# Power MOSFET, N Channel, 100 V, 250 A, 1400 µohm, PowerDI 1012, Surface Mount

![Product image](https://novapart.co/image/farnell:3828447RL/)

**URL**: https://novapart.co/products/DMTH10H1M7STLW-13/power-mosfet-n-channel-100-v-250-a-1400-ohm
**SKU**: DMTH10H1M7STLW-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.0600
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 214W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PowerDI 1012 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 250A |
| Drain Source On State Resistance | 1400µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3828447RL/)

> **Green DMTH10H1M7STLW** ~~@~~ FJ **100V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET POWERDI1012-8 (TOLL)** 

## **Product Summary** 

|~~r~~|~~r~~|~~r~~|
|---|---|---|
|**BVDSS**|**RDS(ON) Max**|**ID **<br>**TC = +25°C**|
|100V|2mΩ @ VGS= 10V|250A|



## **Features** 

- Rated to +175°C – Ideal for High Ambient Temperature Environments 

- 100% Unclamped Inductive Switching (UIS) Test in Production – Ensures More Reliable and Robust End Application 

- High Conversion Efficiency 

- Low RDS(ON) – Minimizes On State Losses 

- Wettable Flank for Improved Optical Inspection 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Description and Applications** 

This new generation N-Channel enhancement mode MOSFET is designed to minimize RDS(ON) yet maintain superior switching performance. This device is ideal for use in notebook battery power management and load switch. 

- **For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative.** 

   - **https://www.diodes.com/quality/product-definitions/** 

- **An Automotive-Compliant Part is Available Under Separate Datasheet ( DMTH10H1M7STLWQ )** 

## **Mechanical Data** 

## **Applications** 

- Motor Control 

- DC-DC Converters 

- Power Management 

- Case: POWERDI[®] 1012-8 (TOLL) 

- Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminal Connections Indicator: See Diagram 

- Terminals: Finish – Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

- Weight: 0.388 grams (Approximate) 

**POWERDI1012-8** 

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D G D<br>S<br>S<br>S D<br>G SS<br>S<br>S D<br>S<br>es Pin1  &<br>Top View<br>Bottom View  Internal Schematic  Pin Configuration<br>g Information Information (Note 4)<br>Part Number Case Packaging<br>DMTH10H1M7STLW-13  POWERDI1012-8  1,500/Tape & Reel<br>**----- End of picture text -----**<br>


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es Pin1<br>Top View  Bottom View<br>**----- End of picture text -----**<br>


## **Ordering Information Information** (Note 4) 

1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 

Notes: 

   2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. 

## **Marking Information** 

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D D D<br>TH10H1M7STL<br>G S S S S S S S<br>WW<br>YY<br>**----- End of picture text -----**<br>


## **PowerDI1012-8** 

= Manufacturer’s Marking TH10H1M7STL = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 21 = 2021) WW = Week Code (01 to 53) 

_POWERDI is a registered trademark of Diodes Incorporated._ 

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**DMTH10H1M7STLW** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

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||||||
|---|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Drain-Source Voltage|VDSS|100|V|
|Gate-Source Voltage|VGSS|±20|V|
|Continuous Drain Current (Note 6) VGS = 10V|TTCC = +100°C  = +25°C|ID|250 176|A|
|Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)|IDM|1000|A|
|Maximum Continuous Body Diode Forward Current (Note 6)|IS|250|A|
|Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)|ISM|1000|A|
|Avalanche Current, L = 0.3mH|IAS|73|A|
|Avalanche Energy, L = 0.3mH|EAS|799.4|mJ|

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## **Thermal Characteristics** 

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||||||
|---|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Total Power Dissipation (Note 5)|TA = +25°C|PD|6|W|
|Thermal Resistance, Junction to Ambient (Note 5)|RθJA|24|°C/W|
|Total Power Dissipation (Note 6)|TC = +25°C|PD|214|W|
|Thermal Resistance, Junction to Case (Note 6)|RθJC|0.6|°C/W|
|Operating and Storage Temperature Range|TJ,|TSTG|-55 to +175|°C|

