# Power MOSFET, N Channel, 60 V, 57 A, 8300 µohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3943875/)

**URL**: https://novapart.co/products/DMT6009LK3-13/power-mosfet-n-channel-60-v-57-a-8300-ohm-to-252
**SKU**: DMT6009LK3-13
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3870
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 50W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 57A |
| Drain Source On State Resistance | 8300µohm |
| Gate Source Threshold Voltage Max | 1.4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943875/)

**DMT6009LK3 60V N-CHANNEL ENHANCEMENT MODE MOSFET** 

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## **Product Summary** 

|**BVDSS**<br>**RDS(ON) Max**<br>**ID Max**<br>**TC = +25°C**<br>60V<br>10mΩ @ VGS= 10V<br>57A<br>12.8mΩ @ VGS= 4.5V<br>51A|**BVDSS**<br>**RDS(ON) Max**<br>**ID Max**<br>**TC = +25°C**<br>60V<br>10mΩ @ VGS= 10V<br>57A<br>12.8mΩ @ VGS= 4.5V<br>51A|**BVDSS**<br>**RDS(ON) Max**<br>**ID Max**<br>**TC = +25°C**<br>60V<br>10mΩ @ VGS= 10V<br>57A<br>12.8mΩ @ VGS= 4.5V<br>51A|
|---|---|---|
|**BVDSS**|**RDS(ON) Max**|**ID Max**<br>**TC = +25°C**|
|60V|10mΩ @ VGS= 10V|57A|
||12.8mΩ @ VGS= 4.5V|51A|



## **Features** 

- Low RDS(ON) – Ensures On State Losses Are Minimized 

- Excellent Qgd x RDS(ON) Product (FOM) 

- Advanced Technology for DC/DC Converters 

- Small Form Factor Thermally Efficient Package Enables Higher Density End Products 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high- efficiency power management applications. 

## **Mechanical Data** 

   - Case: TO252 

   - Case Material: Molded Plastic, “Green” Molding Compound. 

   - UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity: Level 1 per J-STD-020 

- Power Management Functions 

- DC-DC Converters 

- Backlighting 

- Terminal Finish - Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208 

- Weight: 0.33 grams (Approximate) 

Top View 

Pin Out Top View 

Equivalent Circuit 

## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|DMT6009LK3-13|TO252|2,500/Tape & Reel|



- Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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T6009L<br>YYWW<br>_a<br>**----- End of picture text -----**<br>


(CY =Manufacturer’s Marking T6009L = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 15 = 2015) WW = Week Code (01 to 53) 

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DMT6009LK3 Document number: DS38207  Rev. 3 - 2 

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**DMT6009LK3** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage||VDSS|60|V|
|Gate-Source Voltage||VGSS|±16|V|
|Continuous Drain Current (Note 5) VGS= 10V|TA= +25C<br>TA= +70C|ID|13.3<br>10.6|A|
|Continuous Drain Current (Note 6) VGS= 10V|TC= +25C<br>TC= +70C|ID|57<br>46|A|
|Maximum Continuous BodyDiode Forward Current(Note 6)||IS|80|A|
|Pulsed Drain Current(10s Pulse,DutyCycle = 1%)||IDM|90|A|
|Avalanche Current,L=0.1mH||IAS|20.3|A|
|Avalanche Energy,L=0.1mH||EAS|20.6|mJ|



