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E8WSDC12-32.768K TR
Crystal, ECS-2X6-FLX Series
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: ECLIPTEK
- Product type: Resonators
- Available until stocks are exhausted
- SVHC: No SVHC (25-Jun-2025)
- Frequency: 32.768kHz
- No. of Pins: 2Pins
- Product Range: ECS-2X6-FLX Series
- Frequency Stability: -
- Frequency Tolerance: ± 20ppm
- Oscillator Mounting: SMD
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 1.34 € |
| Current stock | 1000+ |
| Lead time | 7 days |
## **E8WSDC12-32.768K TR** PART NUMBER DATA SHEET ## **REGULATORY COMPLIANCE** ## **(Data Sheet downloaded on Dec 15, 2019)** 2011/65 + 2015/863 iy 191 SVHC ## **ITEM DESCRIPTION** Watch Crystal Resonator 1.5mm x 3.2mm x 0.9mm 2 Pad Ceramic Surface Mount (SMD) 32.768KHz ±20ppm at 25°C -40°C to +85°C 12.5pF Parallel Resonant ## **ELECTRICAL SPECIFICATIONS** |**Nominal Frequency**|32.768KHz| |---|---| |**Frequency Tolerance**|±20ppm at 25°C| |**Frequency Stability Temperature**|-0.04ppm/(Change in °C)² Maximum| |**Coefficient**|| |**Turn over Temperature**|25°C ±5°C| |**Aging at 25°C**|±3ppm/year Maximum| |**Operating Temperature Range**|-40°C to +85°C| |**Load Capacitance**|12.5pF Parallel Resonant| |**Shunt Capacitance**|1.0pF Typical, 1.5pF Maximum| |**Motional Capacitance**|4.0fF Typical| |**Equivalent Series Resistance**|70,000 Ohms Maximum| |**Mode of Operation**|Fundamental| |**Drive Level**|0.5µWatt Maximum| |**Crystal Cut**|Tuning Fork| |**Storage Temperature Range**|-40°C to +85°C| |**Insulation Resistance**|500 Megaohms Minimum(Measured at 100Vdc)| |**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**| |---|---| |**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A| |**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C| |**Mechanical Shock**|MIL-STD-202, Method 213, Condition C| |**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K| |**Solderability**|MIL-STD-883, Method 2003| |**Vibration**|MIL-STD-883, Method 2007, Condition A| ~~**www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 01/19/2017 | Page 1 of 5**~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 ## **E8WSDC12-32.768K TR** **==> picture [533 x 157] intentionally omitted <==** **----- Start of picture text -----**<br> MECHANICAL DIMENSIONS (all dimensions in millimeters)<br>PIN CONNECTION<br>1.5<br>0.75 1 Crystal<br>±0.1<br>±0.10 2 Crystal<br>1 (X2)<br>LINE MARKING<br>i: i — 1 XXXXXXXX<br>3.2 1.7<br>XXXXXXXX=Ecliptek<br>±0.1 ±0.1 Manufacturing Identifier (8<br>Characters Maximum)<br>2<br>\ i JT<br>0.9 MAX |b |__|<br>MARKING<br>ORIENTATION<br>**----- End of picture text -----**<br> ## **Seam Sealed** **Terminal Plating Thickness:** Gold (0.3 to 1.0µm) over Nickel (3.0 to 4.0µm). ## **Suggested Solder Pad Layout** All Dimensions in Millimeters **==> picture [164 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> 1.80 (X2) TF<br>Solder Land<br>(X2)<br>a ne<br>1.50<br>oo _<br>1.00 (X2)<br>on 4<br>**----- End of picture text -----**<br> All Tolerances are ±0.1 ~~**www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 01/19/2017 | Page 2 of 5** Lo~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET ## **E8WSDC12-32.768K TR** **==> picture [112 x 39] intentionally omitted <==** ## Tape & Reel Dimensions Quantity Per Reel: 3,000 units **==> picture [513 x 608] intentionally omitted <==** **----- Start of picture text -----**<br> All Dimensions in Millimeters<br>Compliant to EIA-481<br>4.00 ±0.10 0.60 MAX<br>DIA 1.50 +0.10/-0.00<br>2.00 ±0.05 0.10 MAX<br>1.75 ±0.10<br>5.50 ±0.05<br>12.00 ±0.30 B0<br>DIA 1.50 MIN<br>4.00 ±0.10 A0 K0<br>Direction of Unreeling<br>1.50 MIN 18.40 MAX<br>DIA 40 MIN<br>Access Hole at<br>Slot Location<br>180 MAX<br>DIA 50 MIN<br>2.50 MIN Width<br>10 MIN Depth<br>DIA 20.20 MIN<br>Tape slot in Core<br>for Tape Start<br>12.40 +2.00/-0.00<br>DIA 13.00 ±0.20<br>**----- End of picture text -----**<br> ~~**www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 01/19/2017 | Page 3 of 5**~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 ## PART NUMBER DATA SHEET **E8WSDC12-32.768K TR** ## **Recommended Solder Reflow Methods** ## **High Temperature Infrared/Convection** |**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum| |---|---| |**Preheat**|| |**- Temperature Minimum (TS MIN)**|150°C| |**- Temperature Typical (TS TYP)**|175°C| |**- Temperature Maximum (TS MAX)**|200°C| |**- Time(tS MIN)**|60 - 180 Seconds| |**Ramp-up Rate(TL to TP)**|3°C/Second Maximum| |**Time Maintained Above:**|| |**- Temperature (TL)**|217°C| |**- Time(tL)**|60 - 150 Seconds| |**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum| |**Target Peak Temperature(TP Target)**|250°C +0/-5°C| |**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds| |**Ramp-down Rate**|6°C/Second Maximum| |**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum| |**Moisture Sensitivity Level**|Level 1| |**Additional Notes**|Temperatures shown are applied to bodyof device.| ~~**www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 01/19/2017 | Page 4 of 5**~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 ## PART NUMBER DATA SHEET **E8WSDC12-32.768K TR** ## **Recommended Solder Reflow Methods** ## **Low Temperature Infrared/Convection 245°C** |**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum| |---|---| |**Preheat**|| |**- Temperature Minimum (TS MIN)**|N/A| |**- Temperature Typical (TS TYP)**|150°C| |**- Temperature Maximum (TS MAX)**|N/A| |**- Time(tS MIN)**|30 - 60 Seconds| |**Ramp-up Rate(TL to TP)**|5°C/Second Maximum| |**Time Maintained Above:**|| |**- Temperature (TL)**|150°C| |**- Time(tL)**|200 Seconds Maximum| |**Peak Temperature(TP)**|245°C Maximum| |**Target Peak Temperature(TP Target)**|245°C Maximum 2 Times / 230°C Maximum 1 Time| |**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time| |**Ramp-down Rate**|5°C/Second Maximum| |**Time 25°C to Peak Temperature(t)**|N/A| |**Moisture Sensitivity Level**|Level 1| |**Additional Notes**|Temperatures shown are applied to bodyof device.| ## **Low Temperature Manual Soldering** 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) ## **High Temperature Manual Soldering** 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) ~~**www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 01/19/2017 | Page 5 of 5**~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
Updated at March 21, 2026
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