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**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Cf|Characteristic|Symbol|ff|Min|Typ|Max|Unit|Test Condition|
|OFF CHARACTERISTICS|(Note 7)|
|Drain-Source Breakdown Voltage|BVDSS|100|—|—|V|VGS = 0V, ID = 1mA|
|Zero Gate Voltage Drain Current|IDSS|—|—|1|µA|VDS = 80V, VGS = 0V|
|ee|Gate-Source Leakage|IGSS|—|—|±100|nA|VGS = 20V, VDS = 0V|
|ON CHARACTERISTICS|(Note 7)|
|Gate Threshold Voltage|VGS(TH)|2|—|4|V|VDS = VGS, ID = 250µA|
|Static Drain-Source On-Resistance|RDS(ON)|—|1.4|2|mΩ|VGS = 10V, ID = 30A|
|Diode Forward Voltage|VSD|—|0.8|1.2|V|VGS = 0V, IS = 30A|
|——|
|DYNAMIC CHARACTERISTICS|(Note 8)|
|Input Capacitance|Ciss|—|9871|—|
|Output Capacitance|Coss|—|3019|—|pF|VDS = 50V, VGS = 0V,|
|f = 1MHz|
|————|Reverse Transfer Capacitance|C|es|rss|—|es|58|—|il|
|a|Gate Resistance|Rg|—|2.5|—|Ω|Vf = 1MHz DS = 0V, VGS = 0V,|
|Total Gate Charge|Qg|—|147|—|VDD = 50V, ID = 30A,|
|Gate-Source Charge|Qgs|—|43|—|nC|VGS = 10V|
|————|Gate-Drain Charge|Qgd|—|32|—|
|Turn-On Delay Time|tD(ON)|—|29|—|
|Turn-On Rise Time|tR|—|64|—|VDD = 50V, VGS = 10V,|
|ns|
|Turn-Off Delay Time|tD(OFF)|—|108|—|ID = 30A, Rg = 4.7Ω|
|Turn-Off Fall Time|tF|—|69|—|
|Reverse Recovery Time|tRR|—|91|—|ns|
|——|Reverse Recovery Charge|QRR|—|270|—|nC|IF = 25A, di/dt = 100A/µs|
|es|ee|ee|

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- Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 

   6. Thermal resistance from junction to soldering point (on the exposed drain pad). 

   7. Short duration pulse test used to minimize self-heating effect. 

   8. Guaranteed by design. Not subject to product testing. 

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100.0 30<br>90.0 VGS = 10.0V VDS = 5.0V<br>80.0 ee VGS = 8.0V e 25 ee e |e<br>VGS = 6.0V<br>70.0<br>20<br>60.0 e Me vesoe VGS = 5.0V I<br>50.0 15<br>ACE eee |e<br>40.0<br>10<br>30.0 [oT TJ = 175℃<br>20.0 VGS = 4.0V VGS = 4.3V VGS = 4.5V 5 TTJ = 125J = 150℃℃ TTJJ = 25 = 85℃℃<br>10.0<br>TJ = -55℃<br>0.0 poy 0 DT<br>0 1 2 3 4 5 6<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5<br>VDS, DRAIN-SOURCE VOLTAGE (V) Figure 2. Typical Transfer CharacteristicVGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic<br>2.5 12<br>10<br>2.0<br>8<br>1.5<br>VGS = 10.0V<br>6<br>1.0 ID = 30.0A<br>4<br>0.5<br>2<br>0.0 0<br>10 40 70 100 130 160 4 8 12 16 20<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current  Figure 4. Typical Transfer Characteristic<br>and Gate Voltage<br>2.4<br>4<br>VGS = 10V 2.2<br>3.5 7 7 7]. | | | | | dt |<br>2<br>TJ = 175℃<br>3 Tee 1.8 CEE EEE<br>2.5 TJ = 150℃ 1.6 VGS = 10V, ID = 30A<br>S SS TJ = 125℃ 1.4 Fe<br>2<br>TJ = 85℃ 1.2<br>1.5 — —— — ae ane<br>—— TJ = 25℃ 1 | | |pet<br>1 0.8<br>TJ = -55℃<br>0.5 A SS T 0.6 BEC EEE|<br>0.4<br>0 Pot | | ft dL -50 Pt -25 tT 0 25 | 50 | 75 tT 100 | 125 tT 150 175<br>0 5 10 15 20 25 30<br>ID, DRAIN CURRENT (A) Figure 6. On-Resistance Variation with TemperatureTJ, JUNCTION TEMPERATURE (℃)<br>, DRAIN CURRENT (A)ID , DRAIN CURRENT (A)ID<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON)<br>DS(ON) R<br>R<br>(NORMALIZED)<br>,  DRAIN-SOURCE ON-RESISTANCE (Ω) , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


