# Power MOSFET, N Channel, 40 V, 100 A, 1400 µohm, PowerDI 5060, Surface Mount

![Product image](https://novapart.co/image/farnell:3943909RL/)

**URL**: https://novapart.co/products/DMTH41M8SPSQ-13/power-mosfet-n-channel-40-v-100-a-1400-ohm-powerdi
**SKU**: DMTH41M8SPSQ-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.7430
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 3.03W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerDI 5060 |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 1400µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943909RL/)

**DMTH41M8SPSQ** ~~®~~ **Green** Tl **40V +175°C N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI5060-8** 

## **Product Summary** 

|**BVDSS**|**RDS(ON)max**|**ID **<br>**TC = +25°C**<br>**(Note 10)**|
|---|---|---|
|40V|1.8mΩ@VGS= 10V|100A|



## **Features** 

- Rated to +175°C – Ideal for High Ambient Temperature Environments 

- 100% Unclamped Inductive Switching (UIS) Test in Production – Ensures More Reliable and Robust End Application 

- Thermally Efficient Package-Cooler Running Applications 

- High Conversion Efficiency 

- Low RDS(ON) – Minimizes On State Losses 

- <1.1mm Package Profile – Ideal for Thin Applications 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

- **PPAP Capable (Note 4)** 

## **Description and Applications** 

This MOSFET is designed to meet the stringent requirements of Automotive applications. It is qualified to AEC-Q101, supported by a PPAP and is ideal for use in: 

## **Mechanical Data** 

      - Case: PowerDI[®] 5060-8 

   - 

   - Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Engine Management Systems 

- Body Control Electronics 

- DC-DC Converters 

- Terminal Finish - Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

   - Weight: 0.097 grams (Approximate) 

 

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PowerDI5060-8 (Type K)  S D<br>S D<br>S D<br>G D<br>@< Pin1  ©<br>Top View<br>Top View  Bottom View  Internal Schematic  Pin Configuration<br> Information (Note 5)<br>Part Number Case Packaging<br>DMTH41M8SPSQ-13  PowerDI5060-8 (Type K) 2,500 / Tape & Reel<br>**----- End of picture text -----**<br>


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PowerDI5060-8 (Type K)<br>@< Pin1  ©<br>Top View  Bottom View  Internal Schematic<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 5) 

- Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 

   2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to https://www.diodes.com/quality/. 

   5. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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D D D D<br>TH41M8SS<br>YY WW<br>S S S G<br>**----- End of picture text -----**<br>


= Manufacturer’s Marking TH41M8SS = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 19 = 2019) WW = Week Code (01 to 53) 

_PowerDI is a registered trademark of Diodes Incorporated._ 

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DMTH41M8SPSQ Document number: DS39940  Rev. 4 - 2 

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**DMTH41M8SPSQ** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage||VDSS|40|V|
|Gate-Source Voltage||VGSS|±20|V|
|Continuous Drain Current, VGS= 10V (Notes 7 & 10)|TC= +25°C<br>TC= +100°C|ID|100<br>100|A|
|Pulsed Drain Current(10μs Pulse,DutyCycle = 1%)||IDM|400|A|
|Pulsed BodyDiode Forward Current(10μs Pulse,DutyCycle = 1%)||ISM|400|A|
|Continuous BodyDiode Forward Current(Note 7)|TC= +25°C|IS|100|A|
|Avalanche Current,L = 0.1mH||IAS|72.8|A|
|Avalanche Energy,L = 0.1mH||EAS|265|mJ|



## **Thermal Characteristics** 

|**Thermal Characteristics**|**Thermal Characteristics**|**Thermal Characteristics**|**Thermal Characteristics**|
|---|---|---|---|
|||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Total Power Dissipation(Note 6)|PD|3.03|W|
|Thermal Resistance,Junction to Ambient(Note 6)|RJA|49|°C/W|
|Total Power Dissipation(Note 7)|PD|150|W|
|Thermal Resistance,Junction to Case(Note 7)|RJC|1.0|°C/W|
|Operatingand Storage Temperature Range|TJ,TSTG|-55 to +175|°C|