## **Thermal Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics **(@TA= +25°C, unless otherwise specified.)|= +25°C, unless otherwise specified.)|= +25°C, unless otherwise specified.)|= +25°C, unless otherwise specified.)||||
|---|---|---|---|---|---|---|
|**Characteristic**<br>~~——S~~|**Symbol**<br>~~——S~~|**Min**<br>~~——S~~|**Typ **<br>~~——S~~|**Max**<br>~~——S~~|**Unit**<br>~~——S~~|**Test Condition**<br>~~——S~~|
|**OFF CHARACTERISTICS(Note 7) **<br>~~——S~~|||||||
|Drain-Source Breakdown Voltage<br>~~——S~~|BVDSS<br>~~——S~~|60<br>~~——S~~|-<br>~~——S~~|-<br>~~——S~~|V<br>~~——S~~|VGS= 0V,ID= 1mA<br>~~——S~~|
|Zero Gate Voltage Drain Current<br>~~——S~~|IDSS<br>~~——S~~|-<br>~~——S~~|-<br>~~——S~~|1<br>~~——S~~|μA<br>~~——S~~|VDS= 48V,VGS= 0V<br>~~——S~~|
|Gate-Source Leakage<br>~~——S~~|IGSS<br>~~——S~~|-<br>~~——S~~|-<br>~~——S~~|±100<br>~~——S~~|nA<br>~~——S~~|VGS= ±16V,VDS= 0V<br>~~——S~~|
|**ON CHARACTERISTICS(Note 7) **|||||||
|Gate Threshold Voltage<br>~~—————————~~|VGS(TH)<br>~~—————————~~|0.7<br>~~—————————~~|1.4<br>~~—————————~~|2<br>~~—————————~~|V<br>~~—————————~~|VDS= VGS,ID= 250μA<br>~~—————————~~|
|Static Drain-Source On-Resistance<br>~~—————————~~|RDS(ON)<br>~~—————————~~|-<br>~~—————————~~|8.3<br>~~—————————~~|10<br>~~—————————~~|mΩ<br>~~—————————~~|VGS= 10V,ID= 13.5A<br>~~—————————~~|
|||-<br>~~—————————~~|9.6<br>~~—————————~~|12.8<br>~~—————————~~|mΩ<br>~~—————————~~|VGS= 4.5V,ID= 11.5A<br>~~—————————~~|
|Diode Forward Voltage|VSD|-|0.9|1.2|V|VGS= 0V,IS= 20A|
|**DYNAMIC CHARACTERISTICS(Note 8)**|||||||
|Input Capacitance|Ciss|-|1,925|-|pF|VDS= 30V, VGS= 0V,<br>f = 1MHz|
|Output Capacitance|Coss|-|438|-|||
|Reverse Transfer Capacitance<br>~~ee~~|Crss<br>~~ee~~|-<br>~~ee~~|41<br>~~ee~~|-|||
|Gate Resistance<br>~~ee~~<br>~~———~~|Rg<br>~~ee~~|-<br>~~ee~~|1.7<br>~~ee~~|-<br>~~e~~|Ω<br>~~e~~|VDS= 0V,VGS= 0V,f = 1MHz<br>~~eee~~|
|Total Gate Charge(VGS= 4.5V)<br>~~———~~|Qg|-|15.6|-<br>~~e~~|nC<br>~~e~~<br>~~eee~~|VDS= 30V, ID= 13.5A<br>~~eee~~<br>~~eee~~|
|Total Gate Charge(VGS= 10V)<br>~~———~~|Qg|-|33.5|-<br>~~e~~|||
|Gate-Source Charge<br>~~———~~|Qgs|-|4.7|-<br>~~e~~|||
|Gate-Drain Charge<br>~~———~~<br>~~———~~|Qgd|-|5.3|-<br>~~e~~<br>~~eee~~|||
|Turn-On DelayTime<br>~~———~~<br>~~———~~|tD(ON)|-|4.5|-<br>~~e~~<br>~~eee~~|ns<br>~~e~~<br>~~eee~~<br>~~es~~|VDD= 30V, VGS= 10V,<br>RG= 6Ω, ID= 13.5A<br>~~eee~~<br>~~eee~~|
|Turn-On Rise Time<br>~~———~~<br>~~———~~|tR|-|8.6|-<br>~~e~~<br>~~eee~~|||
|Turn-Off DelayTime<br>~~———~~|tD(OFF)|-|35.9|-<br>~~eee~~|||
|Turn-Off Fall Time<br>~~———~~|tF|-|15.7<br>~~ee~~|-<br>~~eee~~<br>~~es~~|||
|BodyDiode Reverse RecoveryTime<br>~~———~~<br>~~ee~~|tRR<br>~~ee~~|-<br>~~ee~~|18.2<br>~~ee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~<br>~~es~~|ns<br>~~eee~~<br>~~ee~~<br>~~es~~|IF= 13.5A, di/dt = 400A/μs<br>~~eee~~<br>~~ee~~|
|BodyDiode Reverse RecoveryCharge<br>~~———~~<br>~~ee~~|QRR<br>~~ee~~|-<br>~~ee~~|33.1<br>~~ee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~<br>~~es~~|nC<br>~~eee~~<br>~~ee~~<br>~~es~~||



