRM<br>VRM = Stand-off voltage<br>IR = Breakdown current VBR VRM V<br>IRM<br>IR<br>**----- End of picture text -----**<br>
**Table 2. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|6|||V|
|IRM|VRM= 3 V per line|||100|nA|
|RDC|DC serial resistance||5||Ω|
**Table 3. Pin description**
|**Pin**<br>**number**|**Description**|**Pin**<br>**number**|**Description**|**Pin**<br>**number**|**Description**|**Pin**<br>**number**|**Description**|
|---|---|---|---|---|---|---|---|
|1|D1+<br>to connector|5|D2-<br>to connector|9|D3-<br>to IC|13|D2+<br>to IC|
|2|D1-<br>to connector|6|GND|10|D3+<br>to IC|14|GND|
|3|GND|7|D3+<br>to connector|11|GND|15|D1-<br>to IC|
|4|D2+<br>to connector|8|D3-<br>to connector|12|D2-<br>to IC|16|D1+<br>to IC|
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**Characteristics**
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Figure 3. Differential attenuation versus frequency (Z0 diff = 100 Ω )<br>SDD21 (dB)<br>0<br>-1<br>-2<br>-3<br>-4<br>F (Hz)<br>-5<br>10M 30M 100M 300M 1G 3G<br>F/Hz<br>Lane #1 Lane #2<br>**----- End of picture text -----**<br>
**Figure 4. Common mode attenuation versus frequency (Z0 com = 50** Ω **)**
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SCC21 (dB)<br>0<br>-5<br>-10<br>-15<br>-20<br>-25<br>-30<br>-35<br>F (Hz)<br>-40<br>10M 30M 100M 300M 1G 3G<br>Lane #1 Lane #2<br>**----- End of picture text -----**<br>
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**Characteristics**
**ECMF06-6HSM16**
**Figure 5. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency**
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ZDD21 1E4 |<br>{<br>ZCC21 i|<br>| |<br>(Ω) 1E3 om | |}<br>|<br>|<br>|<br>|<br>|<br>1E2<br>!<br>|<br>|<br>|<br>1E1<br>|<br>| F<br>———|| | (Hz)<br>1E7 1E8 1E9 6E9<br>**----- End of picture text -----**<br>
**Figure 6. ESD response to IEC61000-4-2 (+8 kV contact discharge)**
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20 V/div<br>T 1 T 1<br>| | if | e 1 VPP: ESD peak voltage<br>| | ‘@ 2 VCL :clamping voltage @ 30 ns<br>{ i@ 3 VCL :clamping voltage @ 60 ns<br>ii@ 4 VCL :clamping voltage @ 100 ns<br>I| i |<br>|:ii Tii<br>1 70.5 V<br>ourreul @ I | if | ae :<br>:i|i<br>| 2 26.4 V I 3 18.9 V T | 4 11.9 V<br>I|I|<br>|| | |<br>iets :I Ht syst | es} es / aheree<br>} Leseail' tant A‘ T :‘<br>kdl Lalas 1 1 T 1 i<br>\ | T | 20 ns/div<br>**----- End of picture text -----**<br>
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**Characteristics**
**Figure 7. ESD response to IEC61000-4-2 (-8 kV contact discharge)**
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20 V/div<br>' 1<br>7 " | |<br>: : nnn<br>eens Senpennen apy ene en Tg ore paring igaliiitas\ Maa Aiea alle Gn ited Da<br>meat eae "4 anetee nee ee ee<br>|<br>|<br>OUTPUT. 2 -15.3 V i i<br>3 -9.3 V 4 -4.3 V<br>}<br>e<br>l 1 -74.6 V<br>l me<br>||<br>e 1 VPP: ESD peak voltage<br>| || e@ 2 VCL :clamping voltage @ 30 ns<br>bo | e@ 3 VCL :clamping voltage @ 60 ns<br>@ 4 VCL :clamping voltage @ 100 ns<br>|!:<br>|| | 20 ns/div<br>**----- End of picture text -----**<br>
**Figure 8. USB2.0 480 Mbps eye diagram without device**
**Figure 9. USB2.0 480 Mbps eye diagram with device**
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**Characteristics**
**ECMF06-6HSM16**
**Figure 10. USB3.0 5 Gbps eye diagram without device**
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Thru<br>250 mV/c<br>33.4 ps/c<br>**----- End of picture text -----**<br>
**Figure 12. HDMI 3.35 Gbps eye diagram without device**
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Thru<br>**----- End of picture text -----**<br>
**Figure 11. USB3.0 5 Gbps eye diagram with device**
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ECMF06-6HSM16 250 mV/c<br>**----- End of picture text -----**<br>
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33.4 ps/c<br>**----- End of picture text -----**<br>
**Figure 13. HDMI 3.35 Gbps eye diagram with device**
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ECMF06-6HSM16<br>**----- End of picture text -----**<br>
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**ECMF06-6HSM16**
**Characteristics**
## **Figure 14. TDR**
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Z (ohm)<br>130<br>120 Before compensation<br>HDMI template<br>110<br>100 After compensation<br>90<br>80<br>time (ns)<br>70<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4<br>**----- End of picture text -----**<br>