**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|---|
||||||||
|**Characteristic**<br>~~—————————————~~|**Symbol**<br>~~—————————————~~|**Min**<br>~~—————————————~~|**Typ**<br>~~—————————————~~|**Max**<br>~~—————————————~~|**Unit**<br>~~—————————————~~|**Test Condition**<br>~~—————————————~~|
|**OFF CHARACTERISTICS(Note 8)**<br>~~—————————————~~|||||||
|Drain-Source Breakdown Voltage<br>~~—————————————~~|BVDSS<br>~~—————————————~~|40<br>~~—————————————~~|—<br>~~—————————————~~|—<br>~~—————————————~~|V<br>~~—————————————~~|VGS= 0V,ID= 250µA<br>~~—————————————~~|
|Zero Gate Voltage Drain Current<br>~~—————————————~~|IDSS<br>~~—————————————~~|—<br>~~—————————————~~<br>~~(OO~~|—<br>~~—————————————~~<br>~~(OO~~|1<br>~~—————————————~~<br>~~GO~~|µA<br>~~—————————————~~<br>~~GO~~|VDS= 32V,VGS= 0V<br>~~—————————————~~|
|Gate-Source Leakage<br>~~I~~|IGSS<br>~~I~~|—<br>~~I~~<br>~~(OO~~|—<br>~~I~~<br>~~(OO~~|±100<br>~~I~~<br>~~GO~~|nA<br>~~I~~<br>~~GO~~|VGS= ±20V,VDS= 0V<br>~~I~~|
|**ON CHARACTERISTICS(Note 8)**<br>~~(OO~~<br>~~GO~~<br>~~ee~~<br>~~——~~|||||||
|Gate Threshold Voltage<br>~~ee~~<br>~~——~~|VGS(TH)<br>~~ee~~<br>|2<br>~~ee~~<br>|—<br>~~ee~~<br>|4<br>~~ee~~<br>|V<br>~~ee~~<br>|VDS= VGS,ID= 250µA<br>~~ee~~<br>|
|Static Drain-Source On-Resistance<br>~~——~~|RDS(ON)<br>|—<br>|1.4<br>|1.8<br>|mΩ<br>|VGS= 10V,ID= 30A<br>|
|Diode Forward Voltage<br>~~——~~|VSD<br>|—<br>|0.8<br>|1.2<br>|V<br>|VGS= 0V,IS= 20A<br>|
|**DYNAMIC CHARACTERISTICS(Note 9)**<br>~~——~~<br>~~eeeeeseeee~~|||||||
|Input Capacitance<br>~~es~~|Ciss<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|6968<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~ee~~|pF<br>~~es~~<br>~~ee~~|VDS= 20V, VGS= 0V,<br>f = 1MHz<br>~~es~~|
|Output Capacitance<br>~~es~~|Coss<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|1812<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~ee~~|||
|Reverse Transfer Capacitance<br>~~es~~|Crss<br>~~es~~<br>~~ee~~|—<br>~~es~~<br>~~ee~~|59<br>~~es~~<br>~~es~~|—<br>~~es~~<br>~~ee~~|||
|Gate Resistance|RG<br>~~ee ~~|—<br> ~~ee ~~|1.21<br> ~~es ~~|—<br> ~~ee ~~|Ω<br> ~~ee~~|VDS= 0V,VGS= 0V,f = 1MHz|
|Total Gate Charge<br>~~Ss~~|Qg|—|79.5|—|nC<br>~~oe~~|VDD= 20V, ID= 90A,<br>VGS= 10V<br>~~—~~<br>~~ee~~|
|Gate-Source Charge<br>~~Ss~~|Qgs|—|20.6|—|||
|Gate-Drain Charge<br>~~Ss~~<br>~~——~~|Qgd|—|16.5<br>~~oe~~|—<br>~~oe~~|||
|Turn-On DelayTime<br>~~Ss~~<br>~~——~~|tD(ON)|—|13.3<br>~~oe~~|—<br>~~oe~~|ns<br>~~oe~~<br>~~eee~~|VDD= 20V, VGS= 10V,<br>ID= 90A, RG= 3.5Ω<br>~~—~~<br>~~ee~~<br>~~eee~~|
|Turn-On Rise Time<br>~~Ss~~<br>~~——~~|tR|—|41.3<br>~~oe~~|—<br>~~oe~~|||
|Turn-Off DelayTime<br>~~Ss~~<br>~~——~~|tD(OFF)|—|35.1<br>~~oe~~|—<br>~~oe~~|||
|Turn-Off Fall Time<br>~~——~~<br>~~=~~|tF|—|13.7<br>~~oe~~|—<br>~~oe~~|||
|Reverse RecoveryTime<br>~~——~~<br>~~=~~|tRR|—|62<br>~~oe~~|—<br>~~oe~~|ns<br>~~oe~~<br>~~eee~~|IF= 50A, di/dt = 100A/μs<br> ~~ee~~<br>~~eee~~|
|Reverse RecoveryCharge<br>~~——~~<br>~~=~~|QRR|—|103<br>~~oe~~|—<br>~~oe~~|nC<br>~~oe ~~<br>~~eee~~||