**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

6. Device mounted on infinite heat sink and measured by thermal couple attached on bottom heat sink of package. 

7. Short duration pulse test used to minimize self-heating effect. 

8. Guaranteed by design. Not subject to product testing. 

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**DMT6009LK3** 

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30.0  30<br>VGS=3.0V VDS=5V<br>25.0  VGS=3.5V 25<br>k K ee e |i<br>VGS=4.0V<br>20.0  ft VGS=4.5V ef 20 ee ||<br>VGS=10.0V<br>15.0  15<br>ff a ee<br>10.0  | 10 125 ℃ | ee<br>VGS=2.5V 150 ℃ 85 ℃<br>5.0  | e e 5 Pe 25 ℃<br>-55 ℃<br>0.0  Ae——_—_ 0 >) aw, Se<br>0 0.5 1 1.5 2 2.5 3 1 1.5 2 2.5 3 3.5 4<br>VDS, DRAIN-SOURCE VOLTAGE (V) VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 1. Typical Output Characteristic Figure 2. Typical Transfer Characteristic<br>0.00950.01 ss VGS=4.5V 0.1<br>0.08<br>0.009<br>0.0085 ae<br>0.06<br>0.008<br>ID=13.5A<br>0.0075 pe VGS=10V 0.04<br>0.007<br>0.02<br>0.0065 P re e<br>0.006 Ft tt tT tf 0<br>2 6 10 14 18 22 26 30 0 4 8 12 16 20<br>ID, DRAIN-SOURCE CURRENT (A)  VGS, GATE-SOURCE VOLTAGE (V)<br>Figure 3. Typical On-Resistance vs. Drain Current and  Figure 4. Typical Transfer Characteristic<br>Gate Voltage<br>0.014 1.8<br>0.013 VGS= 10V<br>+ 150 ℃ tity<br>1.6<br>0.012<br>125 ℃<br>0.011 VGS=4.5V, ID=11.5A<br>1.4<br>0.01 = 85 ℃ | oY<br>0.009 1.2<br>Se e Uf<br>0.008 25 ℃<br>0.007 1 VGS=10V, ID=13.5A<br>-55 ℃<br>0.006 ———— a e<br>0.8<br>0.005 a aa<br>0.004 AT E 0.6 SERRE<br>0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150<br>ID, DRAIN CURRENT (A) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 5. Typical On-Resistance vs. Drain Current and  Figure 6. On-Resistance Variation with Junction<br>Junction Temperature Temperature<br>, DRAIN CURRENT (A)<br>ID , DRAIN CURRENT (A)ID<br>, DRAIN-SOURCE ON-RESISTANCE (Ω) , DRAIN-SOURCE ON-RESISTANCE (Ω)<br>DS(ON) DS(ON)<br>R R<br>(NORMALIZED)<br>, DRAIN-SOURCE ON-RESISTANCE (Ω) , DRAIN-SOURCE ON-RESISTANCE<br>DS(ON)<br>R<br>DS(ON)<br>R<br>**----- End of picture text -----**<br>