Figure 5. Typical On-Resistance vs. Drain Current and Temperature 

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4.0<br>3.5<br>TT LELLLL LELLLL<br>3.0<br>COEE EEE EEE<br>2.5<br>CCCC<br>2.0 VGS = 10V, ID = 30AGS = 10V, ID = 30A= 10V, ID = 30AD = 30A= 30A<br>1.5<br>CT e r<br>1.00.50.0<br>0.50.0 acces<br>0.0 CCEEE EEE EEE<br>-50 -25 0 25 50 75 100 125 150 175<br>TJ, JUNCTION TEMPERATURE (℃)J, JUNCTION TEMPERATURE (℃), JUNCTION TEMPERATURE (℃)℃))<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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4.0 4<br>3.5 3.5<br>TT LELLLL LELLLL C o e<br>ID = 1mA<br>3.0 3<br>COEE EEE EEE Se<br>2.5 2.5<br>CCCC oS<br>2.0 VGS = 10V, ID = 30AGS = 10V, ID = 30A= 10V, ID = 30AD = 30A= 30A 2 ID = 250μA<br>1.5 CT e r 1.5 Po G<br>1.00.50.0 acces CCEEE EEE EEE 0.510 COE Ee<br>-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175<br>TJ, JUNCTION TEMPERATURE (℃)J, JUNCTION TEMPERATURE (℃), JUNCTION TEMPERATURE (℃)℃)) TJ, JUNCTION TEMPERATURE (℃)<br>Figure 7. On-Resistance Variation with Temperature Figure 8. Gate Threshold Variation vs. Junction<br>Temperature<br>30 100000<br>VGS = 0V f = 1MHz<br>25 Ciss<br>10000<br>20 Coss<br>1000<br>15 Ne<br>100 Crss<br>10 N G<br>TJ = 175 [o] C HLL [|] P p<br>TJ = 150 [o] C TJ = 85 [o] C 10<br>5<br>TJ = 125 [o] C TJ = 25 [o] C<br>TJ = -55 [o] C<br>0 — BT) 1 ===.=<br>0 0.3 0.6 0.9 1.2 0 20 40 60 80 100<br>VSD, SOURCE-DRAIN VOLTAGE (V) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current Figure 10. Typical Junction Capacitance<br>10 10000<br>R<br>DS(ON)<br>Limited<br>1000<br>8<br>100<br>6 PW = 1µs<br>PW = 10µs<br>10<br>PW = 100µs<br>4 VDS = 50V, ID = 30ADS = 50V, ID = 30A = 50V, ID = 30AD = 30A = 30A PW = 1ms<br>1 TJ(Max) = 175℃ PW = 10ms<br>TC = 25℃ PW = 100ms<br>2 Single Pulse DC<br>0.1 DUT on Infinite<br>Heatsink<br>0 0.01 VGS = 10V<br>0 20 40 60 80 100 120 140 160 0.1 1 10 100 1000<br>Qg (nC)g (nC) (nC) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge Figure 12. SOA, Safe Operation Area<br>, GATE THRESHOLD VOLTAGE (V)<br>GS(TH)<br>V<br>DS(ON)<br>, SOURCE CURRENT (A)<br>IS<br>, JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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10<br>8<br>6<br>4 VDS = 50V, ID = 30ADS = 50V, ID = 30A = 50V, ID = 30AD = 30A = 30A<br>2<br>0<br>0 20 40 60 80 100 120 140 160<br>Qg (nC)g (nC) (nC)<br>Figure 11. Gate Charge<br> (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