7. Thermal resistance from junction to soldering point (on the exposed drain pad). 

8. Short duration pulse test used to minimize self-heating effect. 

9. Guaranteed by design. Not subject to product testing. 

10. Limited by package. 

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50.0   30<br> VGS = 4.5V  VDS = 5.0V<br>| 25  e ee<br>40.0    VGS = 10V<br>20<br>30.0   po o! || ee<br> VGS = 4.2V  15  ee |<br>20.0   | ee TJ = 175 ℃ e<br>10<br>TJ = 150 ℃<br>10.0    VGS = 4.0V  TJ = 125 ℃<br>5<br>TJ = 85 ℃<br> VGS = 3.8V  TJ = 25 ℃ TJ = -55 ℃<br>{_ -— By<br>0.0   0<br>0  0.5  1  1.5  2  2.5  3  1  2  3  4  5<br>VDS, DRAIN-SOURCE VOLTAGE (V)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic  Figure 2. Typical Transfer Characteristic<br>2.0   5<br>1.8<br>4<br>1.6<br>1.4<br> VGS = 10V  3<br>1.2<br>2<br>1.0<br>0.8<br>1  ID = 30A<br>0.6<br>0.4   0<br>0  20  40  60  80  100  2  4  6  8  10<br>ID, DRAIN-SOURCE CURRENT (A)   VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>3  2<br>2.8  VGS = 10V  TJ = 150 ℃ TJ = 175 ℃ 1.8<br>2.6<br>2.4  1.6<br>2.2  ae Ae<br>2  TJ = 125 ℃ 1.4<br>1.8  P eete 1.2<br>TJ = 85 ℃<br>1.6<br>1<br>1.4<br>TJ = 25 ℃<br>1.2  S SS 0.8  Oe  VGS = 10V, ID = 30A<br>1  TJ = -55 ℃<br>0.6<br>0.8  e e Acc<br>0.6  Se 0.4  Pi} Tee}<br>0  5  10  15  20  25  30  -50  -25  0  25  50  75  100 125 150 175<br>ID, DRAIN CURRENT (A)  TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Temperature<br>Temperature<br>, DRAIN CURRENT (A) ID , DRAIN CURRENT (A) ID<br>(mΩ)  (mΩ)<br>, DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>(mΩ)<br>(NORMALIZED)<br>,  DRAIN-SOURCE ON-RESISTANCE  , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON) DS(ON)<br>R R<br>**----- End of picture text -----**<br>


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3  4<br>3.5<br>2.5<br>y 3  SERRE<br>2.5  ~~ ID = 1mA  an<br>2<br>2<br>1.5  ID = 250μA<br>1.5<br>TUT) = A EAP Re<br>a oe<br>1<br>1   VGS = 10V, ID = 30A<br>0.5<br>ae Ts<br>0.5  0<br>-50 -25  0  25  50  75  100 125 150 175  -50  -25  0  25  50  75  100 125 150 175<br>TJ, JUNCTION TEMPERATURE ( ℃ )  TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Temperature  Figure 8. Gate Threshold Variation vs. Junction<br>Temperature<br>30  100000<br>f = 1MHz<br>25  ee oe Ciss<br>10000   ===ee eee=a<br>20<br>1000   Coss<br>15  eee pbb<br>100<br>10  | TJ = 175 ℃ ~ TJ = 85 ℃ S e Crss  eoS<br>TJ = 150 ℃ 10<br>5  TJ = 25 ℃<br>TJ = 125 ℃<br>TJ = -55 ℃<br>0  — DI}HEL Z IN) 1   _ a<br>0  0.3  0.6  0.9  1.2  0  5  10  15  20  25  30  35  40<br>VSD, SOURCE-DRAIN VOLTAGE (V)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current  Figure 10. Typical Junction Capacitance<br>10  1000<br>R<br>DS(ON)<br>Limited<br>8  eR NEPSAA J<br>100<br>r | 7 | AN LUZ IN EE<br>6  PW = 1µs<br>|| “SKN AN anil<br>10  PW = 10µs<br>4  VDS = 20V, ID = 90A  PW = 100µs<br>PW = 1ms<br>1  TTJ(Max) C = 25= 175 ℃ ℃ ieee i PW = 10ms  ANDZN BE Tl<br>2  Single Pulse  PW<br>DUT on Infinite<br>Heatsink  EHHee DC  | 7PT<br>VGS = 10V  ll<br>0  0.1<br>0  20  40  60  80  0.1  1  10  100<br>Qg (nC)  VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge  Figure 12. SOA, Safe Operation Area<br>, GATE THRESHOLD VOLTAGE (V)<br>, DRAIN-SOURCE ON-RESISTANCE (mΩ)<br>GS(TH)<br>DS(ON) V<br>R<br>, SOURCE CURRENT (A)<br>IS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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120.00<br>VGS = 10V<br>100.00<br>80.00<br>60.00<br>40.00<br>20.00<br>0.00<br>0  25  50  75  100  125  150  175  200<br>TC, CASE TEMPERATURE ( ℃ )<br>Figure 13. Current De-rating<br>1<br>e D=0.7  ee<br>D=0.5<br>bo HR te eH Rt<br>D=0.9<br>D=0.3<br>TIT EAA. CTT TTT<br>HE HEHE epee | | el<br>0.1  NE [ee] Tm L EEEE EAI<br>D=0.1<br>e T<br>D=0.05  [TTT] Hh<br>Fy [EIA] ee at<br>a gf<br>pf mE LALITEET<br>0.01  OA Ee D=0.02  Nt SST LLANEot EE EEEEt LEIA LL<br>po NY TT<br>| ee TIN<br>P| XUAN<br>PT SAU D=0.01  TTT PT<br>D=0.005  RθJC(t) = r(t) * RθJC<br>RθJC = 1.0 ℃ /W<br>D=Single Pulse  Duty Cycle, D = t1 / t2<br>0.001  Sea a<br>1E-06  1E-05  0.0001  0.001  0.01  0.1  1  10<br>t1, PULSE DURATION TIME (sec)<br>Figure 14. Transient Thermal Resistance<br>CURRENT RATING (A)<br>ID,<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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DMTH41M8SPSQ Document number: DS39940  Rev. 4 - 2 

