EA5070CAS-8.000M TR

## **EA5070CAS-8.000M** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Sep 22, 2020)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

Quartz Crystal Resonator 5.0mm x 7.0mm x 1.3mm 4 Pad Ceramic Surface Mount (SMD) 8.000MHz ±50ppm at 25°C, ±100ppm over -40°C to +85°C Series Resonant 

## **ELECTRICAL SPECIFICATIONS** 

|**Nominal Frequency**|8.000MHz|
|---|---|
|**Frequency Tolerance/Stability**|±50ppm at 25°C, ±100ppm over -40°C to +85°C|
|**Aging at 25°C**|±3ppm/year Maximum|
|**Load Capacitance**|Series Resonant|
|**Shunt Capacitance**|7pF Maximum|
|**Equivalent Series Resistance**|90 Ohms Maximum|
|**Mode of Operation**|AT-Cut Fundamental|
|**Drive Level**|50µWatts Maximum|
|**Spurious Response**|-3dB Minimum (Measured from Fo to Fo +5000ppm)|
|**Storage Temperature Range**|-40°C to +85°C|
|**Insulation Resistance**|500 Megaohms Minimum(Measured at 100Vdc)|
|||
|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**||
|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition B|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision B 12/01/2015 |  Page 1 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EA5070CAS-8.000M** smn 

## **MECHANICAL DIMENSIONS (all dimensions in millimeters)** 

**PIN CONNECTION** 1 Crystal 2 Cover/Ground 3 Crystal 

5.00 2.54 ±0.20 ±0.15 1.2 ±0.1 1 Crystal (x4) 2 Cover/Ground 4 1 3 Crystal 4 Cover/Ground 7.00 4.6 ±0.15 ±0.2 **LINE MARKING** 1 **E8.000** _E=Ecliptek Designator_ 3 2 ~~Ut~~ 2 **XXXXX** _XXXXX=Ecliptek_ 1.3 MAX 1.0 ±0.2 _Manufacturing Identifier_ ~~(LI~~ (x4) G ~~a +—~~ Note: Chamfer and index mark not shown. 

**Terminal Plating Thickness:** Gold (0.3 to 1.0µm). Nickel (1.27 to 8.89µm). 

## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

**==> picture [157 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
t 1.40 (x4) p<br>2.20 (X4)<br>3.60 a2 Solder Land<br>“ Eo (X4)<br>1.10 + b<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision B 12/01/2015 |  Page 2 of 4** a~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EA5070CAS-8.000M** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperature shown are applied to bodyof device.|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision B 12/01/2015 |  Page 3 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EA5070CAS-8.000M** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 245°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|30 - 60 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|245°C Maximum|
|**Target Peak Temperature(TP Target)**|245°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperature shown are applied to bodyof device.|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision B 12/01/2015 |  Page 4 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200