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1 eyao se eggt<br>g D = 0.7 ia aSTE TT<br>TIN A<br>F D = 0.5 IERO<br>a cca<br>D = 0.3<br>D = 0.9<br>S T A PUNE EEE EEE EE<br>0.1 CAe O tAL| Ly f TE LAINELI<br>Fi D = 0.1 Hnor<br>a o/scom 0 NV<br>ferret |<br>D = 0.05<br>Fy lt | TTBATTECHAAA<br>SN ae A<br>Ce ET aaa<br>D = 0.02<br>0.01 AK<br>ere D = 0.01 Ta IME LITA UATE LIME ELITE<br>NSAO NT SE SSTTSES Des oss ssprss<br>ANap Alli! D = 0.005 ETT TTT<br>D = Single Pulse<br>A in cca CCE<br>RθJC (t) = r(t) * RθJC<br>RθJC = 0.6℃/W<br>Duty Cycle, D = t1/t2<br>e ee<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, PULSE DURATION TIME (sec)<br>Figure 13. Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


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**DMTH10H1M7STLW** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**POWERDI1012-8** 

**==> picture [506 x 231] intentionally omitted <==**

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POWERDI1012-8<br>E Dim  Min  Max  Typ<br>E 1 L1 c E 3 E 2 E 4 A  2.20 2.40 2.30<br>b 0.70 0.90 0.80<br>b1  0.42  0.50 0.45<br>c 0.40 0.60 0.50<br>D  11.48 11.88 11.68<br>D2 D1  10.23 10.53 10.38<br>k1 D2  6.45 6.85 6.65<br>D D1 E  9.70 10.10 9.90<br>E1  9.70 9.90 9.80<br>E2  7.00 8.00 7.50<br>k L E3 1.10 1.30 1.20<br>E4  3.00 3.20 3.10<br>e 1.20 BSC<br>k  4.39 REF<br>e | b ' L3 b1 L2 [-—} k1  3.30 REF  J<br>L  0.50 0.70 0.60<br>L1  0.50 0.90 0.70<br>L2  1.40 1.80 1.60<br>A L3 1.00 1.30 1.15<br>θ  0º  15º  10º<br>θ1  0º  10º  5º<br>All Dimensions in mm<br>0<br>0<br>01<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**POWERDI1012-8** 

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Y2<br>rt~<‘“CSsSOSOSOCS X3<br>Y3<br>Y4<br>Y5<br>X2<br>G1<br>C<br>Y1<br>Y<br>ojMT<br>G X<br>pe X1<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value**<br>**(in mm)**|
|---|---|
|**C**|1.200|
|**G**|0.400|
|**G1**|2.500|
|**X**|0.800|
|**X1**|9.200|
|**X2**|9.700|
|**X3**|10.100|
|**Y**|2.800|
|**Y1**|0.800|
|**Y2**|1.400|
|**Y3**|2.900|
|**Y4**|3.700|
|**Y5**|13.300|



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## **IMPORTANT NOTICE** 

1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes products. Diodes products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of the Diodes products for their intended applications, (c) ensuring their applications, which incorporate Diodes products, comply the applicable legal and regulatory requirements as well as safety and functionalsafety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 

3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities. 

4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 

5. Diodes products are provided subject to Diodes’ Standard Terms and Conditions of Sale (https://www.diodes.com/about/company/terms-and-conditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 

6. Diodes products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sale is prohibited under any applicable laws and regulations. Should customers or users use Diodes products in contravention of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any damages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold Diodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 

7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may contain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error-free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes. 

8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof) is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized use. 

Copyright © 2021 Diodes Incorporated 

**www.diodes.com** 

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- [Supplier page](https://es.farnell.com/diodes-inc/dmth10h1m7stlw-13/power-mosfet-100v-250a-powerdi/dp/3828447RL)
---

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