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**DMT6009LK3** 

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0.02 2<br>0.016<br>1.6<br>VGS=4.5V, ID=11.5A ID=1mA<br>0.012 Ht P e<br>1.2<br>ID=250μA<br>0.008 paee aan<a ae SS<br>VGS=10V, ID=13.5A<br>0.8<br>0.004<br>0 0.4<br>-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150<br>TJ, JUNCTION TEMPERATURE ( ℃ ) TJ, JUNCTION TEMPERATURE ( ℃ )<br>Figure 7. On-Resistance Variation with Junction  Figure 8. Gate Threshold Variation vs. Junction<br>Temperature Temperature<br>10000<br>30<br>f=1MHz<br>25 ee |e SS Ciss<br>VGS=0V, TJ=125 ℃<br>20 eee |e 1000  |f t Coss<br>VGS=0V, TJ=150 ℃<br>15 HP N P—————r<br>VGS=0V, TJ=85 ℃ 100  Crss<br>10 |) ae e t<br>VGS=0V, TJ=25 ℃<br>| +4 a a a<br>5<br>] VGS=0V, TJ=-55 ℃ a ee<br>0 PTL 10  TT<br>0 5 10 15 20 25 30<br>0 0.3 0.6 0.9 1.2 1.5<br>VSD, SOURCE-DRAIN VOLTAGE (V) Figure 10. Typical Junction CapacitanceVDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 9. Diode Forward Voltage vs. Current<br>1000<br>10<br>RDS(ON) Limited<br>PW =100µs<br>100<br>8<br>6 10<br>4 VDS=30V, ID=13.5A 1 PW =1msPW =10ms<br>TJ(Max) = 150 ℃ PW =100ms<br>2 0.1 TA = 25 ℃ PW =1s<br>Single PulseDUT on 1*MRP Board PW<br>DC<br>VGS= 10V Ll ll<br>0 0.01<br>0 7 14 21 28 35 0.01 0.1 1 10 100<br>Qg (nC) VDS, DRAIN-SOURCE VOLTAGE (V)<br>Figure 11. Gate Charge Figure 12. SOA, Safe Operation Area<br>, GATE THRESHOLD VOLTAGE (V)<br>, DRAIN-SOURCE ON-RESISTANCE (Ω)<br>GS(TH)<br>DS(ON) V<br>R<br>, SOURCE CURRENT (A)<br>IS , JUNCTION CAPACITANCE (pF)<br>T<br>C<br> (V)<br>GS<br>V<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


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DMT6009LK3 Document number: DS38207  Rev. 3 - 2 

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**DMT6009LK3** 

## DIOLS 

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1<br>=e<br>D=0.5 MT UN ee NT<br>S D=0.3 R TN D=0.9<br>D=0.7<br>0.1 MICUTCILMAT..4 a ll<br>D=0.1<br>SU A ull IME | ELIMI<br>D=0.05<br>FTdt eeeAIet ecmTTTet eee eT<br>A<br>A D=0.02 AI HTT TTT TTT<br>0.01 eeAAA<br>peeo<br>Se D=0.01<br>mil Ce<br>| LTS D=0.005 a a RθJC(t)=r(t) * RθJC ll<br>D=Single Pulse RθJC=2.5 ℃ /W<br>Duty Cycle, D=t1 /  t2<br>0.001<br>1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10<br>t1, PULSE DURATION TIME (sec)<br>Figure 13. Transient Thermal Resistance<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

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**----- Start of picture text -----**<br>
E<br>A<br>b3<br>7°± 1°<br>c<br>L3<br>TO252 (DPAK)<br>Dim Min  Max  Typ<br>| | \ ee A  2.19  2.39  2.29<br>+ D L4 A2 H e A1 A2  e 0.00 0.97  e 0.13 1.17  ee 0.08 1.07<br>! _ ee<br>b  0.64  0.88 0.783<br>eeee<br>b2  0.76  1.14  0.95<br>— ee<br>b3  5.21  5.46  5.33<br>c  0.45  0.58 0.531<br>| es D  6.00 6.20 6.10<br>e AL b(3x) at eeeees D1  5.21  ee -  -<br>_ b2(2x) ee e  -  -  2.286<br>E  6.45 6.70 6.58<br>0.508 es E1  4.32  -  -<br>4 Gauge Plane ee<br>H  9.40 10.41 9.91<br>n N ee L  1.40  1.78  1.59<br>E1 D1 ( Seating Plane ee L3  0.88  1.27  1.08<br>L L4  0.64  1.02  0.83<br>a e A1 es<br>2.74REF ee a  0°  10°  -<br>— —_— All Dimensions in mm<br>a<br>**----- End of picture text -----**<br>


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DMT6009LK3 Document number: DS38207  Rev. 3 - 2 

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**DMT6009LK3** 

## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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i X1 |<br>Y1<br>Y2<br>C<br>LJ<br>Y<br>nil X<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value(in mm)**|
|---|---|
|**C**|4.572|
|**X**|1.060|
|**X1**|5.632|
|**Y**|2.600|
|**Y1**|5.700|
|**Y2**|10.700|



## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2015, Diodes Incorporated 

**www.diodes.com** 

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---

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