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**DMTH41M8SPSQ** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI5060-8 (Type K)** 

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D<br>D1 PowerDI5060-8<br>(Type K)<br>0 (4x) Dim  Min  Max  Typ<br>A  0.90 1.10 1.00<br>a x c A1 ——— A1  0 0.05 0.02<br>| - E1 | E f A N| ——es b  0.33 0.51  0.41<br>b1  0.300 0.366 0.333<br>y Seating Plane b2  0.20 0.35 0.25<br>LS C e a c  0.23 0.33 0.277<br>D  5.15 BSC<br>1 Ø 1.000 Depth 0.07± 0.030 0 1(4x) D1 D2  4.- 85 4.- 95 4.3.9098<br>b1(8x) _ oe DETAIL A ———— E  6.15 BSC<br>b(8x) e/2 E1  5.75 5.85 5.80<br>+ ee ee ee<br>1 E2  3.56 3.725 3.66<br>L tir. ===> e  1.27BSC<br>D2 k b2(2x) k  -  -  1.27<br>L  0.51  0.71  0.61<br>feet, Tr La 0.51  0.675 0.61<br>E2 L4 A L1  0.05 0.20 0.175<br>M L4  -  -  0.125<br>al | | es ee ee<br>M  3.50 3.71  3.605<br>DETAIL A x  -  -  1.400<br>y -  -  1.900<br>La L1 θ  10°  12°  11°<br>; SSS= θ1  6°  8°  7°<br>All Dimensions in mm<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**PowerDI5060-8 (Type K)** 

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X2<br>Value<br>Dimensions<br>A a (in mm)<br>Y1 L e I ee C  1.270<br>G  0.660<br>| —— G1  0.8 ee 20<br>X  0.610<br>Y2 —— X1  3.910<br>Y3 ee X2  4.42 ee 0<br>Y  1.270<br>1 ! —— Y1  1.020<br>G1 ae X1 es Y2  3.810<br>Y3 6.610<br>al Y C Lu) X (8x) ————<br>bh G [te<br>**----- End of picture text -----**<br>


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DMTH41M8SPSQ Document number: DS39940  Rev. 4 - 2 

March 2019 © Diodes Incorporated 

**DMTH41M8SPSQ** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2019, Diodes Incorporated 

**www.diodes.com** 

7 of 7 **www.diodes.com** 

DMTH41M8SPSQ Document number: DS39940  Rev. 4 - 2 

March 2019 © Diodes Incorporated 



## Links

- [View this product on Novapart](https://novapart.co/products/DMTH41M8SPSQ-13/power-mosfet-n-channel-40-v-100-a-1400-ohm-powerdi)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/dmth41m8spsq-13/mosfet-n-ch-40v-100a-powerdi-5060/dp/3943909RL)
---

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