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**Application information**
## **2 Application information**
## **Figure 15. HDMI schematic**
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ECMF06<br>mobile I industry D0<br>processor interface<br>D1<br>MIPI transceiver Application baseband<br>DOP DOP D2<br>e~, DON Cesc DON<br>GNDD1P Py CL GNDD1P Clock ECMF02<br>D1N Poe D1N<br>GND GND NC<br>CLKP CLKP<br>CLKP = CLKP =<br>—_= Tt 7<br>i<br>SDA HDP_IC<br>SCL SDA_IC<br>GND GND SCL_IC<br>CEC CEC_IC<br>VDD_CEC FAULT<br>HDMI2C1-6C1<br>HDMI connector HDMI ASIC<br>HPD UTILITY HEAC+ HEAC-<br>5V_OUT VDD_5V VDD_CFC_IC VDD_IC<br>**----- End of picture text -----**<br>
More application information available in following AN:
- Application Note AN4356: "Antenna desense on handheld equipment"
- Application Note AN4511: "Common Mode filters"
- Application Note AN4540: "MHL link filtering and protection"
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**PCB layout recommendations**
## **3 PCB layout recommendations**
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Figure 16. PCB layout recommendations<br>**----- End of picture text -----**<br>
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Connector Host<br>Pad layout 5000 µm<br>350 µm<br>150 µm<br>350 µm<br>Differential<br>lanes<br>(Z0 = 100 )<br>330 µm<br>Differential<br>lanes<br>(Z0 = 100 )<br>Figure 17. PCB stack dimensions<br>40 µm<br>105 µm<br>ε r [= 4.28]<br>170 µm<br>170 µm<br>**----- End of picture text -----**<br>
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**ECMF06-6HSM16**
**Package information**
## **4 Package information**
- Epoxy meets UL94, V0
- Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark.
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Figure 18. µQFN-16L dimension definitions<br>Top view<br>D<br>Idex area<br>E<br>Side view<br>A1<br>A<br>Bottom view<br>e b<br>1 8<br>PIN # 1 ID<br>L<br>16 9<br>**----- End of picture text -----**<br>
**Table 4. µQFN-16L dimension values**
||**Table 4.µQFN-16L dimension values**|**Table 4.µQFN-16L dimension values**|**Table 4.µQFN-16L dimension values**|**Table 4.µQFN-16L dimension values**|**Table 4.µQFN-16L dimension values**|**Table 4.µQFN-16L dimension values**|
|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.45|0.50|0.55|0.018|0.020|0.022|
|A1|0.00|0.02|0.05|0.00|0.0008|0.002|
|b|0.15|0.20|0.25|0.006|0.008|0.010|
|D||4.10|||0.161||
|E||1.35|||0.053||
|e||0.50|||0.020||
|L|0.40|0.50|0.60|0.016|0.020|0.024|
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**Package information**
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Figure 19. Footprint Figure 20. Marking<br>Dot : Pin 1 Identification<br>X X= Marking<br>WW= DataCode (week)<br>0.20<br>Y=Data code(Year) XX<br>0.70 P=Assembly plant<br>0.35 WW<br>0.50 YP<br>**----- End of picture text -----**<br>
## **Figure 21. Tape and reel specifications**
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Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.25<br>1.60 4.0<br>0.75<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>4.35 5.5<br>12.0<br>**----- End of picture text -----**<br>
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**Ordering information**
**ECMF06-6HSM16**
## **5 Ordering information**
## **Figure 22. Ordering information scheme**
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ECMF 06 - 6 HS M16<br>Function<br>Common mode filter with ESD protection<br>Number of lines<br>06 = 6 filtered lines<br>Number of ESD protected lines<br>6 lines with ESD protection<br>Version<br>HS = High speed<br>Package<br>M16 = µQFN-16L<br>**----- End of picture text -----**<br>
**Table 5. Ordering information**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF06-6HSM16|KL|µQFN-16L|7.76 mg|3000|Tape and reel|
## **6 Revision history**
**Table 6. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|03-Oct-2013|1|Initial release.|
|25-Aug-2014|2|Added_Figure 5: Differential (ZDD21) and common mode (ZCC21)_<br>_impedance versus frequency_.|
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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY**
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2014 STMicroelectronics – All rights reserved
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Updated at February 9, 2023
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